JPH0247055U - - Google Patents
Info
- Publication number
- JPH0247055U JPH0247055U JP12641988U JP12641988U JPH0247055U JP H0247055 U JPH0247055 U JP H0247055U JP 12641988 U JP12641988 U JP 12641988U JP 12641988 U JP12641988 U JP 12641988U JP H0247055 U JPH0247055 U JP H0247055U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealed
- semiconductor device
- utility
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
Description
第１図ａ及びｂは本考案の第１の実施例を放熱
器とプリント板に実装した電子装置の平面図及び
側面図、第２図ａ及びｂは本考案の第２の実施例
を放熱器とプリント板に実装した電子装置の平面
図及び側面図、第３図ａ及びｂは従来の樹脂封止
型半導体装置の一例の平面図及び側面図である。
１，１ａ……樹脂部、２……放熱器、３……板
バネ金具、４，４ａ……樹脂部上面、５……溝部
、５ａ……丸溝部、６……凸部、８……プリント
板。
Figures 1a and b are plan and side views of an electronic device in which the first embodiment of the present invention is mounted on a heatsink and a printed board, and Figures 2a and b are heat radiators of the second embodiment of the present invention. FIGS. 3A and 3B are a plan view and a side view of an example of a conventional resin-sealed semiconductor device. DESCRIPTION OF SYMBOLS 1, 1a ...Resin part, 2...Radiator, 3...Flat spring fitting, 4,4a ...Resin part upper surface, 5...Groove part, 5a ...Round groove part, 6...Protrusion part, 8...Printed board.
Claims (1)
導体装置において、前記樹脂部の上面に放熱器固
定具の凸部を挿入する溝部を設けたことを特徴と
する樹脂封止型半導体装置。 1. A resin-sealed semiconductor device in which a semiconductor chip is sealed in a resin portion, characterized in that a groove portion into which a convex portion of a radiator fixture is inserted is provided on the upper surface of the resin portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12641988U JPH0247055U (en) | 1988-09-27 | 1988-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12641988U JPH0247055U (en) | 1988-09-27 | 1988-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0247055U true JPH0247055U (en) | 1990-03-30 |
Family
ID=31377926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12641988U Pending JPH0247055U (en) | 1988-09-27 | 1988-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0247055U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007273860A (en) * | 2006-03-31 | 2007-10-18 | Icom Inc | Clip for fixing semiconductor element |
-
1988
- 1988-09-27 JP JP12641988U patent/JPH0247055U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007273860A (en) * | 2006-03-31 | 2007-10-18 | Icom Inc | Clip for fixing semiconductor element |