JPS6454750A - Manufacture of resin-sealed semiconductor device - Google Patents
Manufacture of resin-sealed semiconductor deviceInfo
- Publication number
- JPS6454750A JPS6454750A JP21231787A JP21231787A JPS6454750A JP S6454750 A JPS6454750 A JP S6454750A JP 21231787 A JP21231787 A JP 21231787A JP 21231787 A JP21231787 A JP 21231787A JP S6454750 A JPS6454750 A JP S6454750A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- bars
- sealing
- cutting
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To simultaneously cut resin and tie bars in the case of cutting and shaping by narrowing the interval of the tie bars and reducing the size of a resin part generated between a package and the bars to a limit in which the resin is not leaked at the time of sealing. CONSTITUTION:The interval C of tie bars 1a is set to the width A of a package 3+0.4mm. The displacement of a metal mold at the time of sealing it with resin is sufficiently absorbed to stop the sealing resin by the bars 1a. After sealing, the size of the resin part 1f formed between the package 3 and the bar 1a is 0.2mm, the resin and the bars are simultaneously cut and shaped by cutting twice the bars, cutting a pinch bar, and eventually cutting leads to finish it, thereby eliminating one step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21231787A JPS6454750A (en) | 1987-08-26 | 1987-08-26 | Manufacture of resin-sealed semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21231787A JPS6454750A (en) | 1987-08-26 | 1987-08-26 | Manufacture of resin-sealed semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6454750A true JPS6454750A (en) | 1989-03-02 |
Family
ID=16620546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21231787A Pending JPS6454750A (en) | 1987-08-26 | 1987-08-26 | Manufacture of resin-sealed semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6454750A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010080913A (en) * | 2008-08-28 | 2010-04-08 | Sanyo Electric Co Ltd | Resin sealing type semiconductor device and method for manufacturing the same, and resin sealing type electronic device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60180126A (en) * | 1984-02-28 | 1985-09-13 | Toshiba Corp | Manufacture of semiconductor device |
| JPS6117750B2 (en) * | 1978-04-24 | 1986-05-09 | Hitachi Ltd | |
| JPS62128163A (en) * | 1985-11-29 | 1987-06-10 | Nec Corp | Lead frame |
-
1987
- 1987-08-26 JP JP21231787A patent/JPS6454750A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6117750B2 (en) * | 1978-04-24 | 1986-05-09 | Hitachi Ltd | |
| JPS60180126A (en) * | 1984-02-28 | 1985-09-13 | Toshiba Corp | Manufacture of semiconductor device |
| JPS62128163A (en) * | 1985-11-29 | 1987-06-10 | Nec Corp | Lead frame |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010080913A (en) * | 2008-08-28 | 2010-04-08 | Sanyo Electric Co Ltd | Resin sealing type semiconductor device and method for manufacturing the same, and resin sealing type electronic device |
| US8502360B2 (en) | 2008-08-28 | 2013-08-06 | Sanyo Semiconductor Co., Ltd. | Resin sealing type semiconductor device and method of manufacturing the same, and resin sealing type electronic device |
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