JPS6252989U - - Google Patents
Info
- Publication number
- JPS6252989U JPS6252989U JP14414585U JP14414585U JPS6252989U JP S6252989 U JPS6252989 U JP S6252989U JP 14414585 U JP14414585 U JP 14414585U JP 14414585 U JP14414585 U JP 14414585U JP S6252989 U JPS6252989 U JP S6252989U
- Authority
- JP
- Japan
- Prior art keywords
- blocks
- groove
- metal blocks
- lsi
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の実施例を示す全体斜視図、第
２図は本考案の実施例を一部開切して示す斜視図
、第３図は第１図の―線における断面図、第
４図は第１図の―線における断面図、第５図
は本考案の他の実施例を示す図、第６図は従来の
電子パツケージの構造を示す図である。
第１図乃至第５図において、１０，１１はヒー
トシンクとなる金属ブロツク、１２は金属ブロツ
クの組合せ面、１３は溝、１４は結合ボルト、１
５は熱伝導性の良いゴム、１６はフレキシブルプ
リント板、１７はＬＳＩ、１８はチツプ部品、１
９はコネクタ、２０は貫通孔である。
Fig. 1 is an overall perspective view showing an embodiment of the present invention, Fig. 2 is a partially cutaway perspective view showing an embodiment of the invention, Fig. 3 is a cross-sectional view taken along the line - - of Fig. 1; 4 is a sectional view taken along the line -- in FIG. 1, FIG. 5 is a view showing another embodiment of the present invention, and FIG. 6 is a view showing the structure of a conventional electronic package. 1 to 5, 10 and 11 are metal blocks that serve as heat sinks, 12 is a combination surface of the metal blocks, 13 is a groove, 14 is a connecting bolt, 1
5 is a rubber with good thermal conductivity, 16 is a flexible printed board, 17 is an LSI, 18 is a chip component, 1
9 is a connector, and 20 is a through hole.
Claims (1)
１１が、それぞれ一方の面が該面で２つのブロツ
ク１０，１１が組合わせ可能となる様に凹凸を繰
返す面１２で形成され、さらに該面１２に溝１３
が設けられ、該溝１３内にＬＳＩ１７、チツプ部
品１８、コネクタ１９等が実装されたフレキシブ
ルプリント板１６を熱伝導性の良いゴム１５を介
して収容した状態で２個の金属ブロツク１０，１
１を結合して成る電子回路パツケージ。 Two metal blocks 10 that serve as heat sinks,
Each of the blocks 11 is formed of a surface 12 on which one surface repeats unevenness so that the two blocks 10 and 11 can be combined on this surface, and furthermore, a groove 13 is formed on the surface 12.
A flexible printed board 16 on which an LSI 17, a chip component 18, a connector 19, etc. are mounted is accommodated in the groove 13 via a rubber 15 with good thermal conductivity, and the two metal blocks 10, 1
An electronic circuit package formed by combining 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14414585U JPS6252989U (en) | 1985-09-24 | 1985-09-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14414585U JPS6252989U (en) | 1985-09-24 | 1985-09-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6252989U true JPS6252989U (en) | 1987-04-02 |
Family
ID=31054484
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14414585U Pending JPS6252989U (en) | 1985-09-24 | 1985-09-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6252989U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0299978A (en) * | 1988-10-06 | 1990-04-11 | Stanley Electric Co Ltd | Eraser for copying machine |
-
1985
- 1985-09-24 JP JP14414585U patent/JPS6252989U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0299978A (en) * | 1988-10-06 | 1990-04-11 | Stanley Electric Co Ltd | Eraser for copying machine |