JPH0397952U - - Google Patents

Info

Publication number
JPH0397952U
JPH0397952U JP606290U JP606290U JPH0397952U JP H0397952 U JPH0397952 U JP H0397952U JP 606290 U JP606290 U JP 606290U JP 606290 U JP606290 U JP 606290U JP H0397952 U JPH0397952 U JP H0397952U
Authority
JP
Japan
Prior art keywords
heat sink
chips
semiconductor laser
separated
mounting surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP606290U
Other languages
Japanese (ja)
Other versions
JP2540298Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990006062U priority Critical patent/JP2540298Y2/en
Publication of JPH0397952U publication Critical patent/JPH0397952U/ja
Application granted granted Critical
Publication of JP2540298Y2 publication Critical patent/JP2540298Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａ及びｂは夫々本考案装置の一実施例を
示す平面図及び正面図、第２図は本考案の他の実
施例を示す正面図である。 1A and 1B are a plan view and a front view, respectively, showing one embodiment of the device of the present invention, and FIG. 2 is a front view showing another embodiment of the present invention.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 複数個の半導体レーザチツプがヒートシンク上
に載置された半導体レーザ装置において、上記ヒ
ートシンクの上記チツプ載置面は、上記各チツプ
間に設けられた溝によつて分離されていることを
特徴とする半導体レーザ装置。 A semiconductor laser device in which a plurality of semiconductor laser chips are mounted on a heat sink, wherein the chip mounting surface of the heat sink is separated by a groove provided between each of the chips. laser equipment.
JP1990006062U 1990-01-25 1990-01-25 Multi-beam semiconductor laser device Expired - Lifetime JP2540298Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990006062U JP2540298Y2 (en) 1990-01-25 1990-01-25 Multi-beam semiconductor laser device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990006062U JP2540298Y2 (en) 1990-01-25 1990-01-25 Multi-beam semiconductor laser device

Publications (2)

Publication Number Publication Date
JPH0397952U true JPH0397952U (en) 1991-10-09
JP2540298Y2 JP2540298Y2 (en) 1997-07-02

Family

ID=31509745

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990006062U Expired - Lifetime JP2540298Y2 (en) 1990-01-25 1990-01-25 Multi-beam semiconductor laser device

Country Status (1)

Country Link
JP (1) JP2540298Y2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002305345A (en) * 2001-04-04 2002-10-18 Cimeo Precision Co Ltd Submount for laser diode and manufacturing method therefor
JP2003218471A (en) * 1993-11-22 2003-07-31 Xerox Corp Method of generating laser diode
JP2006253391A (en) * 2005-03-10 2006-09-21 Sharp Corp Semiconductor laser apparatus
JP2010122182A (en) * 2008-11-21 2010-06-03 Daitron Technology Co Ltd Inspection jig and inspection device
JP2015011214A (en) * 2013-06-28 2015-01-19 Fdk株式会社 Metallic casing for optical device, and optical device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0334385A (en) * 1989-06-29 1991-02-14 Nec Corp Manufacture of semiconductor laser element

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0334385A (en) * 1989-06-29 1991-02-14 Nec Corp Manufacture of semiconductor laser element

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003218471A (en) * 1993-11-22 2003-07-31 Xerox Corp Method of generating laser diode
JP2004274085A (en) * 1993-11-22 2004-09-30 Xerox Corp Laser diode array
JP2002305345A (en) * 2001-04-04 2002-10-18 Cimeo Precision Co Ltd Submount for laser diode and manufacturing method therefor
JP2006253391A (en) * 2005-03-10 2006-09-21 Sharp Corp Semiconductor laser apparatus
JP2010122182A (en) * 2008-11-21 2010-06-03 Daitron Technology Co Ltd Inspection jig and inspection device
JP2015011214A (en) * 2013-06-28 2015-01-19 Fdk株式会社 Metallic casing for optical device, and optical device

Also Published As

Publication number Publication date
JP2540298Y2 (en) 1997-07-02

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term