JP2616685B2 - Method for manufacturing resin-encapsulated semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a resin-sealed semiconductor device, and more particularly to a method for manufacturing a resin-sealed semiconductor device.

[0002]

2. Description of the Related Art A conventional resin sealing method for a resin-sealed semiconductor device will be described with reference to the drawings. FIG. 4 is a sectional view showing the relationship between the lead frame (1), the resin sealing mold (3), and the resin injection gate runner (4), and FIG. 5 is a perspective view showing the state of the lead frame after resin sealing. . In a conventional resin sealing method for a resin-encapsulated semiconductor device, a lead frame (1) is used.
The resin is injected along the frame portion, and the resin injection gate runner (4) which becomes unnecessary after the resin is cured is removed from the lead frame (1). At this time, the resin injection gate runner (4) is located on the external lead frame (1) because the resin is filled between the leads when it is applied to the external leads (6) and it is difficult to remove the resin. The part (7) where the part (6) is not located is designed.

[0003]

In this conventional method of manufacturing a resin-encapsulated semiconductor device, the resin in the resin-injection gate runner portion, which becomes unnecessary after resin encapsulation, adheres well to the lead frame, and the external force is reduced. In addition, there is a problem that the lead frame is easily deformed when being removed. In the case of a semiconductor device using a chip carrier tape or a circuit element formed of an insulating plate and a conductive foil instead of a lead frame, the resin of the resin injection gate runner portion and the chip carrier tape, or the insulating plate and the conductive plate The adhesion to the circuit element formed of foil was even stronger, and it was extremely difficult to remove the resin from the resin injection gate runner. In addition, the position and size of the resin injection gate are largely limited due to the necessity of avoiding the external lead portion as described above, and there is a problem that the resin injection gate cannot be freely designed so that the resin sealing property is optimal.

[0004]

SUMMARY OF THE INVENTION The present invention is to solve the above-mentioned problems, and in a resin-sealed semiconductor device, a plate-shaped semiconductor device having a frame shape having the same size as an outer edge of a predetermined resin-sealed region. A step of resin-sealing the jig between a lead frame and a resin-sealing mold having a resin injection gate runner provided on external leads of the lead frame; and And a step of separating the lead frame from the lead frame.The method for manufacturing a resin-encapsulated semiconductor device, further comprising a chip carrier tape or a circuit element formed of an insulating plate and a conductive foil. In another preferred embodiment, the semiconductor device uses a circuit element formed of a chip carrier tape or an insulating plate and a conductive foil.

[0005]

In the method of manufacturing a resin-encapsulated semiconductor device according to the present invention, a jig having a frame shape of the same size as the outer edge of a predetermined resin-encapsulation region is sealed with a resin having a lead frame and a resin injection gate runner portion. It includes a step of sealing the resin in a state sandwiched between the mold and a step of separating the jig from the lead frame after the resin is cured. And there is no problem such as deformation of the lead frame when removing the resin.

[0006]

Next, an embodiment of the present invention will be described with reference to the drawings.

Embodiment 1 FIG. 1A is a perspective view showing the relationship between a lead frame (1) and a jig (2) according to an embodiment of the present invention. Note that, for convenience of explanation, internal leads, semiconductor elements, and the like formed in the lead frame (1) are omitted. FIGS. 2B to 2E are cross-sectional views sequentially showing the steps from the resin sealing step to the removal of the resin injection gate runner. In resin sealing of this semiconductor device, a plate-shaped jig (2) having a frame shape of the same size as the outer edge of a predetermined resin sealing region (5) was used, and this was overlapped with the lead frame (1). Resin sealing is performed in this state (FIG. 2B). After the resin is cured, the resin is taken out of the mold (FIG. 2C), and the resin in the resin injection gate runner (4) is removed from the jig (2) (FIG. 2).
(D)) Further, the jig (2) is removed from the lead frame (1) (FIG. 2 (e)), and a series of steps is completed.

Here, the jig (2) may be subjected to a surface treatment such as Ag plating in order to reduce the adhesion to the sealing resin. The jig (2) having a thickness of about 0.1 mm does not impair the appearance of the product. Also, by incorporating the jig (2) into the apparatus as a mechanical component of the resin sealing mold (3), continuous work is possible and effective. The above-described method is the same when a circuit element formed of a chip carrier tape or an insulating plate and a conductive foil is used instead of the lead frame. Usually, since the chip carrier tape or the circuit element has extremely low strength, the effect of the present invention is remarkable.

[0008]

Embodiment 2 Next, FIG. 3 is a perspective view showing a state after resin sealing according to a second embodiment of the present invention. In this embodiment, a series of steps are performed as in the first embodiment, but the size of the resin injection gate runner (4) is designed to be larger than in the past.
In the present embodiment, the size and position of the resin injection gate runner section (4) are optimally designed to optimize the resin sealing property, since the position of the resin injection gate runner, which is a feature of the present invention, is not restricted. Becomes possible. As a result, it is possible to reduce the resin sealing failure which has conventionally occurred at a rate of 2 to 3% by half.

[0009]

As described above, according to the present invention,
Since a jig having a frame shape of the same size as the outer edge of the resin sealing area is overlapped with the lead frame and sealed with resin, the resin in the resin injection gate runner portion is formed on the jig and the resin is removed. In doing so, there is no problem such as deformation of the lead frame. In particular, when a circuit element formed of a chip carrier tape or an insulating plate and a conductive foil having extremely low strength is used instead of the lead frame, the effect is remarkably high. Further, according to the present invention, since the position and size of the resin injection gate runner can be freely designed, there is an effect that the resin sealing property can be optimized.
Through these processes, it is possible to halve the defect rate of several percent, which has conventionally occurred in the resin sealing step and the resin removing step of the resin in the resin injection gate runner portion.

[Brief description of the drawings]

FIG. 1A is a perspective view showing a relationship between a lead frame and a jig according to one embodiment of the present invention.

FIGS. 2B to 2E are cross-sectional views showing steps from resin sealing to removal of a resin injection gate runner portion.

FIG. 3 is a perspective view of a state after resin sealing according to a second embodiment of the present invention as viewed from the back surface of a lead frame.

FIG. 4 is a cross-sectional view showing a relationship between a lead frame, a resin sealing mold, and a resin injection gate runner in a conventional resin sealing method.

FIG. 5 is a perspective view of a state after resin sealing as viewed from the back surface of a lead frame by a conventional resin sealing method.

[Explanation of symbols]

 1, lead frame 2, jig 3, resin sealing mold 4, resin injection gate runner 5, resin sealing region 6, external lead

Claims (2)

(57) [Claims] 1. A semiconductor device sealed with a resin,
A plate-shaped jig having a frame shape of the same size as the outer edge of a predetermined resin sealing area is placed between a lead frame and a resin sealing mold having a resin injection gate runner provided on an external lead of the lead frame. A method for manufacturing a resin-encapsulated semiconductor device, comprising: a step of encapsulating a resin while sandwiching the resin; and a step of separating the jig from the lead frame after the resin is cured. 2. The method according to claim 1, wherein the semiconductor device uses a circuit element formed of a chip carrier tape or an insulating plate and a conductive foil.