JPS62131447U - - Google Patents

Info

Publication number
JPS62131447U
JPS62131447U JP1986018446U JP1844686U JPS62131447U JP S62131447 U JPS62131447 U JP S62131447U JP 1986018446 U JP1986018446 U JP 1986018446U JP 1844686 U JP1844686 U JP 1844686U JP S62131447 U JPS62131447 U JP S62131447U
Authority
JP
Japan
Prior art keywords
heat dissipation
dissipation fin
semiconductor device
side surfaces
molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986018446U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986018446U priority Critical patent/JPS62131447U/ja
Publication of JPS62131447U publication Critical patent/JPS62131447U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図Ａ及びＢはこの考案の一実施例による半
導体装置を示す平面図及び側面図、第２図は第１
図ＡのＣ―Ｃ′での断面図、第３図Ａ及びＢは従
来の半導体装置を示す平面図及び側面図である。 図において、１は半導体チツプ、２は放熱フイ
ン、３は電極リード端子、４は支持リード部、５
はモールド樹脂、６は突起である。なお図中同一
符号は同一又は相当部分を示す。 1A and 1B are a plan view and a side view showing a semiconductor device according to an embodiment of this invention, and FIG.
A sectional view taken along line CC' in Figure A, and Figures 3A and 3B are a plan view and a side view showing a conventional semiconductor device. In the figure, 1 is a semiconductor chip, 2 is a heat radiation fin, 3 is an electrode lead terminal, 4 is a support lead part, and 5 is a heat dissipation fin.
6 is a mold resin, and 6 is a protrusion. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】 半導体チツプが取り付けられた放熱フインのほ
ぼ全面と電極リードの一部とをモールド樹脂で成
形封止した樹脂絶縁型の半導体装置において、 上記放熱フインはその上面より上方向にかつ側
面より外方向に突起し上記放熱フイン両側面に一
体に形成さた左右一対の突起を有するものである
ことを特徴とする半導体装置。[Scope of Claim for Utility Model Registration] In a resin-insulated semiconductor device in which almost the entire surface of a heat dissipation fin to which a semiconductor chip is attached and a part of an electrode lead are molded and sealed with molded resin, the heat dissipation fin is above the upper surface of the heat dissipation fin. 1. A semiconductor device comprising a pair of left and right protrusions that protrude in the direction and outward from the side surfaces and are integrally formed on both side surfaces of the heat dissipation fin.
JP1986018446U 1986-02-12 1986-02-12 Pending JPS62131447U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986018446U JPS62131447U (en) 1986-02-12 1986-02-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986018446U JPS62131447U (en) 1986-02-12 1986-02-12

Publications (1)

Publication Number Publication Date
JPS62131447U true JPS62131447U (en) 1987-08-19

Family

ID=30812126

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986018446U Pending JPS62131447U (en) 1986-02-12 1986-02-12

Country Status (1)

Country Link
JP (1) JPS62131447U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0497352U (en) * 1990-07-26 1992-08-24

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0497352U (en) * 1990-07-26 1992-08-24

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