JPS6359339U - - Google Patents
Info
- Publication number
- JPS6359339U JPS6359339U JP15336786U JP15336786U JPS6359339U JP S6359339 U JPS6359339 U JP S6359339U JP 15336786 U JP15336786 U JP 15336786U JP 15336786 U JP15336786 U JP 15336786U JP S6359339 U JPS6359339 U JP S6359339U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation block
- semiconductor device
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の実施例の半導体装置の部分断
面とした正面図、第２図は第１図の側面図、第３
図は本考案の他の実施例の半導体装置の側面図、
第４図は従来の半導体装置の部分断面とした正面
図である。
１：冷却フイン、３：半導体素子、５：プリン
ト基板、６：放熱ブロツク、７：絶縁支持材、８
，９：ねじ、１０：皿ねじ、１１：ねじ。
FIG. 1 is a partially sectional front view of a semiconductor device according to an embodiment of the present invention, FIG. 2 is a side view of FIG. 1, and FIG.
The figure is a side view of a semiconductor device according to another embodiment of the present invention.
FIG. 4 is a partially sectional front view of a conventional semiconductor device. 1: Cooling fin, 3: Semiconductor element, 5: Printed circuit board, 6: Heat dissipation block, 7: Insulating support material, 8
, 9: Screw, 10: Flat head screw, 11: Screw.
Claims (1)
を取付け、この放熱ブロツクに絶縁材を介してプ
リント基板を取付けてなる半導体装置において、
前記放熱ブロツクを断面コの字形に形成するとと
もにその開放面の反対側を冷却フインに密着結合
し、かつこの放熱ブロツクの開放面で形成される
溝内に介在させる絶縁支持材でプリント基板を支
持してなることを特徴とする半導体装置。 In a semiconductor device in which a semiconductor element is attached to a cooling fin via a heat dissipation block, and a printed circuit board is attached to the heat dissipation block via an insulating material,
The heat dissipation block is formed into a U-shaped cross section, and the opposite side of the open surface of the heat dissipation block is tightly coupled to a cooling fin, and the printed circuit board is supported by an insulating support material interposed in a groove formed by the open surface of the heat dissipation block. A semiconductor device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15336786U JPS6359339U (en) | 1986-10-06 | 1986-10-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15336786U JPS6359339U (en) | 1986-10-06 | 1986-10-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6359339U true JPS6359339U (en) | 1988-04-20 |
Family
ID=31072182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15336786U Pending JPS6359339U (en) | 1986-10-06 | 1986-10-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6359339U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01174990U (en) * | 1988-05-31 | 1989-12-13 | ||
| JP2016208055A (en) * | 2013-11-26 | 2016-12-08 | 台達電子企業管理（上海）有限公司 | Power supply conversion device |
-
1986
- 1986-10-06 JP JP15336786U patent/JPS6359339U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01174990U (en) * | 1988-05-31 | 1989-12-13 | ||
| JP2016208055A (en) * | 2013-11-26 | 2016-12-08 | 台達電子企業管理（上海）有限公司 | Power supply conversion device |
| JP2017130673A (en) * | 2013-11-26 | 2017-07-27 | 台達電子企業管理（上海）有限公司 | Power supply conversion device |