JPH03122541U - - Google Patents

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Publication number
JPH03122541U
JPH03122541U JP3122490U JP3122490U JPH03122541U JP H03122541 U JPH03122541 U JP H03122541U JP 3122490 U JP3122490 U JP 3122490U JP 3122490 U JP3122490 U JP 3122490U JP H03122541 U JPH03122541 U JP H03122541U
Authority
JP
Japan
Prior art keywords
package
convex portions
connection
view
chip carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3122490U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3122490U priority Critical patent/JPH03122541U/ja
Publication of JPH03122541U publication Critical patent/JPH03122541U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図a,b,cはそれぞれ本考案の第1の実
施例を示す平面図、断面図、裏面図、第2図a,
b,cはそれぞれ本考案の第2の実施例を示す平
面図、断面図、裏面図、第3図a,bはそれぞれ
従来のチツプキヤリア用パツケージの平面図と断
面図である。 1…セラミツクパツケージ、2…ボンデイング
パツド、3…マウントランド、4…配線パターン
、5…凸部、6…スルーホール、7…外部との接
続パツド。
Figures 1a, b, and c are a plan view, a sectional view, and a back view, respectively, showing the first embodiment of the present invention, and Figures 2a,
FIGS. 3b and 3c are a plan view, a sectional view, and a rear view, respectively, showing a second embodiment of the present invention, and FIGS. 3a and 3b are a plan view and a sectional view, respectively, of a conventional package for a chip carrier. 1...Ceramic package, 2...Bonding pad, 3...Mount land, 4...Wiring pattern, 5...Protrusion, 6...Through hole, 7...External connection pad.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] アルミナセラミツクで形成されるチツプキヤリ
ア用パツケージにおいて、前記パツケージの裏面
に縦横一定間隔で凸部を設け、この凸部に外部と
の接続パツドを設けることを特徴とするチツプキ
ヤリア用パツケージ。
1. A package for a chip carrier made of alumina ceramic, characterized in that convex portions are provided at regular intervals in the vertical and horizontal directions on the back surface of the package, and connection pads for connection with the outside are provided on the convex portions.
JP3122490U 1990-03-27 1990-03-27 Pending JPH03122541U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3122490U JPH03122541U (en) 1990-03-27 1990-03-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3122490U JPH03122541U (en) 1990-03-27 1990-03-27

Publications (1)

Publication Number Publication Date
JPH03122541U true JPH03122541U (en) 1991-12-13

Family

ID=31533968

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3122490U Pending JPH03122541U (en) 1990-03-27 1990-03-27

Country Status (1)

Country Link
JP (1) JPH03122541U (en)

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