JPH0217851U - - Google Patents
Info
- Publication number
- JPH0217851U JPH0217851U JP9459288U JP9459288U JPH0217851U JP H0217851 U JPH0217851 U JP H0217851U JP 9459288 U JP9459288 U JP 9459288U JP 9459288 U JP9459288 U JP 9459288U JP H0217851 U JPH0217851 U JP H0217851U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- island
- chip
- tab
- package structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000000463 material Substances 0.000 claims 1
Description
第１図は本考案の一実施例を示す高放熱ＩＣパ
ツケージ構造を示す側面図、第２図は本実施例の
高放熱ＩＣパツケージ構造に用いられたリードフ
レームの平面図、第３図は従来の高放熱ＩＣパツ
ケージ構造を示す説明図、第４図は従来の高放熱
ＩＣパツケージの全体斜視図、第５図は従来の高
放熱ＩＣパツケージの最終形態の側面図、第６図
は放熱フインを設けた状態の高放熱ＩＣパツージ
を示す側面図である。
６…ＩＣチツプ、１０…放熱用フイン、１１…
リードフレーム、１２…アイランド部、１３…リ
ード端子、１５…アイランドサポート部、１６…
放熱用タブ、１７…樹脂部、１８…高放熱ＩＣパ
ツケージ。
Fig. 1 is a side view showing a high heat dissipation IC package structure showing an embodiment of the present invention, Fig. 2 is a plan view of a lead frame used in the high heat dissipation IC package structure of this embodiment, and Fig. 3 is a conventional one. Fig. 4 is an overall perspective view of a conventional high heat dissipation IC package, Fig. 5 is a side view of the final form of the conventional high heat dissipation IC package, and Fig. 6 shows the heat dissipation fins. FIG. 2 is a side view showing the high heat dissipation IC part in the installed state. 6...IC chip, 10...heat dissipation fin, 11...
Lead frame, 12... Island part, 13... Lead terminal, 15... Island support part, 16...
Heat dissipation tab, 17...resin part, 18...high heat dissipation IC package.
Claims (1)
のリード端子と、四方からアイランドサポート部
により支持されたアイランド部を有するリードフ
レームの、前記アイランド部上にＩＣチツプを載
置し、 前記リード端子の外端が突出するようにリード
フレームとＩＣチツプとを樹脂部により覆い、こ
のＩＣチツプにて発生した熱を空気中に放熱する
放熱用フインを樹脂部の上面側に設けた高放熱Ｉ
Ｃパツケージ構造において、 前記アイランドサポート部の先端にアイランド
サポート部よりも幅の広い放熱用タブを形成し、
この放熱用タブが前記樹脂部の上面側に重なるよ
うにアイランドサポート部を折曲して、前記放熱
用タブ上に放熱用フインを接着することを特徴と
する高放熱ＩＣパツケージ構造。[Claims for Utility Model Registration] A lead frame is made of a material with good thermal conductivity, has a plurality of aligned lead terminals, and has an island part supported from all sides by island support parts, and an IC chip is mounted on the island part. The lead frame and the IC chip are covered with a resin part so that the outer ends of the lead terminals protrude, and a heat dissipation fin for dissipating the heat generated by the IC chip into the air is placed on the upper surface of the resin part. High heat dissipation I installed on the side
In the C package structure, a heat dissipation tab wider than the island support part is formed at the tip of the island support part,
A high heat dissipation IC package structure characterized in that the island support part is bent so that the heat dissipation tab overlaps the upper surface side of the resin part, and a heat dissipation fin is bonded onto the heat dissipation tab.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9459288U JPH0217851U (en) | 1988-07-19 | 1988-07-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9459288U JPH0217851U (en) | 1988-07-19 | 1988-07-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0217851U true JPH0217851U (en) | 1990-02-06 |
Family
ID=31319144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9459288U Pending JPH0217851U (en) | 1988-07-19 | 1988-07-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0217851U (en) |
-
1988
- 1988-07-19 JP JP9459288U patent/JPH0217851U/ja active Pending
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