JPS55157235A - Manufacture of semiconductor integrated circuit - Google Patents

Manufacture of semiconductor integrated circuit

Info

Publication number
JPS55157235A
JPS55157235A JP6545979A JP6545979A JPS55157235A JP S55157235 A JPS55157235 A JP S55157235A JP 6545979 A JP6545979 A JP 6545979A JP 6545979 A JP6545979 A JP 6545979A JP S55157235 A JPS55157235 A JP S55157235A
Authority
JP
Japan
Prior art keywords
resin
integrated circuit
shape
semiconductor integrated
punch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6545979A
Other languages
Japanese (ja)
Other versions
JPS6150379B2 (en
Inventor
Kojiro Shibuya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP6545979A priority Critical patent/JPS55157235A/en
Publication of JPS55157235A publication Critical patent/JPS55157235A/en
Publication of JPS6150379B2 publication Critical patent/JPS6150379B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To reduce the damage and defect at a resin seal of a semiconductor integrated circuit by forming the shape of a punch of a mold used for the step of removing unnecessary resin of a resin-sealed integrated circuit in raised shape. CONSTITUTION:The shape of a punch 6 for removing resin burr 1 filled in a region surrounded by a lead wire 2 and a tie bar 3 is formed in raised shape. On the other hand, the resin burr 1 is formed of the same material as the resin seal 5, and incorporates higher punch out stress than that between the lead wire 2 or the tie bar 3 and the resin burr 1.
JP6545979A 1979-05-25 1979-05-25 Manufacture of semiconductor integrated circuit Granted JPS55157235A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6545979A JPS55157235A (en) 1979-05-25 1979-05-25 Manufacture of semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6545979A JPS55157235A (en) 1979-05-25 1979-05-25 Manufacture of semiconductor integrated circuit

Publications (2)

Publication Number Publication Date
JPS55157235A true JPS55157235A (en) 1980-12-06
JPS6150379B2 JPS6150379B2 (en) 1986-11-04

Family

ID=13287730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6545979A Granted JPS55157235A (en) 1979-05-25 1979-05-25 Manufacture of semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPS55157235A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0230152A (en) * 1988-07-19 1990-01-31 Nec Corp Manufacture of semiconductor device
JPH0371647A (en) * 1989-08-10 1991-03-27 Sanyo Electric Co Ltd Manufacture of semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0230152A (en) * 1988-07-19 1990-01-31 Nec Corp Manufacture of semiconductor device
JPH0371647A (en) * 1989-08-10 1991-03-27 Sanyo Electric Co Ltd Manufacture of semiconductor device

Also Published As

Publication number Publication date
JPS6150379B2 (en) 1986-11-04

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