JPH03109352U - - Google Patents
Info
- Publication number
- JPH03109352U JPH03109352U JP1633890U JP1633890U JPH03109352U JP H03109352 U JPH03109352 U JP H03109352U JP 1633890 U JP1633890 U JP 1633890U JP 1633890 U JP1633890 U JP 1633890U JP H03109352 U JPH03109352 U JP H03109352U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- substrate
- lower surfaces
- package
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
第１図は本考案の半導体装置の実施例を示す平
面図、第２図は第１図の−線に沿つた断面図
、第３図は本実施例半導体装置の分解図である。
１…放熱板、２…ＩＣ、３…基板、５…パツケ
ージ。
FIG. 1 is a plan view showing an embodiment of the semiconductor device of the present invention, FIG. 2 is a sectional view taken along the - line in FIG. 1, and FIG. 3 is an exploded view of the semiconductor device of the present embodiment. 1... Heat sink, 2... IC, 3... Board, 5... Package.
Claims (1)
体装置において、上面及び下面にＩＣ接続手段を
有すると共に上記パツケージから突出する複数の
リードを備えた基板と、上記基板の上面及び下面
に各々配置された第１及び第２のＩＣとを含むこ
とを特徴とする半導体装置。 A semiconductor device in which a plurality of ICs are enclosed in a single package, including a substrate having IC connection means on the upper and lower surfaces thereof and a plurality of leads protruding from the package, and a plurality of leads arranged on the upper and lower surfaces of the substrate, respectively. A semiconductor device comprising a first IC and a second IC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1633890U JPH03109352U (en) | 1990-02-21 | 1990-02-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1633890U JPH03109352U (en) | 1990-02-21 | 1990-02-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03109352U true JPH03109352U (en) | 1991-11-11 |
Family
ID=31519607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1633890U Pending JPH03109352U (en) | 1990-02-21 | 1990-02-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03109352U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017011192A (en) * | 2015-06-25 | 2017-01-12 | アサヒ・エンジニアリング株式会社 | Resin sealing device and resin sealing method of electronic element |
-
1990
- 1990-02-21 JP JP1633890U patent/JPH03109352U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017011192A (en) * | 2015-06-25 | 2017-01-12 | アサヒ・エンジニアリング株式会社 | Resin sealing device and resin sealing method of electronic element |