JPS5587469A - Semiconductor device and its manufacture - Google Patents

Semiconductor device and its manufacture

Info

Publication number
JPS5587469A
JPS5587469A JP16403278A JP16403278A JPS5587469A JP S5587469 A JPS5587469 A JP S5587469A JP 16403278 A JP16403278 A JP 16403278A JP 16403278 A JP16403278 A JP 16403278A JP S5587469 A JPS5587469 A JP S5587469A
Authority
JP
Japan
Prior art keywords
lead
external
leads
frame
constitution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16403278A
Other languages
Japanese (ja)
Inventor
Takashi Haraguchi
Haruo Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16403278A priority Critical patent/JPS5587469A/en
Publication of JPS5587469A publication Critical patent/JPS5587469A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent damage on the lead by bonding with each one piece of resistance the tips of external leads introduced in the surroundings and enabling easy handling. CONSTITUTION:Tie bar 12 and external leads 11 are additionally formed on the outer frame of lead frame. When manufacturing the device, leads 11 are seal- formed simultaneously with the resin sealing part 5 of semiconductor chip. Tie bar 12 not only prevents the deformation of lead 1', 11 but also stops the flow of resin when sealed. Next, after mold shaping, tie bars 2, 12 and the external frame 3 are cut and removed. Thus a semiconductor apparatus is completed. Under this constitution, it is easy to handle the device and improve workability with reduced damage on the external lead and the feasibility of connection without mutual contact.
JP16403278A 1978-12-25 1978-12-25 Semiconductor device and its manufacture Pending JPS5587469A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16403278A JPS5587469A (en) 1978-12-25 1978-12-25 Semiconductor device and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16403278A JPS5587469A (en) 1978-12-25 1978-12-25 Semiconductor device and its manufacture

Publications (1)

Publication Number Publication Date
JPS5587469A true JPS5587469A (en) 1980-07-02

Family

ID=15785505

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16403278A Pending JPS5587469A (en) 1978-12-25 1978-12-25 Semiconductor device and its manufacture

Country Status (1)

Country Link
JP (1) JPS5587469A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5822745U (en) * 1981-08-05 1983-02-12 日本電気株式会社 Mount board for flat package type IC
JPS59136956A (en) * 1983-01-25 1984-08-06 Rohm Co Ltd Semiconductor device
JPS59182944U (en) * 1983-05-20 1984-12-06 クラリオン株式会社 semiconductor equipment
JPS6098651A (en) * 1983-10-19 1985-06-01 トーマス　アンド　ベツツ　コーポレーシヨン Lead member and its mounting method
US4547795A (en) * 1983-03-24 1985-10-15 Bourns, Inc. Leadless chip carrier with frangible shorting bars
JPS6298759A (en) * 1985-10-25 1987-05-08 Mitsubishi Electric Corp Electronic device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5381073A (en) * 1976-12-27 1978-07-18 Hitachi Ltd Oroduction of resin seal type semiconductor device and lead frame used the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5381073A (en) * 1976-12-27 1978-07-18 Hitachi Ltd Oroduction of resin seal type semiconductor device and lead frame used the same

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5822745U (en) * 1981-08-05 1983-02-12 日本電気株式会社 Mount board for flat package type IC
JPS59136956A (en) * 1983-01-25 1984-08-06 Rohm Co Ltd Semiconductor device
US4547795A (en) * 1983-03-24 1985-10-15 Bourns, Inc. Leadless chip carrier with frangible shorting bars
JPS59182944U (en) * 1983-05-20 1984-12-06 クラリオン株式会社 semiconductor equipment
JPS6334289Y2 (en) * 1983-05-20 1988-09-12
JPS6098651A (en) * 1983-10-19 1985-06-01 トーマス　アンド　ベツツ　コーポレーシヨン Lead member and its mounting method
JPH0151064B2 (en) * 1983-10-19 1989-11-01 Thomas & Betts Corp
JPS6298759A (en) * 1985-10-25 1987-05-08 Mitsubishi Electric Corp Electronic device

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