JPH0330439U - - Google Patents
Info
- Publication number
- JPH0330439U JPH0330439U JP9046289U JP9046289U JPH0330439U JP H0330439 U JPH0330439 U JP H0330439U JP 9046289 U JP9046289 U JP 9046289U JP 9046289 U JP9046289 U JP 9046289U JP H0330439 U JPH0330439 U JP H0330439U
- Authority
- JP
- Japan
- Prior art keywords
- cooling fin
- package
- base
- semiconductor device
- air passage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 13
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 1
Description
第１図は本考案の実施例を示すパツケージ冷却
フインの実装断面図、第２図はそのパツケージ冷
却フインの斜視図、第３図は従来のパツケージ冷
却フインの実装断面図、第４図はそのパツケージ
冷却フインの斜視図である。
１０……基板、１１……半導体装置（パツケー
ジ）、１２……基部、１２ａ……中央部、１３…
…支柱、１４……中央冷却エアー通路、１５ａ…
…基部冷却フイン、１５ｂ……側部冷却フイン、
１５ｃ……上部冷却フイン、１６……流通経路、
１７……冷却エアー流。
Fig. 1 is a sectional view of a package cooling fin according to an embodiment of the present invention; Fig. 2 is a perspective view of the package cooling fin; Fig. 3 is a sectional view of a conventional package cooling fin; FIG. 3 is a perspective view of a package cooling fin. DESCRIPTION OF SYMBOLS 10...Substrate, 11...Semiconductor device (package), 12...Base, 12a...Central part, 13...
...Strut, 14...Central cooling air passage, 15a...
...Base cooling fin, 15b...Side cooling fin,
15c... Upper cooling fin, 16... Distribution route,
17...Cooling air flow.
Claims (1)
素子から発生する熱を放散させる冷却フインにお
いて、 (a) 基部と (b) 該基部の周辺部から上方に延びる複数の支
柱と、 (c) 該複数の支柱間に連設され、中央冷却エア
ー通路に向かつて上り傾斜面を有する側部冷却フ
インを具備することを特徴とするパツケージ冷却
フイン。[Claims for Utility Model Registration] A cooling fin that is attached to a package of a semiconductor device and dissipates heat generated from the semiconductor device, which comprises: (a) a base; (b) a plurality of columns extending upward from the periphery of the base; (c) A package cooling fin comprising a side cooling fin that is connected between the plurality of support columns and has an upwardly sloped surface toward the central cooling air passage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9046289U JPH0330439U (en) | 1989-08-02 | 1989-08-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9046289U JPH0330439U (en) | 1989-08-02 | 1989-08-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0330439U true JPH0330439U (en) | 1991-03-26 |
Family
ID=31639980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9046289U Pending JPH0330439U (en) | 1989-08-02 | 1989-08-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0330439U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06136757A (en) * | 1992-10-23 | 1994-05-17 | Taiyo Kogyo Kk | Sand spreading method over bottom of water |
-
1989
- 1989-08-02 JP JP9046289U patent/JPH0330439U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06136757A (en) * | 1992-10-23 | 1994-05-17 | Taiyo Kogyo Kk | Sand spreading method over bottom of water |