JPH0289844U - - Google Patents
Info
- Publication number
- JPH0289844U JPH0289844U JP17053688U JP17053688U JPH0289844U JP H0289844 U JPH0289844 U JP H0289844U JP 17053688 U JP17053688 U JP 17053688U JP 17053688 U JP17053688 U JP 17053688U JP H0289844 U JPH0289844 U JP H0289844U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- heat dissipation
- package
- dissipation fin
- lead terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は本考案の一実施例を示す要部側断面図
、第２図ａとｂは本考案の一応用例を示す要部側
断面図と構成部材の細部構造を示す平面図、第３
図ａとｂは従来の半導体装置の構成を示す要部側
断面図である。
図において、３と１３は熱緩衝部材、３ａはネ
ジ部、７はリード端子、９は実装用半田、１０は
放熱フイン、１０ａはネジ孔、１０ｂは嵌着用突
起、１１は樹脂系接着材（接着材）、１３ａは嵌
着部、１３ｂは爪部、１３ｃはスリワリ部、１５
はパツケージ、１９はパツド、２０はプリント板
、をそれぞれ示す。
Figure 1 is a side sectional view of the main part showing an embodiment of the present invention, Figures 2a and b are side sectional views of the main part and a plan view showing the detailed structure of the constituent members, and
Figures a and b are side sectional views of main parts showing the structure of a conventional semiconductor device. In the figure, 3 and 13 are thermal buffer members, 3a is a screw part, 7 is a lead terminal, 9 is a mounting solder, 10 is a heat dissipation fin, 10a is a screw hole, 10b is a fitting protrusion, 11 is a resin adhesive ( adhesive material), 13a is a fitting part, 13b is a claw part, 13c is a slit part, 15
19 indicates a package, 19 indicates a pad, and 20 indicates a printed board.
Claims (1)
し、下面にリード端子７を有してなる半導体装置
であつて、 前記放熱フイン１０を着脱可能に支持し、かつ
熱膨脹率がパツケージ１５のそれとほぼ等しい材
料で構成された熱緩衝部材３を当該パツケージ１
５の上面に装備してなることを特徴とする半導体
装置。[Claims for Utility Model Registration] A semiconductor device comprising a heat dissipation fin 10 on the upper surface of a package cage 15 and a lead terminal 7 on the lower surface, which supports the heat dissipation fin 10 in a removable manner and has a coefficient of thermal expansion. The thermal buffer member 3 is made of a material that is approximately the same as that of the package 15.
5. A semiconductor device characterized in that it is equipped on the upper surface of a semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17053688U JPH0289844U (en) | 1988-12-27 | 1988-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17053688U JPH0289844U (en) | 1988-12-27 | 1988-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0289844U true JPH0289844U (en) | 1990-07-17 |
Family
ID=31461571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17053688U Pending JPH0289844U (en) | 1988-12-27 | 1988-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0289844U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4737885B2 (en) * | 2001-08-08 | 2011-08-03 | イビデン株式会社 | Module board |
-
1988
- 1988-12-27 JP JP17053688U patent/JPH0289844U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4737885B2 (en) * | 2001-08-08 | 2011-08-03 | イビデン株式会社 | Module board |
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