JPH0293290U - - Google Patents
Info
- Publication number
- JPH0293290U JPH0293290U JP24189U JP24189U JPH0293290U JP H0293290 U JPH0293290 U JP H0293290U JP 24189 U JP24189 U JP 24189U JP 24189 U JP24189 U JP 24189U JP H0293290 U JPH0293290 U JP H0293290U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor devices
- facing
- convex parts
- substrates
- recesses
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims 3
Landscapes
- Packaging Frangible Articles (AREA)
Description
第１図は本考案の一実施例のパレツトおよび収
納ＣＯＢ基板を示す斜視図、第２図は第１図のパ
レツトを裏返した状態の斜視図、第３図は本考案
の第２実施例と収納ＣＯＢ基板を示す断面図であ
る。
１ａ，２ａ，３ａ……凸部、１ｂ，２ｂ，３ｂ
……凹部、５，６……ＣＯＢ基板、５ａ，６ａ…
…チツプ搭載部。
Fig. 1 is a perspective view showing a pallet and storage COB board according to an embodiment of the present invention, Fig. 2 is a perspective view of the pallet shown in Fig. 1 turned over, and Fig. 3 is a perspective view showing a second embodiment of the present invention. It is a sectional view showing a storage COB board. 1a, 2a, 3a...Convex portion, 1b, 2b, 3b
...Concavity, 5, 6...COB substrate, 5a, 6a...
...Chip loading section.
Claims (1)
れる多数の収納凹部およびこの凹部の中にさらに
前記基板のチツプ搭載部が収納される凹部が縦横
に並べて１面（Ａ面）側に形成され、このＡ面を
下にして裏返して反対側の面（Ｂ面）を上にした
状態では、前記Ａ面を上にしたときの凹部が変わ
つて凸部となつた隣り合う凸部と凸部との間をＢ
面における半導体装置の基板収納部とされている
ことを特徴とする半導体装置の収納パレツト。 A large number of storage recesses in which the substrates of chip-on-board semiconductor devices are accommodated, and recesses in which the chip mounting portions of the substrates are further accommodated are arranged vertically and horizontally on the first side (side A). When turned over with side A facing down and the opposite side (side B) facing up, the concave parts when side A was facing up changed to become convex parts, and the adjacent convex parts and convex parts Between B
1. A storage pallet for semiconductor devices, characterized in that the pallet serves as a substrate storage portion for semiconductor devices on a surface thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24189U JPH0293290U (en) | 1989-01-04 | 1989-01-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24189U JPH0293290U (en) | 1989-01-04 | 1989-01-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0293290U true JPH0293290U (en) | 1990-07-24 |
Family
ID=31199095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24189U Pending JPH0293290U (en) | 1989-01-04 | 1989-01-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0293290U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1992005581A1 (en) * | 1990-09-13 | 1992-04-02 | Fujitsu Limited | Semiconductor device having heat radiating fin assembly and case for containing the same |
-
1989
- 1989-01-04 JP JP24189U patent/JPH0293290U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1992005581A1 (en) * | 1990-09-13 | 1992-04-02 | Fujitsu Limited | Semiconductor device having heat radiating fin assembly and case for containing the same |