JPS6430237A - Manufacture of resin-sealed semiconductor device - Google Patents
Manufacture of resin-sealed semiconductor deviceInfo
- Publication number
- JPS6430237A JPS6430237A JP18718887A JP18718887A JPS6430237A JP S6430237 A JPS6430237 A JP S6430237A JP 18718887 A JP18718887 A JP 18718887A JP 18718887 A JP18718887 A JP 18718887A JP S6430237 A JPS6430237 A JP S6430237A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- protrusions
- protrusion
- cavity part
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE:To stop a resin flow to flow out of a cavity part in the vicinity of a tie bar and to make it possible to peel easily resin thin pieces adhered on the surfaces of leads in the latter process by a method wherein a metal mold is provided with two protrusions and these protrusions are respectively pressed to the tie bar of a lead frame and on the lead frame in the vicinity of the cavity part. CONSTITUTION:First and second protrusions 1a and 1b are provided on the lower surface of a top metal mold 1, the protrusion 1a is pressed to the end part of a tie bar 4a and the second protrusion 1b is pressed to the surface of a lead frame 4 in the immediate vicinity of a cavity part 3. In this state, when a fused resin is poured in the cavity part 3, a package 6 for protecting a semiconductor chip 5 is formed of the filled resin. At this time, part of the resin intrudes between the first and second protrusions 1a and 1b as well and a thin piece is formed. However, this thin piece does not leak outside from the protrusion 1a and moreover, is interrupted from the package 6 by the protrusion 1b. Then, when leads 4b are bent at the time of bent processing, thin pieces 7a separated from the package 6 are peeled naturally according to the bending of the leads 4b.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62187188A JP2532490B2 (en) | 1987-07-27 | 1987-07-27 | Method for manufacturing resin-sealed semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62187188A JP2532490B2 (en) | 1987-07-27 | 1987-07-27 | Method for manufacturing resin-sealed semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6430237A true JPS6430237A (en) | 1989-02-01 |
JP2532490B2 JP2532490B2 (en) | 1996-09-11 |
Family
ID=16201647
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62187188A Expired - Lifetime JP2532490B2 (en) | 1987-07-27 | 1987-07-27 | Method for manufacturing resin-sealed semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2532490B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60175079A (en) * | 1984-02-21 | 1985-09-09 | 株式会社ナムコ | Driver using curved shaft |
US20130341779A1 (en) * | 2012-06-25 | 2013-12-26 | Mitsubishi Electric Corporation | Method of manufacturing a semiconductor device and semiconductor device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS562642A (en) * | 1979-06-22 | 1981-01-12 | Mitsubishi Electric Corp | Device for forming resin-sealed semiconductor device |
JPS63314841A (en) * | 1987-06-17 | 1988-12-22 | Nec Yamagata Ltd | Metal mold for resin seal of semiconductor device |
-
1987
- 1987-07-27 JP JP62187188A patent/JP2532490B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS562642A (en) * | 1979-06-22 | 1981-01-12 | Mitsubishi Electric Corp | Device for forming resin-sealed semiconductor device |
JPS63314841A (en) * | 1987-06-17 | 1988-12-22 | Nec Yamagata Ltd | Metal mold for resin seal of semiconductor device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60175079A (en) * | 1984-02-21 | 1985-09-09 | 株式会社ナムコ | Driver using curved shaft |
US20130341779A1 (en) * | 2012-06-25 | 2013-12-26 | Mitsubishi Electric Corporation | Method of manufacturing a semiconductor device and semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JP2532490B2 (en) | 1996-09-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR900007230B1 (en) | Leadfrfame for semiconductor device | |
MY126370A (en) | Plastic molded type semiconductor device and fabrication process thereof | |
KR950004495A (en) | Method of manufacturing semiconductor device, lead frame and semiconductor device | |
EP0688650A4 (en) | Method of resin-sealing semiconductor devices | |
JPS6430237A (en) | Manufacture of resin-sealed semiconductor device | |
JPS5763850A (en) | Semiconductor device | |
JPS6484651A (en) | Semiconductor device | |
JPS5587469A (en) | Semiconductor device and its manufacture | |
JPS5664445A (en) | Manufacture of semiconductor device | |
JPS55157235A (en) | Manufacture of semiconductor integrated circuit | |
JPS562642A (en) | Device for forming resin-sealed semiconductor device | |
JPS6450454A (en) | Manufacture of lead frame and semiconductor device | |
KR930007174Y1 (en) | Lead frame | |
JPS6237120A (en) | Molding mold and molding method | |
JPS5720437A (en) | Resin sealing metal mold for semiconductor device | |
JPS6467950A (en) | Semiconductor device | |
JPS57154863A (en) | Manufacture of resin sealing type electronic parts | |
JPS57202745A (en) | Manufacture of semiconductor device | |
JPS635539A (en) | Resin sealing device for semiconductor device | |
JPS5752155A (en) | Manufacture of resin sealed semiconductor device | |
JPS574132A (en) | Manufacture of semiconductor device | |
JPH04286355A (en) | Lead frame | |
JPS55163867A (en) | Lead frame for semiconductor device | |
JPS6480031A (en) | Manufacture of resin sealed semiconductor device | |
JPS6453567A (en) | Manufacture of resin-molded type electronic component |