JPS6415958A - Resin-encapsulated semiconductor device - Google Patents
Resin-encapsulated semiconductor deviceInfo
- Publication number
- JPS6415958A JPS6415958A JP17095687A JP17095687A JPS6415958A JP S6415958 A JPS6415958 A JP S6415958A JP 17095687 A JP17095687 A JP 17095687A JP 17095687 A JP17095687 A JP 17095687A JP S6415958 A JPS6415958 A JP S6415958A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- screw
- package
- encapsulated body
- beveled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To improve the package breaking strength due to a stress caused at the time of tightening the screw in a package by applying a work in which a tapered or stepwise beveling is performed along the periphery of the bottom of a resin-encapsulated body near the hole for attaching the screw. CONSTITUTION:In a resin-encapsulated body 3, part of the upper side near the screw attaching has a recessed part 7 formed in correspondence to the all type projecting part for keeping the injection balance of the resin at the time of resin mold, and a step part 8 is formed where the sharp part is stepwise beveled along the perimetrical part of the bottom near a hole for screw attaching of the resin-encapsulated body, and particularly in the corners of the bottom, obliquely and widely beveled triangular step parts 9 are formed. The shapes of the step parts 8, 9 are decided at the design stage of the metal mold along with the recessed part 7. Even if a radiation substrate 10 of a resin full mode transistor has a curve, the stress due to the tightening of the screw is not directly applied to the perimetrical part because the sharp part of the bottom of the resin-encapsulated body has been beveled in the perimetrical part, and the concentration of the stress on the package perimetry is reduced, whereby the package tightening strength can be improved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62170956A JP2602234B2 (en) | 1987-07-10 | 1987-07-10 | Resin-sealed semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62170956A JP2602234B2 (en) | 1987-07-10 | 1987-07-10 | Resin-sealed semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6415958A true JPS6415958A (en) | 1989-01-19 |
| JP2602234B2 JP2602234B2 (en) | 1997-04-23 |
Family
ID=15914495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62170956A Expired - Lifetime JP2602234B2 (en) | 1987-07-10 | 1987-07-10 | Resin-sealed semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2602234B2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57188858A (en) * | 1981-05-18 | 1982-11-19 | Matsushita Electronics Corp | Plastic molded type semiconductor device |
| JPS6263944U (en) * | 1985-10-11 | 1987-04-21 |
-
1987
- 1987-07-10 JP JP62170956A patent/JP2602234B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57188858A (en) * | 1981-05-18 | 1982-11-19 | Matsushita Electronics Corp | Plastic molded type semiconductor device |
| JPS6263944U (en) * | 1985-10-11 | 1987-04-21 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2602234B2 (en) | 1997-04-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 11 Free format text: PAYMENT UNTIL: 20080129 |