JPS6416644U - - Google Patents

Info

Publication number
JPS6416644U
JPS6416644U JP11209187U JP11209187U JPS6416644U JP S6416644 U JPS6416644 U JP S6416644U JP 11209187 U JP11209187 U JP 11209187U JP 11209187 U JP11209187 U JP 11209187U JP S6416644 U JPS6416644 U JP S6416644U
Authority
JP
Japan
Prior art keywords
semiconductor device
hole
substrates
component
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11209187U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11209187U priority Critical patent/JPS6416644U/ja
Publication of JPS6416644U publication Critical patent/JPS6416644U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図a,bはそれぞれ本考案の一実施例を説
明するための平面図及び斜視図、第2図a,bは
それぞれ本考案の他の実施例を説明するための平
面図、及び斜視図、第3図a〜cは従来例を説明
するための平面図及び斜視図である。 1,2,3,4,5,6……半導体装置、11
,21,31,41,51,61……基板、12
,22……半導体デバイス、13,23……抵抗
、124……端子、125……外装樹脂、30,
40,50,60……貫通穴、666……へこみ
、126,127……端子、32,33,42,
43,52,53,62,63……裸のペレツト
である。
1A and 1B are a plan view and a perspective view, respectively, for explaining one embodiment of the present invention, and FIGS. 2A and 2B are a plan view and a perspective view, respectively, for explaining another embodiment of the present invention. 3A to 3C are a plan view and a perspective view for explaining a conventional example. 1, 2, 3, 4, 5, 6... semiconductor device, 11
, 21, 31, 41, 51, 61...Substrate, 12
, 22... Semiconductor device, 13, 23... Resistor, 124... Terminal, 125... Exterior resin, 30,
40,50,60...through hole, 666...dent, 126,127...terminal, 32,33,42,
43, 52, 53, 62, 63... These are naked pellets.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 片側に半導体素子等の部品をそれぞれ搭載した
2個の基板の裏面同士をはりあわせ樹脂により前
記部品及び前記基板を覆つた半導体装置において
、前記2個の基板が貫通穴を有し、該貫通穴上の
前記樹脂には凹部が形成されていることを特徴と
する半導体装置。
In a semiconductor device in which the back sides of two substrates each having a component such as a semiconductor element mounted on one side are bonded together and the component and the substrate are covered with resin, the two substrates have a through hole, and the through hole A semiconductor device characterized in that a recess is formed in the upper resin.
JP11209187U 1987-07-21 1987-07-21 Pending JPS6416644U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11209187U JPS6416644U (en) 1987-07-21 1987-07-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11209187U JPS6416644U (en) 1987-07-21 1987-07-21

Publications (1)

Publication Number Publication Date
JPS6416644U true JPS6416644U (en) 1989-01-27

Family

ID=31350724

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11209187U Pending JPS6416644U (en) 1987-07-21 1987-07-21

Country Status (1)

Country Link
JP (1) JPS6416644U (en)

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