JPH02146450U - - Google Patents
Info
- Publication number
- JPH02146450U JPH02146450U JP1989055274U JP5527489U JPH02146450U JP H02146450 U JPH02146450 U JP H02146450U JP 1989055274 U JP1989055274 U JP 1989055274U JP 5527489 U JP5527489 U JP 5527489U JP H02146450 U JPH02146450 U JP H02146450U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- bonded
- central region
- heat spreader
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Description
第１図は本考案の実施例のヒートスプレツダの
断面図、第２図はその平面図、第３図は第１図の
実施例の熱流を示す断面図、第４図は本考案の他
の実施例のヒートスプレツダの断面図、第５図は
その平面図、第６図は第４図の実施例の熱流を示
す断面図、第７図は従来のヒートスプレツダの断
面図、第８図はその平面図、第９図は第７図の従
来例の熱流を示す断面図である。
１０……ヒートスプレツダ、１１……半導体素
子、１４……金属放熱板（金属台座）、１５……
中心領域、１６……周辺領域。
Fig. 1 is a sectional view of a heat spreader according to an embodiment of the present invention, Fig. 2 is a plan view thereof, Fig. 3 is a sectional view showing heat flow in the embodiment of Fig. 1, and Fig. 4 is a sectional view of a heat spreader according to an embodiment of the present invention. 5 is a plan view thereof, FIG. 6 is a sectional view showing heat flow in the embodiment of FIG. 4, FIG. 7 is a sectional view of a conventional heat spreader, and FIG. FIG. 8 is a plan view thereof, and FIG. 9 is a sectional view showing the heat flow of the conventional example shown in FIG. 10...Heat spreader, 11...Semiconductor element, 14...Metal heat sink (metal pedestal), 15...
central area, 16...peripheral area.
Claims (1)
属台座または金属放熱板に接着するよう配置され
、半導体素子から発生する熱を放散させるヒート
スプレツダにおいて、半導体素子の直下となる中
心領域を、熱伝導率の高い材料によつて形成し、
該中心領域を取り囲む周辺領域を、熱膨張係数が
半導体素子に近い材料によつて形成したことを特
徴とする半導体素子のヒートスプレツダ。 In a heat spreader that is arranged so that one surface is bonded to a semiconductor device and the other surface is bonded to a metal pedestal or a metal heat sink, and which dissipates heat generated from the semiconductor device, the central region immediately below the semiconductor device is , made of a material with high thermal conductivity,
A heat spreader for a semiconductor device, characterized in that a peripheral region surrounding the central region is formed of a material having a coefficient of thermal expansion close to that of the semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989055274U JPH02146450U (en) | 1989-05-16 | 1989-05-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989055274U JPH02146450U (en) | 1989-05-16 | 1989-05-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146450U true JPH02146450U (en) | 1990-12-12 |
Family
ID=31578077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989055274U Pending JPH02146450U (en) | 1989-05-16 | 1989-05-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146450U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018510499A (en) * | 2015-02-05 | 2018-04-12 | トゥー‐シックス・インコーポレイテッド | Composite substrate having alternating pattern of diamond and metal or metal alloy |
-
1989
- 1989-05-16 JP JP1989055274U patent/JPH02146450U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018510499A (en) * | 2015-02-05 | 2018-04-12 | トゥー‐シックス・インコーポレイテッド | Composite substrate having alternating pattern of diamond and metal or metal alloy |