JPH01110490U - - Google Patents
Info
- Publication number
- JPH01110490U JPH01110490U JP578588U JP578588U JPH01110490U JP H01110490 U JPH01110490 U JP H01110490U JP 578588 U JP578588 U JP 578588U JP 578588 U JP578588 U JP 578588U JP H01110490 U JPH01110490 U JP H01110490U
- Authority
- JP
- Japan
- Prior art keywords
- absorption plate
- heat dissipation
- heat absorption
- heat
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010521 absorption reaction Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の実施例を示す説明図、第２図
は本考案の変形例を示す説明図、第３図は従来例
の説明図である。
第１図において、１は基板、２は半導体素子、
３は吸熱プレート、４は放熱フインである。
FIG. 1 is an explanatory diagram showing an embodiment of the present invention, FIG. 2 is an explanatory diagram showing a modification of the present invention, and FIG. 3 is an explanatory diagram of a conventional example. In FIG. 1, 1 is a substrate, 2 is a semiconductor element,
3 is a heat absorption plate, and 4 is a heat radiation fin.
Claims (1)
面に吸熱プレート３を当接固定し、該吸熱プレー
ト３の一端縁部に放熱フイン４を垂設したことを
特徴とする半導体素子の放熱構造。 A heat dissipation structure for a semiconductor device, characterized in that a heat absorption plate 3 is fixed in contact with the upper surface of a plurality of semiconductor devices 2 mounted on a substrate 1, and a heat dissipation fin 4 is vertically provided at one end edge of the heat absorption plate 3. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP578588U JPH01110490U (en) | 1988-01-20 | 1988-01-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP578588U JPH01110490U (en) | 1988-01-20 | 1988-01-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01110490U true JPH01110490U (en) | 1989-07-26 |
Family
ID=31209458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP578588U Pending JPH01110490U (en) | 1988-01-20 | 1988-01-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01110490U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1187964A (en) * | 1997-09-09 | 1999-03-30 | Nippon Telegr & Teleph Corp <Ntt> | Electronic circuit package and mounting body thereof |
-
1988
- 1988-01-20 JP JP578588U patent/JPH01110490U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1187964A (en) * | 1997-09-09 | 1999-03-30 | Nippon Telegr & Teleph Corp <Ntt> | Electronic circuit package and mounting body thereof |
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