JPH0273790U - - Google Patents

Info

Publication number
JPH0273790U
JPH0273790U JP15392088U JP15392088U JPH0273790U JP H0273790 U JPH0273790 U JP H0273790U JP 15392088 U JP15392088 U JP 15392088U JP 15392088 U JP15392088 U JP 15392088U JP H0273790 U JPH0273790 U JP H0273790U
Authority
JP
Japan
Prior art keywords
circuit board
holding plate
radiator
solder
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15392088U
Other languages
Japanese (ja)
Other versions
JPH064635Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988153920U priority Critical patent/JPH064635Y2/en
Publication of JPH0273790U publication Critical patent/JPH0273790U/ja
Application granted granted Critical
Publication of JPH064635Y2 publication Critical patent/JPH064635Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例の構成を説明する断
面図、第２図は同平面図、第３図は従来の構成を
示す断面図、第４図は従来例において使用される
押え板の側面図である。 １１……回路基板、１３……ランド、１４……
半田盛上げ部、１６……放熱器、１７……押え板
、２０……ネジ。 Fig. 1 is a sectional view illustrating the configuration of an embodiment of the present invention, Fig. 2 is a plan view of the same, Fig. 3 is a sectional view showing the conventional configuration, and Fig. 4 is a presser plate used in the conventional example. FIG. 11... Circuit board, 13... Land, 14...
Solder build-up portion, 16...radiator, 17...pressing plate, 20...screw.

Claims (1)

【実用新案登録請求の範囲】 (1) 回路基板と、 上記回路基板の所定位置に形成した放熱器取付
用穴と、 上記穴より離れて上記回路基板の表面上に形成
した半田盛上げ部と、 上記半田盛上げ部に当接するよう配置した押え
板と、 上記押え板、回路基板及び放熱器を、上記放熱
器取付用穴を貫通するネジによつてネジ止めする
ことを特徴とする放熱器の取付け構造。 (2) 上記押え板の外周囲に接触する位置に、半
田盛上げ部を形成したことを特徴とする実用新案
登録請求の範囲第１項記載の放熱器の取付け構造
。[Scope of Claim for Utility Model Registration] (1) A circuit board, a heatsink mounting hole formed at a predetermined position on the circuit board, a solder heap formed on the surface of the circuit board away from the hole, Mounting of a heat radiator, characterized in that: a holding plate arranged to abut the solder heap; and the holding plate, the circuit board, and the radiator are screwed together with screws passing through the heat radiator mounting holes. structure. (2) The radiator mounting structure according to claim 1, wherein a solder raised portion is formed at a position in contact with the outer periphery of the holding plate.
JP1988153920U 1988-11-26 1988-11-26 Heat sink mounting structure Expired - Lifetime JPH064635Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988153920U JPH064635Y2 (en) 1988-11-26 1988-11-26 Heat sink mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988153920U JPH064635Y2 (en) 1988-11-26 1988-11-26 Heat sink mounting structure

Publications (2)

Publication Number Publication Date
JPH0273790U true JPH0273790U (en) 1990-06-05
JPH064635Y2 JPH064635Y2 (en) 1994-02-02

Family

ID=31430183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988153920U Expired - Lifetime JPH064635Y2 (en) 1988-11-26 1988-11-26 Heat sink mounting structure

Country Status (1)

Country Link
JP (1) JPH064635Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014216595A (en) * 2013-04-30 2014-11-17 株式会社Ｊｖｃケンウッド Heat dissipation structure and assembly method of heat dissipation structure

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5678566U (en) * 1979-11-20 1981-06-25
JPS572666U (en) * 1980-06-05 1982-01-08

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5678566U (en) * 1979-11-20 1981-06-25
JPS572666U (en) * 1980-06-05 1982-01-08

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014216595A (en) * 2013-04-30 2014-11-17 株式会社Ｊｖｃケンウッド Heat dissipation structure and assembly method of heat dissipation structure

Also Published As

Publication number Publication date
JPH064635Y2 (en) 1994-02-02

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