JPS6322749U - - Google Patents

Info

Publication number
JPS6322749U
JPS6322749U JP11721886U JP11721886U JPS6322749U JP S6322749 U JPS6322749 U JP S6322749U JP 11721886 U JP11721886 U JP 11721886U JP 11721886 U JP11721886 U JP 11721886U JP S6322749 U JPS6322749 U JP S6322749U
Authority
JP
Japan
Prior art keywords
semiconductor device
heat sink
attached
transistor chip
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11721886U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11721886U priority Critical patent/JPS6322749U/ja
Publication of JPS6322749U publication Critical patent/JPS6322749U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案の一実施例を示す半導体装置
の分解斜視図、第2図は第1図の正面図、第3図
は従来の半導体装置の分解斜視図、第4図は熱流
メカニズムの説明図である。 図において、1はトランジスタチツプ、3は基
板、20はヒートシンク、20aは斜面である。
なお、各図中の同一符号は同一または相当部分を
示す。
Fig. 1 is an exploded perspective view of a semiconductor device showing an embodiment of this invention, Fig. 2 is a front view of Fig. 1, Fig. 3 is an exploded perspective view of a conventional semiconductor device, and Fig. 4 shows the heat flow mechanism. It is an explanatory diagram. In the figure, 1 is a transistor chip, 3 is a substrate, 20 is a heat sink, and 20a is a slope.
Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] トランジスタチツプが取り付けられたヒートシ
ンクを基板上に載置固定した半導体装置において
、前記ヒートシンクの形状を前記トランジスタチ
ツプが取り付けられる頂部から四方向にほぼ45
度それぞれ傾斜せしめた四角錐状の台形としたこ
とを特徴とする半導体装置。
In a semiconductor device in which a heat sink to which a transistor chip is attached is mounted and fixed on a substrate, the shape of the heat sink is approximately 45 mm in four directions from the top where the transistor chip is attached.
A semiconductor device characterized in that it has a trapezoidal shape of a quadrangular pyramid that is tilted at each degree.
JP11721886U 1986-07-29 1986-07-29 Pending JPS6322749U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11721886U JPS6322749U (en) 1986-07-29 1986-07-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11721886U JPS6322749U (en) 1986-07-29 1986-07-29

Publications (1)

Publication Number Publication Date
JPS6322749U true JPS6322749U (en) 1988-02-15

Family

ID=31002528

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11721886U Pending JPS6322749U (en) 1986-07-29 1986-07-29

Country Status (1)

Country Link
JP (1) JPS6322749U (en)

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