JPS6212958U - - Google Patents

Info

Publication number
JPS6212958U
JPS6212958U JP1986102906U JP10290686U JPS6212958U JP S6212958 U JPS6212958 U JP S6212958U JP 1986102906 U JP1986102906 U JP 1986102906U JP 10290686 U JP10290686 U JP 10290686U JP S6212958 U JPS6212958 U JP S6212958U
Authority
JP
Japan
Prior art keywords
heat sink
substrate
package
rubber sheet
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986102906U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986102906U priority Critical patent/JPS6212958U/ja
Publication of JPS6212958U publication Critical patent/JPS6212958U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来のＬＳＩパツケージの断面図、第
２図は本考案の第１の実施例を示す断面図および
第３図は本考案の第２の実施例を示す断面図であ
る。 図において、１……ＬＳＩ、２……パツケージ
基板、３……高密度コネクタ、４……高密度プリ
ント板、５，５′……ヒートシンク、６……ネジ
、７′，７″……熱伝導性ゴムシート、８……パ
ワー・トランジスタ。 FIG. 1 is a cross-sectional view of a conventional LSI package, FIG. 2 is a cross-sectional view showing a first embodiment of the present invention, and FIG. 3 is a cross-sectional view showing a second embodiment of the present invention. In the figure, 1...LSI, 2...Package board, 3...High density connector, 4...High density printed board, 5, 5'...Heat sink, 6...Screw, 7', 7''...Heat Conductive rubber sheet, 8...Power transistor.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 大規模集積回路チツプ等の複数の発熱体が搭載
されたパツケージ基板とヒートシンクとを有する
大規模集積回路パツケージにおいて、前記基板と
前記ヒートシンクとの間に少なくとも片面が球面
を有する熱伝導性ゴムシートを設け、該熱伝導性
ゴムシートを介して前記基板と前記ヒートシンク
とを圧接したことを特徴とする高密度ＬＳＩパツ
ケージ。 In a large-scale integrated circuit package having a package substrate on which a plurality of heat generating elements such as a large-scale integrated circuit chip are mounted, and a heat sink, a thermally conductive rubber sheet having at least one side having a spherical surface is disposed between the substrate and the heat sink. A high-density LSI package, characterized in that the substrate and the heat sink are pressed into contact with each other via the thermally conductive rubber sheet.
JP1986102906U 1986-07-03 1986-07-03 Pending JPS6212958U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986102906U JPS6212958U (en) 1986-07-03 1986-07-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986102906U JPS6212958U (en) 1986-07-03 1986-07-03

Publications (1)

Publication Number Publication Date
JPS6212958U true JPS6212958U (en) 1987-01-26

Family

ID=30974976

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986102906U Pending JPS6212958U (en) 1986-07-03 1986-07-03

Country Status (1)

Country Link
JP (1) JPS6212958U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5234947U (en) * 1975-09-04 1977-03-11

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5234947U (en) * 1975-09-04 1977-03-11

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