JPH0247055U - - Google Patents

Info

Publication number
JPH0247055U
JPH0247055U JP12641988U JP12641988U JPH0247055U JP H0247055 U JPH0247055 U JP H0247055U JP 12641988 U JP12641988 U JP 12641988U JP 12641988 U JP12641988 U JP 12641988U JP H0247055 U JPH0247055 U JP H0247055U
Authority
JP
Japan
Prior art keywords
resin
sealed
semiconductor device
utility
registration request
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12641988U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12641988U priority Critical patent/JPH0247055U/ja
Publication of JPH0247055U publication Critical patent/JPH0247055U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図a及びbは本考案の第1の実施例を放熱
器とプリント板に実装した電子装置の平面図及び
側面図、第2図a及びbは本考案の第2の実施例
を放熱器とプリント板に実装した電子装置の平面
図及び側面図、第3図a及びbは従来の樹脂封止
型半導体装置の一例の平面図及び側面図である。 1,1……樹脂部、2……放熱器、3……板
バネ金具、4,4……樹脂部上面、5……溝部
、5……丸溝部、6……凸部、8……プリント
板。
Figures 1a and b are plan and side views of an electronic device in which the first embodiment of the present invention is mounted on a heatsink and a printed board, and Figures 2a and b are heat radiators of the second embodiment of the present invention. FIGS. 3A and 3B are a plan view and a side view of an example of a conventional resin-sealed semiconductor device. DESCRIPTION OF SYMBOLS 1, 1a ...Resin part, 2...Radiator, 3...Flat spring fitting, 4,4a ...Resin part upper surface, 5...Groove part, 5a ...Round groove part, 6...Protrusion part, 8...Printed board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体チツプを樹脂部で封止する樹脂封止型半
導体装置において、前記樹脂部の上面に放熱器固
定具の凸部を挿入する溝部を設けたことを特徴と
する樹脂封止型半導体装置。
1. A resin-sealed semiconductor device in which a semiconductor chip is sealed in a resin portion, characterized in that a groove portion into which a convex portion of a radiator fixture is inserted is provided on the upper surface of the resin portion.
JP12641988U 1988-09-27 1988-09-27 Pending JPH0247055U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12641988U JPH0247055U (en) 1988-09-27 1988-09-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12641988U JPH0247055U (en) 1988-09-27 1988-09-27

Publications (1)

Publication Number Publication Date
JPH0247055U true JPH0247055U (en) 1990-03-30

Family

ID=31377926

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12641988U Pending JPH0247055U (en) 1988-09-27 1988-09-27

Country Status (1)

Country Link
JP (1) JPH0247055U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007273860A (en) * 2006-03-31 2007-10-18 Icom Inc Clip for fixing semiconductor element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007273860A (en) * 2006-03-31 2007-10-18 Icom Inc Clip for fixing semiconductor element

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