JP2602570Y2 - Lead frame for semiconductor device - Google Patents
Lead frame for semiconductor deviceInfo
- Publication number
- JP2602570Y2 JP2602570Y2 JP1992014454U JP1445492U JP2602570Y2 JP 2602570 Y2 JP2602570 Y2 JP 2602570Y2 JP 1992014454 U JP1992014454 U JP 1992014454U JP 1445492 U JP1445492 U JP 1445492U JP 2602570 Y2 JP2602570 Y2 JP 2602570Y2
- Authority
- JP
- Japan
- Prior art keywords
- tie bar
- lead
- frame
- lead frame
- island
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本考案は半導体装置のリードフレ
ームに関し、特に樹脂封止型半導体装置用のリードフレ
ームに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame for a semiconductor device, and more particularly to a lead frame for a resin-sealed semiconductor device.
【０００２】[0002]
【従来の技術】従来の半導体装置用リードフレームは、
図２に示すように、半導体ペレット１を搭載するための
アイランド２と、半導体ペレット１の電極部との電気接
続を行うボンディングワイヤ３を接続するためのステッ
チ４と、このステッチ４に連続されて外部に電気配線を
導出するためのリード５と、樹脂封止を行うまでリード
５を帯状に連結するタイバー６と、これらを支持補強し
ておく枠状のフレーム部８とで構成される。2. Description of the Related Art Conventional lead frames for semiconductor devices are:
As shown in FIG. 2, an island 2 for mounting the semiconductor pellet 1, a stitch 4 for connecting a bonding wire 3 for electrically connecting an electrode portion of the semiconductor pellet 1, and a stitch 4 connected to the stitch 4 It is composed of a lead 5 for leading out an electric wiring to the outside, a tie bar 6 for connecting the lead 5 in a belt shape until resin sealing is performed, and a frame-shaped frame portion 8 for supporting and reinforcing these.
【０００３】[0003]
【考案が解決しようとする課題】前記したタイバー６は
樹脂封止の際に樹脂が外部に洩れないようにするために
も利用される。このため、タイバー６の幅寸法を小さく
すると、樹脂封止工程での射出圧力によってタイバーが
変形され、樹脂が外部に洩れてリード５の表面に付着
し、外装メッキの付着性が劣化される。したがって、タ
イバー６の幅は樹脂封止での射出圧力で変形されない幅
寸法が必要とされ、近年における表面実装式の半導体装
置において要求されるような、リード成形の精度を高め
るためにタイバーの幅を狭くしてモールドに極めて近い
位置に設けることが困難になる。The above-mentioned tie bar 6 is also used to prevent the resin from leaking to the outside during resin sealing. Therefore, when the width of the tie bar 6 is reduced, the tie bar is deformed by the injection pressure in the resin sealing step, and the resin leaks to the outside and adheres to the surface of the lead 5, thereby deteriorating the adhesion of the outer plating. Therefore, the width of the tie bar 6 is required to be a width that is not deformed by the injection pressure in the resin sealing, and the width of the tie bar 6 is increased in order to enhance the precision of lead molding, which is required in recent surface mount type semiconductor devices. And it is difficult to provide the position very close to the mold.
【０００４】又、タイバーの幅寸法が小さくできないこ
とにより、タイバーの切断荷重が大きくなり、かつ切断
取り数が少なくなり、これにより一貫生産ラインでのタ
イバー切断、加工洩れ検出が困難で、後工程での設備ジ
ャミング、稼働率低下、金型破損等の問題が生じてい
る。本考案の目的は、タイバーの幅を小さくすることを
可能にした半導体装置用リードフレームを提供すること
にある。In addition, since the width of the tie bar cannot be reduced, the cutting load of the tie bar is increased and the number of cuts is reduced. Problems such as equipment jamming, reduced operation rate, and mold breakage. SUMMARY OF THE INVENTION An object of the present invention is to provide a lead frame for a semiconductor device in which the width of a tie bar can be reduced.
【０００５】[0005]
【課題を解決するための手段】本考案は、タイバーはリ
ードとの接続箇所に形成される幅狭部と、前記リード間
の前記幅狭部に挟まれ、かつ前記アイランドと反対側の
辺に沿って形成した幅広部とを有し、前記幅広部は三角
形状に形成され、かつＴ型タイバーにより前記フレーム
部に接続されている構成とされる。According to the present invention, a tie bar has a narrow portion formed at a connecting portion with a lead, and a tie bar sandwiched between the narrow portion between the leads and opposite to the island. And a wide portion formed along the triangle.
The frame is formed in a shape and is formed by a T-shaped tie bar.
It is configured to be connected to the unit .
【０００６】[0006]
【実施例】次に、本考案について図面を参照して説明す
る。図１は本考案の参照例としての半導体装置用リード
フレームの平面図である。半導体ペレット１を搭載する
ためのアイランド２と、半導体ペレットに設けられた電
極部との間でボンディングワイヤ３を接続するためのス
テッチ４と、このステッチ４に連続されて外方に延びて
いるリード５と、このリード５をつないでいるタイバー
６と、これらをつないでおくフレーム部８とで構成され
ている。ここで前記タイバー６は細く形成する一方で、
リード５及びフレーム部８との接続箇所を除く部位、換
言すれば後工程での切断箇所を除く部位に、その幅寸法
を部分的に大きくした幅広部６ａを設けている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 is a plan view of a lead frame for a semiconductor device as a reference example of the present invention. An island 2 for mounting the semiconductor pellet 1, a stitch 4 for connecting a bonding wire 3 between an electrode portion provided on the semiconductor pellet, and a lead extending outward from the stitch 4 5, a tie bar 6 connecting the leads 5, and a frame portion 8 connecting these. Here, while the tie bar 6 is formed thin,
A wide portion 6a whose width dimension is partially increased is provided in a portion excluding a connection portion between the lead 5 and the frame portion 8, in other words, in a portion excluding a cut portion in a later process.
【０００７】このようにタイバーを構成すると、タイバ
ーの切断箇所を含む部分を細くしても、幅広部６ａによ
って全体の強度が高められる。このため、封入工程にて
溶融した樹脂がランナー及びゲート（図示せず）を通っ
て、封入金型（図示せず）のパッケージエリア７に注入
されるとき、タイバー６はプランジャによる射出圧力を
受けるが、幅広部６ａにより強度が増大されたことによ
って射出圧力によっても変形され難くなり、樹脂の洩れ
を防ぐこともできる。これにより、タイバーを細くして
タイバーの切断荷重を小さくし、或いは切断取り数を多
くして生産能力を向上する。又、モールドパッケージに
極力近い位置に細いタイバーを形成することが可能とな
り、ＳＯＰ等のリードの曲げ精度を向上することができ
る。When the tie bar is configured in this manner, the overall strength is increased by the wide portion 6a even if the portion including the cut portion of the tie bar is made thin. For this reason, when the resin melted in the encapsulating step is injected into the package area 7 of the encapsulating mold (not shown) through the runner and the gate (not shown), the tie bar 6 receives the injection pressure by the plunger. However, since the strength is increased by the wide portion 6a, it is difficult to be deformed even by the injection pressure, and it is possible to prevent the resin from leaking. As a result, the tie bar is made thinner to reduce the cutting load of the tie bar, or the number of cuts is increased to improve the production capacity. Further, a thin tie bar can be formed at a position as close as possible to the mold package, and the bending accuracy of a lead such as an SOP can be improved.
【０００８】図３は本考案にかかる実施例の平面図であ
り、図１と同一部分には同一符号を付してある。この実
施例では、強度タイバー６のリード５との接続箇所以外
の部分にフレーム部８につながるＴ型タイバー６Ａを新
たに設け、かつこのＴ型タイバー６Ａとの接続部分を三
角形状に形成して幅広部６ｂを設けている。この構成に
よれば、タイバー６にＴ型タイバー６Ａを連結し、かつ
この連結部分に幅広部６ｂを形成することで、タイバー
６の強度を更に向上でき、タイバー６を一層細くするこ
とが可能になる。FIG. 3 is a plan view of an embodiment according to the present invention , and the same parts as those in FIG. 1 are denoted by the same reference numerals. This fruit
In this embodiment, a new T-shaped tie bar 6A connected to the frame portion 8 is newly provided in a portion other than the connection portion of the strength tie bar 6 with the lead 5, and the connection portion with the T-shaped tie bar 6A is formed in a triangular shape to increase the width. A portion 6b is provided. According to this configuration, by connecting the T-shaped tie bar 6A to the tie bar 6 and forming the wide portion 6b at the connection portion, the strength of the tie bar 6 can be further improved, and the tie bar 6 can be made thinner. that Do not.
【０００９】[0009]
【考案の効果】以上説明したように本考案は、タイバー
の後工程での切断箇所は幅狭に形成され、この幅狭部以
外の部位に幅広部をアイランドと反対側の辺に沿って設
けているので、封入工程でのタイバー変形、樹脂洩れ等
の不具合が生じない程度にタイバー切断部を細くでき
る。これにより、タイバー切断荷重を小さくでき、或い
は切断取り数を多くとれるため、生産能力が向上され
る。又、タイバー切断部の幅が小さくできるため、モー
ルドに極めて近い位置にタイバーが設けられ、リード成
形時の精度向上ができる効果がある。さらに、モールド
樹脂において生じる樹脂のダムが異形状となることがな
く、容易に除去することが可能となる。また、前記幅広
部は三角形状に形成され、かつＴ型タイバーにより前記
フレーム部に接続されていることにより、構造が多少複
雑になるが、このＴ型タイバーによりタイバーの強度を
高める一方で、前記幅狭部の長さを大きくすることがで
き、タイバーを切断する際に切断刃が幅広部に干渉する
ことがなく、切断荷重の軽減と、切断刃の高寿命化が実
現できる。In the present invention as has been described above devised], the cutting portions in the subsequent steps of the tie bars is formed narrower, provided along a wide portion at a portion other than the narrow portion on the side opposite to the island As a result, it is possible to make the tie-bar cut portion thin enough to prevent problems such as tie-bar deformation and resin leakage in the encapsulation process. Thereby, the tie bar cutting load can be reduced or the number of cuts can be increased, so that the production capacity is improved. Further, since the width of the tie bar cutting portion can be reduced, the tie bar is provided at a position very close to the mold, and there is an effect that the precision at the time of lead molding can be improved. Further, the resin dam generated in the mold resin does not have an irregular shape, and can be easily removed. Also, the wide
The part is formed in a triangular shape, and said part is formed by a T-shaped tie bar.
The structure is somewhat complicated due to the connection to the frame.
Although it becomes complicated, the strength of the tie bar is increased by this T-shaped tie bar.
While increasing the length of the narrow portion.
When the tie bar is cut, the cutting blade does not interfere with the wide portion, thereby reducing the cutting load and extending the life of the cutting blade.
【図１】本考案のリードフレームの参照例の平面図であ
る。FIG. 1 is a plan view of a reference example of a lead frame of the present invention.
【図２】従来のリードフレームの平面図である。FIG. 2 is a plan view of a conventional lead frame.
【図３】本考案にかかる実施例の平面図である。3 is a plan view of such an embodiment of the present invention.
２ アイランド ４ ステッチ ５ リード ６ タイバー ６Ａ Ｔ型タイバー ６ａ，６ｂ 幅広部 ７ パッケージエリア ８ フレーム部 2 Island 4 Stitch 5 Lead 6 Tie bar 6A T-type tie bar 6a, 6b Wide part 7 Package area 8 Frame part
───────────────────────────────────────────────────── フロントページの続き (72)考案者 中川 広之 熊本県宇土郡不知火町大字長崎89 九州 電子株式会社内 (56)参考文献 特開 昭61−253844（ＪＰ，Ａ) 実開 昭61−81154（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 23/50 H01L 21/56 ──────────────────────────────────────────────────続 き Continuation of the front page (72) Hiroyuki Nakagawa 89 Hirosaki, Shiranui-cho, Uto-gun, Kumamoto Prefecture Inside Kyushu Electronics Co., Ltd. (56) References JP-A-61-253844 (JP, A) (JP, U) (58) Field surveyed (Int. Cl. 7 , DB name) H01L 23/50 H01L 21/56
Claims (1)
と、このアイランドに臨んで配列されるステッチと、こ
のステッチに連続されるリードと、前記リード相互及び
前記リードとフレーム部をつなぐタイバーとを備えるリ
ードフレームにおいて、前記タイバーは前記リードとの
接続箇所に形成される幅狭部と、前記リード間の前記幅
狭部に挟まれ、かつ前記アイランドと反対側の辺に沿っ
て形成した幅広部とを有し、前記幅広部は三角形状に形
成され、かつＴ型タイバーにより前記フレーム部に接続
されていることを特徴とする半導体装置用リードフレー
ム。1. A lead frame including an island on which a semiconductor pellet is mounted, stitches arranged facing the island, leads connected to the stitches, and tie bars connecting the leads to each other and the leads to a frame portion. , The tie bar has a narrow portion formed at a connection portion with the lead, and a wide portion sandwiched between the narrow portion between the leads and formed along a side opposite to the island. And the wide part has a triangular shape.
And connected to the frame by T-tie bar
A lead frame for a semiconductor device, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1992014454U JP2602570Y2 (en) | 1992-02-15 | 1992-02-15 | Lead frame for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1992014454U JP2602570Y2 (en) | 1992-02-15 | 1992-02-15 | Lead frame for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0567005U JPH0567005U (en) | 1993-09-03 |
| JP2602570Y2 true JP2602570Y2 (en) | 2000-01-17 |
Family
ID=11861494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1992014454U Expired - Lifetime JP2602570Y2 (en) | 1992-02-15 | 1992-02-15 | Lead frame for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2602570Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3782840B2 (en) | 1995-07-14 | 2006-06-07 | 株式会社ルネサステクノロジ | External storage device and memory access control method thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6181154U (en) * | 1984-10-31 | 1986-05-29 | ||
| JPS61134048U (en) * | 1985-02-09 | 1986-08-21 | ||
| JPS61253844A (en) * | 1985-05-02 | 1986-11-11 | Nec Kyushu Ltd | Lead frame for semiconductor device |
| JPH01201945A (en) * | 1988-02-05 | 1989-08-14 | Mitsubishi Electric Corp | Lead frame |
| JPH0297048A (en) * | 1988-10-03 | 1990-04-09 | Nec Kyushu Ltd | Lead frame |
-
1992
- 1992-02-15 JP JP1992014454U patent/JP2602570Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0567005U (en) | 1993-09-03 |
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