JPH0377443U - - Google Patents
Info
- Publication number
- JPH0377443U JPH0377443U JP13675989U JP13675989U JPH0377443U JP H0377443 U JPH0377443 U JP H0377443U JP 13675989 U JP13675989 U JP 13675989U JP 13675989 U JP13675989 U JP 13675989U JP H0377443 U JPH0377443 U JP H0377443U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- longitudinal direction
- metal lead
- pin grooves
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000123 paper Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 230000002265 prevention Effects 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims 1
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 230000003014 reinforcing effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011087 paperboard Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図〜第３図は本考案の第１実施例で、第１
図はペーパー基板の平面図、第２図はペーパー基
板の斜視図、第３図は使用状態を示す一部簡略し
た斜視図、第４図及び第５図は本考案の第２実施
例及び第３実施例で、各ａがペーパー基板の平面
図、各ｂが使用状態を示す一部簡略した斜視図、
第６図は半導体装置の１例を示す１部簡略した平
面図、第７図は従来のメタルリードフレームの１
例を示す平面図である。
１，１ａ，１ｂ……基板本体、１′……一外側
面、１″……他外側面、２，２′，２ａ，２ｂ…
…保持孔、３……位置選定ピン溝、４……ピン支
持孔、５……補強片、６……防止片、７，７ａ，
７ｂ……ペーパー基板。
Figures 1 to 3 show the first embodiment of the present invention.
The figure is a plan view of the paper substrate, FIG. 2 is a perspective view of the paper substrate, FIG. 3 is a partially simplified perspective view showing the state of use, and FIGS. In Embodiment 3, each a is a plan view of the paper substrate, each b is a partially simplified perspective view showing the state of use,
Fig. 6 is a partially simplified plan view showing an example of a semiconductor device, and Fig. 7 is a diagram of a conventional metal lead frame.
FIG. 3 is a plan view showing an example. 1, 1a, 1b...board body, 1'...one outer surface, 1''...other outer surface, 2, 2', 2a, 2b...
...Holding hole, 3...Position selection pin groove, 4...Pin support hole, 5...Reinforcement piece, 6...Prevention piece, 7, 7a,
7b...Paper board.
Claims (1)
湿、加熱、圧搾処理された所定肉圧の厚紙からな
る基板本体に、該メタルリードフレームの回路チ
ツプを装着する固定部に合致するよう複数個穿設
された保持孔と、長手方向の一外側面両端に突設
された防止片と、長手方向の他外側面の中央附近
及び両端附近に複数個切欠されたコの字状の位置
選定ピン溝と、各該位置選定ピン溝の中間よりも
外側寄りに複数個突設された、ピン支持孔を有す
る補強片とを備えたことを特徴とする半導体装置
形成金型掃除用ペーパー基板。 A board body having the same area as a known metal lead frame and made of cardboard with a predetermined wall thickness that has been subjected to humidification, heating, and compression treatment is provided with a plurality of holes so as to match the fixing portions of the metal lead frame to which the circuit chips are attached. a holding hole, a prevention piece protruding from both ends of one outer surface in the longitudinal direction, and a plurality of U-shaped positioning pin grooves cut out near the center and near both ends of the other outer surface in the longitudinal direction; A paper substrate for cleaning a semiconductor device forming mold, comprising: a plurality of reinforcing pieces having pin support holes protruding outward from the middle of each of the position selection pin grooves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13675989U JPH0526742Y2 (en) | 1989-11-24 | 1989-11-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13675989U JPH0526742Y2 (en) | 1989-11-24 | 1989-11-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0377443U true JPH0377443U (en) | 1991-08-05 |
| JPH0526742Y2 JPH0526742Y2 (en) | 1993-07-07 |
Family
ID=31683952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13675989U Expired - Lifetime JPH0526742Y2 (en) | 1989-11-24 | 1989-11-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0526742Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011096854A (en) * | 2009-10-29 | 2011-05-12 | Mitsui High Tec Inc | Dummy lead frame |
| KR101368321B1 (en) * | 2013-03-20 | 2014-02-27 | (주) 제이디피이에스 | Safety mat for industry |
-
1989
- 1989-11-24 JP JP13675989U patent/JPH0526742Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011096854A (en) * | 2009-10-29 | 2011-05-12 | Mitsui High Tec Inc | Dummy lead frame |
| KR101368321B1 (en) * | 2013-03-20 | 2014-02-27 | (주) 제이디피이에스 | Safety mat for industry |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0526742Y2 (en) | 1993-07-07 |