JPS62156844A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPS62156844A JPS62156844A JP60297009A JP29700985A JPS62156844A JP S62156844 A JPS62156844 A JP S62156844A JP 60297009 A JP60297009 A JP 60297009A JP 29700985 A JP29700985 A JP 29700985A JP S62156844 A JPS62156844 A JP S62156844A
- Authority
- JP
- Japan
- Prior art keywords
- dam
- bars
- dam bar
- lead
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明はリードフレームに関するもので特に合成樹脂に
よって封止されてなる半導体装置に使用されるものであ
る。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a lead frame, and is particularly used in a semiconductor device sealed with a synthetic resin.
第４図に従来のリードフレームの一例を示す。 FIG. 4 shows an example of a conventional lead frame.
この図は左右方向に連続して形成された複数ブロックの
うちの１ブロック分を示しており、中央に設けられたベ
ッド部（アイランド部）１がタイバー２によってフレー
ム３に結合支持され、ベッド部１の周囲には多数のリー
ド４が一端側が近接して放射状に配設され、各リードの
他端側は上部および下部のフレームと平行な状態でフレ
ーム３の上下接続部に結合される。これらのリード４の
途中にはり一ド４の変形を防止するためのダイパー５が
隣接するリード間に架設されている。このダムバー５は
パッケージ本体形成後に第６図のようにリード４間にポ
ンチ１０が打ち込まれ、切り落されるものである。This figure shows one block out of a plurality of blocks formed continuously in the left and right direction. A bed part (island part) 1 provided in the center is connected and supported by a frame 3 by tie bars 2, and the bed part A large number of leads 4 are arranged radially around the frame 1 with one end close to each other, and the other end of each lead is connected to the upper and lower connecting portions of the frame 3 in parallel with the upper and lower frames. In the middle of these leads 4, a dieper 5 for preventing deformation of the beam 4 is installed between adjacent leads. The dam bar 5 is cut off by driving a punch 10 between the leads 4 as shown in FIG. 6 after the package body is formed.
このようなリードフレームを使用して半導体装置を形成
するには第７図に示すようにベッド部１に半導体チップ
６をダイボンディングした後、この半導体チップ６上に
電極と各リード４の内端部間を金線、アルミニウム線等
のライ１フ７でボンディング接続する。To form a semiconductor device using such a lead frame, as shown in FIG. The parts are bonded and connected using a life 7 made of gold wire, aluminum wire, or the like.
そして、半導体デツプ２２、ボンディングワイヤ２４、
リードフレーム２３を含む領域に樹脂モールドを行い、
これらを封止するパッケージ本体を形成する。Then, the semiconductor depth 22, the bonding wire 24,
Resin molding is performed on the area including the lead frame 23,
A package body is formed to seal these.
なＪ５、第４図の２点鎖線はモールド部の境界を示して
いる。第５図はかかるパッケージ本体′８が形成された
後の半導体装置の従来例の部分平面図である。J5, the two-dot chain line in FIG. 4 indicates the boundary of the mold part. FIG. 5 is a partial plan view of a conventional example of a semiconductor device after such a package body '8 has been formed.
同図によれば、パッケージ本体８を形成するためのモー
ルドされた樹脂のバリ９がパッケージ本体８からリード
１とダムバー５とによって囲まれたｍＨに形成されるこ
とがある。このバリは脱落して製品の接触不良等を招く
ことがダムバー５のカッティングの後にバリ除去が行な
われるが、製造工程が増加するため好ましくない。従っ
て、従来ではダムバー５を切り落とすポンチ１０をバリ
に届くように横長に形成し、ダムバー５のカッティング
と同時にバリ除去を行なっている。しかしながら、この
場合はバリ９が硬いため、第６図に示すように完全に除
去されないバリ９′として残る他にポンチ１０が早期に
摩耗し、ポンチ１０の交換頻度が多い、という問題点が
ある。According to the figure, a molded resin burr 9 for forming the package body 8 may be formed in mH surrounded by the lead 1 and the dam bar 5 from the package body 8. This burr is removed after cutting the dam bar 5 because the burr falls off and causes poor contact of the product, but this is not preferable because it increases the number of manufacturing steps. Therefore, conventionally, the punch 10 for cutting off the dam bar 5 is formed horizontally long so as to reach the burr, and the burr is removed at the same time as the dam bar 5 is cut. However, in this case, since the burr 9 is hard, it remains as a burr 9' that is not completely removed as shown in FIG. .
本発明は上記問題を解決するためなされたもので、樹脂
モールド後のバリの発生を防止してバリ除去作業を省略
することができるリードフレームを提供することを目的
とする。The present invention has been made to solve the above problems, and an object of the present invention is to provide a lead frame that can prevent the occurrence of burrs after resin molding and can omit burr removal work.
上記目的達成のため、本発明にかかるリードフレームに
おいてはダムバ一部から樹脂封止予定部近傍まで延び、
ダムバー切断時に除去されるバリ防止片を備えている。In order to achieve the above object, the lead frame according to the present invention extends from a part of the dam bar to the vicinity of the resin-sealed part,
Equipped with a burr prevention piece that is removed when cutting the dam bar.
このためバリの発生が抑制されバリ除去作業を省略する
ことが可能どなる。As a result, the occurrence of burrs is suppressed, making it possible to omit burr removal work.
本発明にかかるリードフレームの一実施例を第１図の平
面図に示す。An embodiment of a lead frame according to the present invention is shown in the plan view of FIG.
これによればこのリードフレームは従来と同様にベッド
部１１、タイバー１２、フレーム１３、リード１４を有
しているが、タイバー１５付近の構成が異なる。すなわ
ちダムバー１５から樹脂封止領域１８の方に延びる小片
が形成されている。According to this, this lead frame has a bed portion 11, a tie bar 12, a frame 13, and a lead 14 like the conventional one, but the structure around the tie bar 15 is different. That is, a small piece is formed extending from the dam bar 15 toward the resin sealing region 18.
この小片は先端部１６ ａは樹脂封止部１ｆｆ１８にき
わめて近い位置まで延び、根元部１６ｂはダムバー１５
に連設されているが切欠き部１７がその両側に形成され
ているためにダムバー１５よりも狭い幅を有している。The tip portion 16a of this small piece extends to a position extremely close to the resin sealing portion 1ff18, and the root portion 16b extends to a position very close to the dam bar 15.
Although notches 17 are formed on both sides of the dam bar, the width thereof is narrower than that of the dam bar 15.
また小片１６の両側側面はり−ド１４から切離された切
込線２０となっている。Also, there are cut lines 20 cut off from the beams 14 on both sides of the small piece 16.
第２図ｄ３よび第３図は本発明の作用を示す平面図であ
って、第５図おにび第６図と同様にモールド後の様子を
示している。第２図はモールド直後の様子を示しており
、小片１６の先端部１６ａと樹脂封止部１８との間に１
よ実用１全く問題にならないごく少帝のバリ１９が形成
されるにすぎない。FIGS. 2d3 and 3 are plan views showing the operation of the present invention, and similarly to FIGS. 5 and 6, they show the state after molding. FIG. 2 shows the state immediately after molding.
It's just a very small burr 19 that is not a problem for practical use.
第３図はボンデ２１をアウタリード１４間のダムバー１
５に当接させて、ダムバー１５を除去する状態を示して
いる。第１図および第２図により前述したように、この
ダムバー１５とリード１４との平行な切込線２０が予め
、形成されており、リード１４およびダイパー１２のフ
レーム１３からの切離しと同時にポンチによるダムバー
３の打ち落しが行われるとダムバー１５が除去されると
共に小片１６全体が除去され、その部分にはダムバーの
痕跡１５′と微小なバリ１９が残存Ｊることとなる。Figure 3 shows the dam bar 1 between the bond 21 and the outer lead 14.
5, the dam bar 15 is removed. As described above with reference to FIGS. 1 and 2, parallel cutting lines 20 are formed between the dam bar 15 and the lead 14, and the lead 14 and the dieper 12 are simultaneously separated from the frame 13 using a punch. When the dam bar 3 is shot down, the dam bar 15 is removed and the entire small piece 16 is removed, leaving traces 15' of the dam bar and minute burrs 19 in that part.
したがって、バリ４が小さいため除去する必要がなくな
り、従って、ポンチで心接バリを落ずことは不要となる
。これにより、バリどの接触によるポンチの摩耗がなく
なり、ポンチの耐使用回数が増大する。Therefore, since the burr 4 is small, it is not necessary to remove it, and therefore, it is not necessary to remove the center contact burr with a punch. This eliminates wear on the punch due to contact with the burrs, increasing the number of times the punch can be used.
本実施例では切込線５の外側端部が矩形状に切り欠かれ
て孔７が形成されているがアウタリード２の変形、歪を
吸収するように作用すると共に、ダムバー３の打ち落し
を容易にすることかできるものであればどのような形状
でもよい。In this embodiment, the outer end of the cut line 5 is notched into a rectangular shape to form a hole 7, which acts to absorb deformation and distortion of the outer lead 2 and facilitates knocking off the dam bar 3. Any shape is acceptable as long as it can be made into a shape.
以上のとおり本発明によれば、リード間に介在されるダ
ムバー樹脂封止予定部近傍まで延出さ「てリードとダム
バーにより形成される隙間を小さくしているので樹脂封
止時のバリの発生を防止することができ、バリ除去作業
の省略による工程の効率化Ｊ３よびコメ１−ダウンを図
ることができる。As described above, according to the present invention, the dam bar interposed between the leads extends to the vicinity of the area to be resin-sealed, thereby reducing the gap formed by the lead and the dam bar, thereby preventing the occurrence of burrs during resin sealing. By omitting the burr removal work, it is possible to improve the efficiency of the process and reduce the amount of rice.
第１図は本発明にかかるリードフレームの一実施例の部
分平面図、第２図はその部分拡大図、第３図はダムバー
除去の際の部分平面図、第４図は従来のリードフレーム
の平面図、第５図はその部分拡大図、第６図はそのダム
バー除去の際の部分平面図、第７図は半導体装置の組立
途中を示す斜６！図である。
１．１１・・・ベッド部、２，１２・・・ダイパー、３
゜１３・・・フレーム、４，１４・・・リード、５．１
５・・・ダムバー、９．１９・・・バリ、１６・・・バ
リ防止片、１７・・・切欠部、１８・・・樹脂防止片、
２０・・・切込線。
出願人代理人 佐 藤 −雄
第１図
第４図FIG. 1 is a partial plan view of an embodiment of the lead frame according to the present invention, FIG. 2 is an enlarged partial view thereof, FIG. 3 is a partial plan view of the dam bar removed, and FIG. 4 is a partial plan view of a conventional lead frame. A plan view, FIG. 5 is a partially enlarged view, FIG. 6 is a partial plan view when the dam bar is removed, and FIG. 7 is a diagonal 6! showing the semiconductor device being assembled. It is a diagram. 1.11... Bed part, 2, 12... Diaper, 3
゜13...Frame, 4,14...Lead, 5.1
5... Dam bar, 9.19... Burr, 16... Burr prevention piece, 17... Notch, 18... Resin prevention piece,
20... Cut line. Applicant's agent Mr. Sato Figure 1 Figure 4
Claims (1)
が搭載されるベッド部と、 このベッド部の周囲に放射状に配置され、それぞれフレ
ームに結合された複数のリード部と、これらのリード部
どうしを結合するダムバーと、このダムバーから樹脂封
止予定部近傍まで延び、ダムバー切断時に除去されるバ
リ防止片とを備えたリードフレーム。 ２、バリ防止片がリードと切離し状態にダムバーから延
出された突片である特許請求の範囲第１項記載のリード
フレーム。 ３、バリ防止片が根元部に切欠き部を有するものである
特許請求の範囲第１項または第２項記載のリードフレー
ム。[Claims] 1. A bed portion connected to a frame by tie bars and on which a semiconductor chip is mounted; a plurality of lead portions arranged radially around the bed portion and each connected to the frame; A lead frame comprising a dam bar that connects lead parts together, and a burr prevention piece that extends from the dam bar to the vicinity of a portion to be sealed with resin and is removed when the dam bar is cut. 2. The lead frame according to claim 1, wherein the burr prevention piece is a protruding piece that extends from the dam bar and is separated from the lead. 3. The lead frame according to claim 1 or 2, wherein the burr prevention piece has a notch at its base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60297009A JPS62156844A (en) | 1985-12-28 | 1985-12-28 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60297009A JPS62156844A (en) | 1985-12-28 | 1985-12-28 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62156844A true JPS62156844A (en) | 1987-07-11 |
Family
ID=17841065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60297009A Pending JPS62156844A (en) | 1985-12-28 | 1985-12-28 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62156844A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0298165A (en) * | 1988-10-05 | 1990-04-10 | Goto Seisakusho:Kk | Lead frame for electronic component and manufacture of electronic component using the same |
| US5070039A (en) * | 1989-04-13 | 1991-12-03 | Texas Instruments Incorporated | Method of making an integrated circuit using a pre-served dam bar to reduce mold flash and to facilitate flash removal |
| US5271148A (en) * | 1988-11-17 | 1993-12-21 | National Semiconductor Corporation | Method of producing a leadframe |
| KR20010105891A (en) * | 2000-05-19 | 2001-11-29 | 마이클 디. 오브라이언 | Leadframe for semiconductor package |
| US7109064B2 (en) * | 2003-12-08 | 2006-09-19 | Semiconductor Components Industries, L.L.C. | Method of forming a semiconductor package and leadframe therefor |
-
1985
- 1985-12-28 JP JP60297009A patent/JPS62156844A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0298165A (en) * | 1988-10-05 | 1990-04-10 | Goto Seisakusho:Kk | Lead frame for electronic component and manufacture of electronic component using the same |
| US5271148A (en) * | 1988-11-17 | 1993-12-21 | National Semiconductor Corporation | Method of producing a leadframe |
| US5070039A (en) * | 1989-04-13 | 1991-12-03 | Texas Instruments Incorporated | Method of making an integrated circuit using a pre-served dam bar to reduce mold flash and to facilitate flash removal |
| KR20010105891A (en) * | 2000-05-19 | 2001-11-29 | 마이클 디. 오브라이언 | Leadframe for semiconductor package |
| US7109064B2 (en) * | 2003-12-08 | 2006-09-19 | Semiconductor Components Industries, L.L.C. | Method of forming a semiconductor package and leadframe therefor |
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