JP2772447B2 - Method for manufacturing optical semiconductor device - Google Patents

Abstract

PURPOSE:To prevent resin from leaking during resin injection and 3-dimensional wiring pattern from being damaged by forming a resin leakage preventing wall in an armor part of an insulating substrate and by pressing a pressing part of a molding die to the resin leakage preventing wall by the use of a spring. CONSTITUTION:An insulating substrate 1 is formed with a plurality of devices in series integrally and a 3-dimensional wiring pattern P is formed thereon. In the process, a resin leakage preventing wall is formed in an armor part of the insulating substrate 1 as thick as the 3-dimensional wiring pattern P. Then, resin is injected once from a runner part through a gate for a plurality of devices by using dies 10, 11 and then sealed to form a package 8 having a lens 6. In the process, pressing parts 10a, 11a of the dies 10, 11 are pressed floatably to the 3-dimensional wiring pattern P and the resin leakage preventing wall by a spring 14. Thereafter, dicing is performed by a dicing line to remove the runner part and the gate. Thereby, it is possible to prevent resin from leaking during resin injection.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a leadless type resin-sealed optical semiconductor device.

[0002]

2. Description of the Related Art As shown in FIG. 7, a conventional surface mount device (hereinafter referred to as SMD) in a leadless type optical semiconductor device has a resin insulation having a through hole S (through hole) for forming an electrode. A three-dimensional wiring pattern P having a header part 3 for mounting an optical semiconductor element 2 (photoelectric conversion element) on a substrate 1 and a connection part 4 electrically connected to the electrodes of the optical semiconductor element 2 by wire bonding is formed by three-dimensional wiring. The pattern is formed. As a material of the insulating substrate 1,
Glass epoxy resin or the like is used.

The optical semiconductor device 2 shown in FIG. 7 is die-bonded with a conductive paste to a header portion 3 laminated on an insulating substrate 1, and furthermore, the optical semiconductor device 2 is bonded to a connection portion 4 and a gold wire or the like. The wires 5 are connected.

[0004] The optical semiconductor element 2 is, as shown in FIG.
Using a translucent resin, resin sealing is performed by a transfer molding method, and the lens 6 is provided. As a method of transfer molding, as shown in FIG. 8, a runner portion 7 is provided in a portion other than a portion to be a package 8, a resin is injected from the runner portion 7 through a gate 9, and the resin is sealed. Then, dicing is performed at a dicing line D to remove the gate 9 to manufacture a single SMD optical semiconductor device (see FIGS. 2 and 3).

FIGS. 9 to 11 show molding dies 10 and 11.
FIG. 3 is a view showing a state in which resin sealing is performed by using FIG. In FIG.
10a and 11a are holding portions of the molding dies 10 and 11;
Denotes a resin inlet, and 13 denotes a plunge (piston).

[0006]

In the conventional method of manufacturing an optical semiconductor device, when performing transfer molding, as shown in FIGS. 9 and 10, the insulating substrate 1 is clamped and molded by molding dies 10 and 11. As shown in FIG.

Here, the three-dimensional wiring pattern P on the insulating substrate 1 has a thickness of about 20 μm on one side.
A gap d (FIG. 9) is generated between the mold and the molding dies 10, 11. In order to prevent the resin from leaking from the gap d, the gap d must be closed even if the three-dimensional wiring pattern P is crushed by the mold dies 10 and 11. For this reason, a phenomenon occurs when the three-dimensional wiring pattern P is cut at the boundary between the regions where the molding dies 10 and 11 are applied and the region to be sealed with resin.

As another method, there is a method of clamping a metal lead frame with a molding die. in this case,
The thickness tolerance of metal lead frames is generally small. On the other hand, when the insulating substrate 1 as shown in FIGS. 9 and 10 is used, there is an advantage that the entire optical semiconductor device can be reduced in size. And become big.

For this reason, taking into account the state where the thickness tolerance of the insulating substrate 1 is the smallest, the pressing portions 10 of the molding dies 10 and 11 are considered.
When the thickness dimensions of a and 11a are determined, as described above, when the insulating substrate 1 is thicker than this design dimension, the three-dimensional wiring pattern P is completely cut, which is a cause of defective products.

Conversely, in order to prevent this phenomenon, taking into account the state where the thickness tolerance of the insulating substrate 1 is the largest, the holding portion 10
It is also possible to reduce the pressing pressure of the molding dies 10 and 11 by determining the thickness dimensions of a and 11a. However, in this case, the gap d between the substrate 1 and the mold becomes large, and the resin leaks from the gap d, so that the resin cost cannot be saved, and the resin protrudes from the molding dies 10, 11 to form the resin. Because of the irregular shape, there was a drawback when it took time to handle.

SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a method of manufacturing an optical semiconductor device that does not cause resin leakage during molding, reduces damage to a three-dimensional wiring pattern on an insulating substrate, and improves quality. Aim.

[0012]

According to the first aspect of the present invention, as shown in FIG. 1, a three-dimensional wiring pattern P is provided on an insulating substrate 1 and a plurality of optical semiconductor elements 2 are provided on the three-dimensional wiring pattern P. Manufacturing of an optical semiconductor device in which a plurality of optical semiconductor elements 2 are molded with a translucent resin while mounting the insulating substrate 1 with the holding portions 10a and 11a of the molding dies 10 and 11 to form a plurality of packages 8. In the method, a resin leakage preventing wall 21 is formed on the outer peripheral portion of the insulating substrate 1 to have the same thickness as the three-dimensional wiring pattern P, and at least one holding portion 10a of the molding dies 10, 11 is made freely movable. The portion 10a is pressed by the spring 14 against the three-dimensional wiring pattern P and the resin leakage prevention wall 21, and the adhesion between the holding portion 10a and the resin leakage prevention wall 21 prevents resin leakage during resin injection. .

According to a second aspect of the present invention, the resin leakage preventing wall 21 according to the first aspect is formed by using the same material as the three-dimensional wiring pattern P at the same time.

[0014]

According to the first aspect of the present invention, the pressing portions 10a, 1 of the molding dies 10, 11 are formed during resin molding.
When the insulating substrate 1 is pressed by 1a, the pressing portion 10a is freely movable with respect to the molding dies 10, 11, so that the spring 14
Thereby, the pressure applied to the insulating substrate 1 and the three-dimensional wiring pattern P can be appropriately adjusted.

In this case, even if the resin leaks from the gap d between the holding portion 10a and the insulating substrate 1 at the time of injecting the resin into the portion where the three-dimensional wiring pattern P on the insulating substrate 1 is not arranged, Since the leak prevention wall 21 and the holding portion 10a are in close contact with each other, the flow of the resin can be stopped.

According to the second aspect, the resin leakage preventing wall 21 on the insulating substrate 1 is simultaneously formed using the same material as the three-dimensional wiring pattern P to prevent an increase in the number of steps due to the addition of members.

[0017]

FIG. 1 is a structural conceptual view of a molding die used in one embodiment of the present invention, FIG. 2 is a plan view showing a completed state of an optical semiconductor device, FIG. 3 is a sectional view taken along line AA of FIG. FIG. 4 is BB of FIG.
FIG. 5 is a plan view showing a three-dimensional wiring pattern and a resin leakage preventing wall on the insulating substrate, and FIG. 6 is a sectional view of the insulating substrate. Note that members having the same functions as those in the related art are denoted by the same reference numerals.

The optical semiconductor device of this embodiment is a leadless type surface mount device (hereinafter referred to as SMD).
As shown in FIGS. 2 to 4, a three-dimensional wiring pattern P is formed on the upper surface of an insulating substrate 1 made of a glass epoxy resin or the like by a plating method or a metal vapor deposition method. Is mounted, a bonding wire 5 is connected between the electrode of the optical semiconductor element 2 and the connection portion 4 of the three-dimensional wiring pattern P, and is further sealed with a resin using a translucent resin by a transfer molding method. 6 is formed.

The mold used in this embodiment is shown in FIG.
As shown in the figure, the upper die 10 and the lower die 11 have pressing portions 10a and 11a which can be pressed by the plunge 13. And the holding part 10a of the upper metal mold 10 is
The upper mold body 10b is freely movable up and down in a storage chamber 10c, and is urged downward by a spring 14.

The SMD optical semiconductor device is manufactured as follows.

First, as shown in FIG. 5 or FIG. 6, the insulating substrate 1 is formed in a state where a plurality of devices are integrally connected, and a three-dimensional wiring pattern P is formed on the upper surface thereof. At this time, as shown in FIG. 5, a resin leakage preventing wall 21 is formed in the outer peripheral portion of the insulating substrate 1 to have the same thickness as the three-dimensional wiring pattern P.

Next, as shown in FIG. 8, resin is injected at once from the runner portion 7 through the gate 9 to seal the lens 6 by using the molds 10 and 11.
Is formed.

At this time, as shown in FIG. 1, the pressing portions 10a and 11a of the dies 10 and 11 are movably pressed against the three-dimensional wiring pattern P and the resin leakage preventing wall 21 by the spring 14.

Then, regardless of the thickness of the substrate 1, the holding portions 10a, 11a and the resin leakage preventing
Can be surely brought into close contact with each other, and leakage of resin to the outside during resin injection can be prevented.

Further, by providing the resin leakage preventing wall 21, even if air and resin in the package 8 escape from the gap d shown in FIG. 9, resin leakage can be prevented. There is no need to process recesses (air vents), processing of molding dies is easy, and low capital investment is required.

Thereafter, in order to remove the runner portion 7 and the gate 9, dicing is performed at a dicing line D, and FIG.
As shown in (1) to (3), a single SMD optical semiconductor device is completed.

It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that many modifications and changes can be made to the above-described embodiment within the scope of the present invention.

For example, in the above embodiment, the upper mold 10
Although the spring 14 is provided on the holding portion 10a of the mold 11, the spring 14 may be provided on the holding portion 11a of the lower mold 11, and the pressing may be performed from below.

[0029]

As is apparent from the above description, according to the first aspect of the present invention, the resin leakage preventing wall is formed on the outer peripheral portion of the insulating substrate, and the pressing portion of the molding die is formed on the resin leakage preventing wall by the spring. Since the pressing is performed, it is possible to prevent the resin from leaking at the time of injecting the resin due to the adhesion between the pressing portion and the resin leakage preventing wall.

Therefore, regardless of the thickness of the substrate, the pressing portion and the resin leakage preventing wall can be securely brought into close contact with each other, and the resin injection can be performed without damaging the three-dimensional wiring pattern and impairing the reliability. In addition, it is possible to prevent the resin from leaking to the outside at the time, thereby reducing the cost, and at the same time, the shape can be fixed and the handling can be facilitated.

According to the second aspect of the present invention, since the resin leakage preventing wall is formed simultaneously with the three-dimensional wiring pattern by using the same material, it is possible to prevent an increase in the number of working steps due to the provision of new members. effective.

[Brief description of the drawings]

FIG. 1 is a schematic structural view of a molding die used in one embodiment of the present invention.

FIG. 2 is a plan view showing a completed state of the optical semiconductor element.

FIG. 3 is a sectional view taken along line AA of FIG. 2;

FIG. 4 is a sectional view taken along line BB of FIG. 2;

FIG. 5 is a plan view showing a three-dimensional wiring pattern and a resin leakage prevention wall on an insulating substrate.

FIG. 6 is a sectional view of an insulating substrate.

FIG. 7 is a partial plan view showing a three-dimensional wiring pattern on an insulating substrate;

FIG. 8 is a partial plan view showing a resin-sealed state of the optical semiconductor element.

9 is a sectional view taken along the line CC in FIG.

FIG. 10 is a sectional view taken along line DD of FIG. 8;

FIG. 11 is a structural conceptual view of a molding die used conventionally.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 insulating substrate 2 optical semiconductor element 8 package 10, 11 molding die 10 a, 11 a holding part 14 spring 21 resin leakage prevention wall P three-dimensional wiring pattern

Claims (2)

(57) [Claims] 1. A three-dimensional wiring pattern is provided on an insulating substrate, a plurality of optical semiconductor elements are mounted on the three-dimensional wiring pattern, and the plurality of optical semiconductor elements are translucent while holding the insulating substrate with a pressing part of a molding die. In a method of manufacturing an optical semiconductor device, wherein a plurality of packages are formed by molding with a resin, a resin leakage prevention wall is formed on an outer portion of the insulating substrate to have the same thickness as a three-dimensional wiring pattern, and at least one of the molding dies is formed. The holding part is freely movable, and the holding part is pressed against the three-dimensional wiring pattern and the resin leakage prevention wall by a spring, and the resin is prevented from leaking at the time of injecting the resin by the adhesion between the holding part and the resin leakage prevention wall. A method for manufacturing an optical semiconductor device, comprising: 2. The method of manufacturing an optical semiconductor device according to claim 1, wherein the resin leakage prevention wall according to claim 1 is formed simultaneously with the three-dimensional wiring pattern using the same material.