JPH0320461U - - Google Patents
Info
- Publication number
- JPH0320461U JPH0320461U JP15372888U JP15372888U JPH0320461U JP H0320461 U JPH0320461 U JP H0320461U JP 15372888 U JP15372888 U JP 15372888U JP 15372888 U JP15372888 U JP 15372888U JP H0320461 U JPH0320461 U JP H0320461U
- Authority
- JP
- Japan
- Prior art keywords
- transistor
- printed circuit
- circuit board
- board
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims 2
- 239000011810 insulating material Substances 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は、本考案の一実施例である高周波高出
力トランジスタの実装を示す平面図、第２図は第
１図のＡ−Ｂにおける断面図である。第３図は本
考案の別な実施例の平面図、第４図は第３図のＡ
−Ｂにおける断面図である。第５図及び第６図は
アルミ板の形状に関するより効果的な実施例を示
す断面図である。第７図は従来の高周波高出力ト
ランジスタの実装を示す断面図である。
１……トランジスタ、２……プリント基板、３
……ヒートシンク、４……ハンダ、１１……コレ
クタリード、１２……エミツタ電極、１３……ベ
ースリード、１４……ストリツプライン、１５…
…アルミナセラミツク板、１６……ネジ、１７…
…アルミ板。
FIG. 1 is a plan view showing the implementation of a high-frequency, high-output transistor that is an embodiment of the present invention, and FIG. 2 is a sectional view taken along line AB in FIG. 1. Fig. 3 is a plan view of another embodiment of the present invention, and Fig. 4 is A of Fig. 3.
-B is a cross-sectional view. FIGS. 5 and 6 are cross-sectional views showing more effective embodiments regarding the shape of the aluminum plate. FIG. 7 is a cross-sectional view showing the implementation of a conventional high-frequency, high-output transistor. 1...Transistor, 2...Printed circuit board, 3
... Heat sink, 4 ... Solder, 11 ... Collector lead, 12 ... Emitter electrode, 13 ... Base lead, 14 ... Strip line, 15 ...
...Alumina ceramic plate, 16...Screw, 17...
…an alminium board.
Claims (1)
配線パターンとを電気的に接続させる構造におい
て、トランジスタのリードとプリント基板上の配
線パターンとを重ねて押えつけるための絶縁物で
作られた板と、前述の板をプリント基板と固定し
、トランジスタのリードを十分な圧力で押えつけ
るためのネジを有するトランジスタのリード接続
構造。 (2) 実用新案登録請求の範囲第１項のトランジ
スタのリード接続構造において、トランジスタの
リードとプリント基板上の配線パターンとを重ね
て押えつけるための絶縁物で作られた板と、前述
の板を上から均一に押えるための熱伝導率が良い
物質で作られた板と、これらの板をプリント基板
と固定しトランジスタのリードを十分な圧力で押
えつけるための１本又は複数本のネジを有するト
ランジスタのリード接続構造。[Claims for Utility Model Registration] (1) Insulation for overlapping and pressing the transistor lead and the wiring pattern on the printed circuit board in a structure that electrically connects the transistor lead and the wiring pattern on the printed circuit board. A transistor lead connection structure that includes a board made of a material and screws for fixing the board to a printed circuit board and pressing down the transistor leads with sufficient pressure. (2) In the transistor lead connection structure set forth in claim 1 of the utility model registration, a board made of an insulating material for overlapping and pressing the transistor lead and the wiring pattern on the printed circuit board, and the aforementioned board. A plate made of a material with good thermal conductivity is used to press the transistor leads uniformly from above, and one or more screws are used to fix these plates to the printed circuit board and press the transistor leads with sufficient pressure. Transistor lead connection structure with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15372888U JPH0320461U (en) | 1988-02-08 | 1988-11-25 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1597788 | 1988-02-08 | ||
| JP15372888U JPH0320461U (en) | 1988-02-08 | 1988-11-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0320461U true JPH0320461U (en) | 1991-02-28 |
Family
ID=31717332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15372888U Pending JPH0320461U (en) | 1988-02-08 | 1988-11-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0320461U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000181358A (en) * | 1998-12-18 | 2000-06-30 | Toppan Printing Co Ltd | Seal of premium case for the realization and counting system thereof |
| JP2005287889A (en) * | 2004-04-01 | 2005-10-20 | Fujitsu Ten Ltd | Premium exchange system |
-
1988
- 1988-11-25 JP JP15372888U patent/JPH0320461U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000181358A (en) * | 1998-12-18 | 2000-06-30 | Toppan Printing Co Ltd | Seal of premium case for the realization and counting system thereof |
| JP4517411B2 (en) * | 1998-12-18 | 2010-08-04 | 凸版印刷株式会社 | Cash prize giveaway counting system |
| JP2005287889A (en) * | 2004-04-01 | 2005-10-20 | Fujitsu Ten Ltd | Premium exchange system |