JPS6155393U - - Google Patents
Info
- Publication number
- JPS6155393U JPS6155393U JP14101684U JP14101684U JPS6155393U JP S6155393 U JPS6155393 U JP S6155393U JP 14101684 U JP14101684 U JP 14101684U JP 14101684 U JP14101684 U JP 14101684U JP S6155393 U JPS6155393 U JP S6155393U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- electronic unit
- case
- dissipation structure
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 2
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案の一実施例である電子ユニツ
トの一部破断外観斜視図、第２図は従来構造の電
子ユニツトの一部破断外観斜視図、第３図は従来
構造の他の電子ユニツトの一部破断外観斜視図で
ある。
１：電子ユニツト、２：プリント基板、３：ケ
ース、５：放熱筒、６，７：発熱量の多い電子部
品、８：熱伝導性の良い絶縁性ゴム。
Fig. 1 is a partially cutaway external perspective view of an electronic unit that is an embodiment of this invention, Fig. 2 is a partially cutaway external perspective view of an electronic unit with a conventional structure, and Fig. 3 is a partially cutaway external perspective view of an electronic unit with a conventional structure. FIG. 2 is a partially cutaway external perspective view. 1: electronic unit, 2: printed circuit board, 3: case, 5: heat sink, 6, 7: electronic components that generate a large amount of heat, 8: insulating rubber with good thermal conductivity.
Claims (1)
納した電子ユニツトにおいて、密閉したケースを
上下方向に貫通するパイプ状の放熱筒を設けると
ともにケース内における発熱量の多い電子部品を
前記放熱筒に直接熱伝導的に密着させるかあるい
は熱伝導性の良い絶縁性ゴムを介して熱伝導的に
密着させたことを特徴とする電子ユニツトの放熱
構造。 In an electronic unit in which a printed circuit board with electronic components mounted thereon is housed in a case, a pipe-shaped heat sink is provided that passes vertically through the sealed case, and electronic components that generate a large amount of heat within the case are directly conducted to the heat sink. A heat dissipation structure for an electronic unit, characterized by a heat dissipation structure for an electronic unit, which is characterized by a heat-conducting structure in which the parts are brought into close contact with each other, or in a thermally conductive manner through an insulating rubber having good thermal conductivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14101684U JPS6155393U (en) | 1984-09-18 | 1984-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14101684U JPS6155393U (en) | 1984-09-18 | 1984-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6155393U true JPS6155393U (en) | 1986-04-14 |
Family
ID=30699361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14101684U Pending JPS6155393U (en) | 1984-09-18 | 1984-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6155393U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020202522A (en) * | 2019-06-12 | 2020-12-17 | 日立オートモティブシステムズ株式会社 | Stereo camera |
-
1984
- 1984-09-18 JP JP14101684U patent/JPS6155393U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020202522A (en) * | 2019-06-12 | 2020-12-17 | 日立オートモティブシステムズ株式会社 | Stereo camera |
| WO2020250745A1 (en) * | 2019-06-12 | 2020-12-17 | 日立オートモティブシステムズ株式会社 | Stereo camera |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6155393U (en) | ||
| JPS61158957U (en) | ||
| JPS6398699U (en) | ||
| JPS58175641U (en) | Semiconductor component mounting equipment | |
| JPS646085U (en) | ||
| JPH0211391U (en) | ||
| JPS6280340U (en) | ||
| JPH0334292U (en) | ||
| JPH029444U (en) | ||
| JPS61119396U (en) | ||
| JPS6359339U (en) | ||
| JPH0444194U (en) | ||
| JPS6247199U (en) | ||
| JPS59177955U (en) | Heatsink used for printed wiring boards | |
| JPS61174775U (en) | ||
| JPH0330440U (en) | ||
| JPH0415892U (en) | ||
| JPS6448090U (en) | ||
| JPS61151392U (en) | ||
| JPS6212991U (en) | ||
| JPS6252989U (en) | ||
| JPS61192455U (en) | ||
| JPH0227759U (en) | ||
| JPH0171490U (en) | ||
| JPS59117165U (en) | Electric circuit heat dissipation structure |