JPS6263944U - - Google Patents
Info
- Publication number
- JPS6263944U JPS6263944U JP1985155853U JP15585385U JPS6263944U JP S6263944 U JPS6263944 U JP S6263944U JP 1985155853 U JP1985155853 U JP 1985155853U JP 15585385 U JP15585385 U JP 15585385U JP S6263944 U JPS6263944 U JP S6263944U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation fin
- semiconductor device
- resin
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図ａ，ｂは本考案による樹脂絶縁形半導体
装置の一実施例を示す平面図、そのＢ―Ｂ′断面
図、第２図は第１図の要部拡大平面図、第３図は
半導体素子を投載した放熱フインをモールド成形
する状態を示す要部断面図、第４図ａ，ｂおよび
第５図ａ，ｂは従来の樹脂絶縁形半導体装置を示
す平面図、そのＢ―Ｂ′断面図、第６図は従来の
樹脂絶縁形半導体装置の放熱フインの位置ずれ状
態を示す平面図である。
１……放熱フイン、２……電極リード端子、３
……半導体チツプ、４……モールド樹脂、６，６
′……固定ピン跡、７……位置決め用穴、８……
上金型、８ａ……固定ピン、９……下金型、９ａ
……固定ピン。
1a and 1b are plan views showing one embodiment of a resin insulated semiconductor device according to the present invention, and a sectional view thereof taken along line BB', FIG. 2 is an enlarged plan view of the main part of FIG. 1, and FIG. A sectional view of main parts showing a state in which a heat dissipation fin on which a semiconductor element is mounted is molded, FIGS. 4a and 4b and FIGS. The sectional view and FIG. 6 are plan views showing misaligned heat radiation fins of a conventional resin-insulated semiconductor device. 1... Heat dissipation fin, 2... Electrode lead terminal, 3
...Semiconductor chip, 4...Mold resin, 6,6
'...Fixing pin mark, 7...Positioning hole, 8...
Upper mold, 8a...Fixing pin, 9...Lower mold, 9a
...Fixed pin.
Claims (1)
ード端子部とを有する放熱フインの前記放熱フイ
ン部のほぼ全面をモールド樹脂により被覆された
樹脂絶縁形半導体装置において、前記放熱フイン
に半導体チツプ取付用穴とは異なる位置決め用穴
を設けたことを特徴とする半導体装置。 In a resin-insulated semiconductor device, the heat dissipation fin has a heat dissipation fin on which a semiconductor chip is mounted and an electrode lead terminal, and substantially the entire surface of the heat dissipation fin is covered with a molded resin, and the heat dissipation fin has a hole for attaching the semiconductor chip. A semiconductor device characterized by having different positioning holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985155853U JPS6263944U (en) | 1985-10-11 | 1985-10-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985155853U JPS6263944U (en) | 1985-10-11 | 1985-10-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6263944U true JPS6263944U (en) | 1987-04-21 |
Family
ID=31076926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985155853U Pending JPS6263944U (en) | 1985-10-11 | 1985-10-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6263944U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6415958A (en) * | 1987-07-10 | 1989-01-19 | Hitachi Ltd | Resin-encapsulated semiconductor device |
| JPH04162550A (en) * | 1990-10-26 | 1992-06-08 | Nec Corp | Resin-sealed semiconductor device and manufacture thereof |
-
1985
- 1985-10-11 JP JP1985155853U patent/JPS6263944U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6415958A (en) * | 1987-07-10 | 1989-01-19 | Hitachi Ltd | Resin-encapsulated semiconductor device |
| JPH04162550A (en) * | 1990-10-26 | 1992-06-08 | Nec Corp | Resin-sealed semiconductor device and manufacture thereof |