JPH0722561A - Semiconductor device lead frame and manufacture of semiconductor device employing lead frame - Google Patents

Abstract

PURPOSE:To eliminate resin flashes produced on the outer edge of the part of an outer frame which touches a resin casting path by a method wherein the width of a chamfer so formed on the outer edge as to have the thickness of its cross-section reduced gradually toward the upstream side of the resin casting direction is larger than the width of the resin casting path. CONSTITUTION:A lead frame 3 to which a semiconductor chip 2 is attached is placed inside a lower mold 10 and, in that state, held between the lower mold 10 and an upper mold 11. At that time, the lead frame 3 is so placed as to have its outer frame 5 fitted to a recess 22 formed along the outer circumference of the cavity 12 of the lower mold 10. A chamfer is so formed on the outer edge 5' of the upstream side of the resin casting direction of the part of the outer frame 5 which touches a resin casting path as to have the thickness of its cross-section reduced gradually toward the upstream side of the resin casting direction. The width of the chamfer is larger than the width of the resin casting path. With this chamfer, cured resin can be removed without being left on the outer edge 5'.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame used for a resin-sealed semiconductor device and a method for manufacturing a semiconductor device using the same.

[0002]

2. Description of the Related Art Conventionally, this type of resin-encapsulated semiconductor device is generally manufactured as follows. That is,
The resin-sealed semiconductor device is manufactured by mounting a semiconductor element on a lead frame and sealing the lead frame on which the semiconductor element is mounted with resin. In the resin-encapsulated semiconductor device 100, as shown in FIG. 10, each electrode of the semiconductor element 103 and the lead 104 are illustrated with the semiconductor element 103 placed on the tab 102 of the lead frame 101. Do not connect to each other by wire bonding.

Then, the lead frame 101 to which the semiconductor element 103 is attached is sandwiched by a lower mold die 105 and an upper mold die 106, as shown in FIG. At this time, the lead frame 101 is arranged with its outer frame 107 fitted in a recess 109 formed on the outer periphery of the cavity 108 of the lower molding die 105. This recess 109 is formed by the lead frame 101. Outer frame 1
When sandwiching 07, upper and lower mold dies 105, 1
In order to prevent a gap from being generated between the lead frames 101 and to allow the lead frame 101 to be completely sandwiched without being lifted, the depth D is equal to the thickness T of the lead frame 101.
It is set shallower. Therefore, the lead frame 101 is provided in the recess 109 of the lower mold dies 105 and 106.
With the outer frame 107 of the lead frame 101 fitted.
An outer edge 107 ′ of the outer frame 107 is partially projected from the parting surface of the lower molding die 105 as shown in FIG. 11.

As described above, the lead frame 101 to which the semiconductor element 103 is attached is attached to the upper and lower molding dies 10.
FIG. 10 and FIG.
As shown in FIG. 11, a resin 112 for encapsulation is provided on the upper molding die 106 through a runner portion 110 and a gate portion 111 formed so as to extend over the outer frame 107 of the lead frame 101, as shown in FIG. Upper and lower mold 105,
It is injected and filled into the cavity 108 formed between 106. At that time, the air in the cavity 108 is removed to the outside from the air bend portion 113 provided in the upper molding die 106, and air is removed. Next, the resin 112
After curing, the upper and lower molding dies 105 and 106 are opened, and the resin 112a of the cavity 108 integrated with the lead frame 101 and the resins 112b and 112c of the runner 110 and the gate 111 are molded together.
It is taken out from 05 and 106. Finally, as shown in FIG. 12, the lead frame 101 is filled with the resin 112 which is filled and cured in the unnecessary runner portion 110 and the gate portion 111.
Then, the resin encapsulation portion 115 of the semiconductor device 100 is formed.

[0005]

However, the above-mentioned prior art has the following problems. That is, in the conventional resin-encapsulated semiconductor device 100 described above, resin encapsulation is performed with the lead frame 101 sandwiched between the upper and lower molds 105 and 106, but the upper and lower molds 105 and 106 are opened. When removing the resin-sealed lead frame 101, the lead frame 101
Together with the resin 112a of the cavity portion 108 integrated with the runner portion 110 and the gate portion 1 of the molding die 106.
Unnecessary cured resin 112b, 11 for the portion corresponding to 11
2c remains. Therefore, it is necessary to mechanically remove the cured resins 112b and 112c remaining in the runner portion 110 and the gate portion 111 of the molding die 106, but the runner portion 110 of the molding die 106 is not shown in FIG.
As shown in FIG. 3, since the resin 112b is formed so as to extend over the outer frame 107 of the lead frame 101, the resin 112b that cures at the runner portion 110 of the molding die 106 adheres to the outer edge 107 ′ of the outer frame 107 of the lead frame 101. It cures in the condition. Therefore, when the cured resin 112b remaining on the runner portion 110 of the molding die 106 is mechanically removed, as shown in FIGS. 12 and 13, it is cured to the edge of the outer edge 107 ′ of the lead frame outer frame 107. Resin 1
16 is caught, and the cured resin 116 remains as burr.

By the way, as shown in FIG. 14, the lead frame 101 after resin sealing has a guide rail 12
While being held by 0 and 121, the process proceeds to the next lead trimming and lead forming steps, etc., but the outer edge 107 ′ of the outer frame 107 of the lead frame 101 comes into contact with the guide rail 120 when the lead frame 101 is transported. Therefore, the outer edge 10 of the lead frame outer frame 107
When the lead frame 101 is conveyed to the next step, the resin burr 116 attached to 7'may come into contact with the guide rail 120 or the like and fall off into the manufacturing apparatus. Adhesion to the parting surface of the forming die may lead to vertical trimming and clamp failure of the forming mold die, damage to the trimming and forming die, and adhesion to other parts to cause poor conveyance of the lead frame 101. There was a problem.

Therefore, the present invention has been made in order to solve the above-mentioned problems of the prior art, and its object is to mold the resin of the molding die in the outer frame of the lead frame in the resin sealing step. It is possible to prevent the occurrence of resin burr on the outer edge portion that contacts the injection path, or even if resin burr occurs on the outer frame of the lead frame,
An object of the present invention is to provide a lead frame for a semiconductor device capable of preventing the occurrence of inconvenience due to a resin burr attached to the outer frame of the lead frame, and a semiconductor device manufacturing method using the same.

[0008]

That is, the invention according to claim 1 is a lead frame for a semiconductor device which is sandwiched between a pair of molding dies and resin-sealed, and an outer frame of the lead frame. Of these, the outer edge of the outer frame in contact with the resin injection path of the molding die on the upstream side in the resin injection direction, a chamfer having a cross-sectional shape formed so that the thickness becomes thinner toward the upstream side in the resin injection direction, It is configured to be formed wider than the width of the resin injection path.

According to the second aspect of the present invention, the resin injection path, the cavity corresponding to the resin sealing portion of the semiconductor device, and the thickness of the lead frame for arranging the lead frame in a fitted state are more preferable. A pair of molding dies having a shallow recess on one of its parting surfaces is used, and a lead frame is sandwiched between the pair of molding dies while being fitted in the recess, and the semiconductor device is inserted from the resin injection path. In a method of manufacturing a semiconductor device by injecting and curing a resin into a cavity corresponding to a resin sealing portion, an outer frame of the outer frame of the lead frame, which is in contact with a resin injection path of the molding die, is upstream in a resin injection direction. A lead frame with a chamfer whose cross-sectional shape is formed so as to become thinner toward the upstream side in the resin injection direction at the outer edge of the side is formed wider than the width of the resin injection path. After performing resin sealing with this lead frame sandwiched between a pair of molding dies, the resin of the molding dies is removed with the resin-sealed lead frame taken out from the pair of molding dies. The resin cured in the injection path can be integrally removed by chamfering formed on the outer edge of the outer frame of the lead frame without being left on the outer edge of the outer frame of the lead frame. It is a manufacturing method.

Further, according to a third aspect of the present invention, in a lead frame for a semiconductor device which is sandwiched between a pair of molding dies and resin-sealed, the molding metal is included in an outer frame of the lead frame. For a semiconductor device, characterized in that a notch toward the downstream side in the resin injection direction is formed wider than the width of the resin injection path at the outer edge of the outer frame in contact with the resin injection path of the mold on the upstream side in the resin injection direction. It is a lead frame.

Further, according to a fourth aspect of the present invention, the resin injection path, the cavity corresponding to the resin sealing portion of the semiconductor device, and the thickness of the lead frame for arranging the lead frame in a fitted state are more preferable. A pair of molding dies having a shallow recess on one of its parting surfaces is used, and a lead frame is sandwiched between the pair of molding dies while being fitted in the recess, and the semiconductor device is inserted from the resin injection path. In a method of manufacturing a semiconductor device by injecting and curing a resin into a cavity corresponding to a resin sealing portion, an outer frame of the outer frame of the lead frame, which is in contact with a resin injection path of the molding die, is upstream in a resin injection direction. A lead frame having a notch toward the downstream side in the resin injection direction wider than the width of the resin injection path is used on the outer edge of the side. After resin encapsulation while sandwiched between the molds, remove the cured resin in the resin injection path of the mold with the resin-sealed lead frame taken out from the pair of molds. In this case, the cured resin is left in the notch formed in the outer edge of the outer frame of the lead frame.

[0012]

In the lead frame for a semiconductor device according to claim 1 of the present invention, an outer edge of the outer frame of the lead frame, which is in contact with the resin injection path of the molding die, is located on the upstream side in the resin injection direction. Since the chamfer whose cross-sectional shape is formed so as to become thinner toward the upstream side in the resin injection direction is formed to be wider than the width of the resin injection path, this lead frame is After performing resin sealing with the resin sandwiched between the molding dies, remove the resin-sealed lead frame from the pair of molding dies, and set the cured resin in the resin injection path of the molding dies. The chamfering formed on the outer edge of the outer frame of the lead frame allows the lead frame to be integrally removed without being left on the outer edge of the outer frame.

Further, in the lead frame for a semiconductor device according to claim 3 of the present invention, the outer frame of the outer frame of the lead frame, which is in contact with the resin injection path of the molding die, is located on the upstream side in the resin injection direction. Since the notch facing the downstream side in the resin injection direction is formed on the outer edge so as to be wider than the width of the resin injection path, the lead frame is sandwiched between the pair of molding dies and the resin. When the resin-sealed lead frame is taken out from the pair of molding dies after sealing, the outer frame of the lead frame is used to remove the cured resin in the resin injection path of the molding dies. The cured resin remains in the notch formed on the outer edge of the lead frame. This notch is located on the upstream side of the outer frame of the lead frame, which is in contact with the resin injection path of the molding die, in the resin injection direction. Since the outer edge is formed toward the downstream side in the resin injection direction, the cured resin remaining in the notch does not come into contact with the guide rail for carrying the lead frame, etc. It is possible to prevent inconvenience from occurring due to the resin burr attached to the frame.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to illustrated embodiments.

FIG. 2 shows an embodiment of a resin-sealed semiconductor device to which the semiconductor device lead frame according to the present invention is applied.

In FIG. 2, reference numeral 1 denotes a semiconductor device, which is formed by sealing a lead frame 3 to which a semiconductor element 2 is attached with a synthetic resin 4. As the lead frame 3, a plurality of lead frames 3 corresponding to the plurality of semiconductor devices 1 are continuously connected in a strip shape so that the plurality of semiconductor devices 1 can be manufactured in series.

As shown in FIG. 1, the lead frame 3 has wide outer frames 5 and 5 arranged on both sides thereof in parallel with each other, and these outer frames 5 and 5 are connected to each other to form one lead frame 3. Dams 6, 6 partitioning a region corresponding to the semiconductor device 1.
A tab 7 having a square shape in a plane for mounting the semiconductor element 2 arranged in the center, and a plurality of leads 8 connected to each other by an electrode of the semiconductor element 2 by wire bonding (not shown) I have it.

In the lead frame 3, the semiconductor element 2 is placed on the tab 7 formed in the central portion thereof, and the electrode of the semiconductor element 2 extends to the periphery of the tab 7 of the lead frame 3. The plurality of leads 8 are also connected to each other by wire bonding (not shown).

Thus, the lead frame 3 to which the semiconductor element 2 is attached is sandwiched between the lower mold die 10 and the upper mold die 11 as shown in FIG. Cavity 12 formed in
Then, the synthetic resin 15 for sealing is injected and cured through the runner portion 13 and the gate portion 14 as the resin injection path provided in the upper mold 11 to form the resin sealing portion 16. To be done.

By the way, in this embodiment, at the outer end of the outer frame of the lead frame, which faces the resin injection path of the upper molding die, a chamfered portion which becomes thinner toward the outer side of the lead frame. Is formed to be wider than the runner portion of the molding die.

That is, the outer frame 5 of the lead frame 3
As shown in FIGS. 1 and 4, the outer end 5 ′ of the chamfered portion 2 is provided at a portion facing the runner portion 13 of the upper molding die 11.
0 is provided. The chamfered portion 20 is formed to be thin toward the outside of the lead frame 3,
Moreover, the width b is formed wider than the width a of the runner portion 13 of the molding die 11. The chamfered portion 20 is formed by etching, pressing, or the like when manufacturing the lead frame 3.

In the above structure, the resin-sealed semiconductor device according to this embodiment is manufactured as follows using the lead frame structured as described above. First,
The lead frame 3 to which the semiconductor element 2 is attached is shown in FIG.
As shown in FIG. 2, the lower mold die 10 is sandwiched between the lower mold die 10 and the upper mold die 11 while being arranged inside the lower mold die 10. At that time, the lead frame 3 is arranged with the outer frame 5 thereof fitted in the recess 22 formed in the outer periphery of the cavity 12 of the lower molding die 10. The recess 22 prevents the clearance between the upper and lower molding dies 10 and 11 when the outer frame 5 of the lead frame 3 is clamped, and the lead frame 3 is completely clamped without rising. In order to make it possible, the depth is set to be slightly shallower than the thickness of the lead frame 3. Therefore, with the outer frame 5 of the lead frame 3 fitted in the recess 22 of the lower mold 10, the outer edge 5'of the outer frame 5 of the lead frame 3 is partially undermolded as shown in FIG. It is designed to project from the 10 parting surface.

The lead frame 3 to which the semiconductor element 2 is attached as described above is provided with the upper and lower molding dies 10,
It is arranged in a state of being sandwiched by 11, and inside the cavity 12 formed between the upper and lower mold dies 10, 11,
As shown in FIG. 3, the upper molding die 11 is filled with a synthetic resin 15 for sealing through a runner portion 13 and a gate portion 14 formed so as to extend over the outer frame 5 of the lead frame 3. . At that time, the air in the cavity 12 is
The air is removed from the air bend portion 23 provided in the upper molding die 11 to the outside. Next, after the resin 15 is cured, the upper and lower mold dies 10 and 11 are opened,
The resin 15a of the cavity portion 12 integrated with the lead frame 3, the resin 15b of the runner portion 13 and the gate portion 14,
15c is taken out from the molding dies 10 and 11. Then, finally, the unnecessary resin 15b, 15c filled and cured in the runner portion 13 and the gate portion 14 is mechanically removed from the surface of the lead frame 3 as shown in FIGS. Thus, the resin portion 16 of the semiconductor device 1 is formed.

At this time, as shown in FIG. 4, the upper mold 1 is attached to the outer end 5'of the outer frame 5 of the lead frame 3.
The chamfered portion 20 is provided in the portion facing the runner portion 13. Therefore, the cured resins 15b and 15c remaining in the portion of the molding die 11 corresponding to the runner portion 13 and the like.
The outer frame 5 of the lead frame 3 when mechanically removing the
The resin 15b cured at the outer edge 5'of the lead frame 3 is removed from the chamfered portion 20 and the resin 15b cured at the runner portion 13 without being caught by the outer edge 5'of the outer frame 5. Cured resin 1 on the outer edge 5'of the outer frame 5
It is possible to reliably prevent 5b from remaining as burr.

By the way, as shown in FIG. 7, the lead frame 5 after resin sealing is carried to the next lead trimming and forming steps while being held by the guide rails 30 and 31. Lead frame 3
No resin burr is attached to the outer edge 5'of the outer frame 5. Therefore, when the lead frame 3 is conveyed to the next step, the resin burr attached to the outer edge 5 ′ of the lead frame outer frame 5 comes into contact with the guide rail 30 or the like and drops into the manufacturing apparatus. Adheres to the parting surface of the upper and lower trimming and forming dies, for example, resulting in defective clamping of the upper and lower trimming and forming dies, damage to the trimming and forming dies, and poor conveyance of the lead frame 3 due to attachment to other parts. It is possible to reliably prevent the occurrence of such problems.

As described above, in the lead frame for a semiconductor device according to the above-mentioned embodiment, the outer frame of the lead frame, which is in contact with the resin injection path of the molding die, has an outer edge on the upstream side in the resin injection direction, Since the chamfer having the cross-sectional shape is formed so that the thickness becomes thinner toward the upstream side in the resin injection direction, the lead frame is sandwiched between the pair of molding dies and the resin sealing is performed. After stopping, the resin-sealed lead frame is taken out from the pair of molding dies, and the resin cured in the resin injection path of the molding dies is formed on the outer edge of the outer frame of the lead frame. By chamfering, the lead frame can be integrally removed without being left on the outer edge of the outer frame.

FIG. 8 shows another embodiment of the present invention. The same parts as those of the above embodiment are designated by the same reference numerals. In this embodiment, the outer side of the outer frame of the lead frame is shown. At the end that faces the resin injection path of the upper mold, a notch part facing the inside of the lead frame is formed wider than the runner part of the mold, and the outer end of this notch part The chamfered portion is formed so as to become thinner toward the outside of the lead frame.

That is, the outer frame 5 of the lead frame 3
As shown in FIG. 8, a notch 40 is provided on the outer end 5 ′ of the upper mold die 11 facing the runner portion 13, and the notch 40 has a width b. It is formed wider than the width a of the runner portion 13 of the molding die 11. Further, the cutout portion 40 is formed so as to be inclined with respect to the resin injection direction of the runner portion 13 of the upper molding die. Further, as shown in FIG. 4, a chamfered portion 20 is provided on the outer end 5 ′ of the cutout portion 40. The chamfered portion 20 is formed so as to become thinner toward the outside of the lead frame 3. The notch portion 40 and the chamfered portion 20 are formed by an etching process or a press working when manufacturing the lead frame 3.

Then, when a semiconductor device is manufactured using the lead frame 3 thus constructed, resin burrs are generated in a portion corresponding to the runner portion 13 of the upper mold die as follows. Is prevented.

That is, when the resin 15b cured in the runner portion 13 of the upper molding die 11 is mechanically removed from the surface of the lead frame 3, the outer end 5'of the outer frame 5 of the lead frame 3 has a As shown in FIG. 8, a cutout portion 40 and a chamfered portion 20 are provided in a portion of the upper molding die 11 facing the runner portion 13. Therefore, when the cured resin 15b, 15c remaining in the portion corresponding to the runner portion 13 of the molding die 11 is mechanically removed, the resin 15 cured at the outer edge 5'of the outer frame 5 of the lead frame 3 is removed.
b does not get caught on the outer edge 5'of the outer frame 5,
Of course, the chamfered portion 20 is integrally removed with the resin 15b cured in the runner portion 13, and the chamfered portion 20 is also removed.
Is formed at the outer end of the notch portion 40 that is provided so as to be inclined with respect to the runner portion 13. Therefore,
The resin 15b cured at the outer edge 5'of the outer frame 5 of the lead frame 3 is gradually peeled off from the outer end side of the cutout portion 40 inclined with respect to the runner portion 13, and thus the outer frame 5 of the lead frame 3 is formed. It is possible to more reliably prevent the cured resin 15b from remaining as burrs on the outer edge 5'of the.

The other structure and operation are the same as those of the above-mentioned embodiment, and the description thereof will be omitted.

FIG. 9 shows an embodiment of the invention set forth in the claims of the present invention. The same parts as those of the embodiment of the invention will be designated by the same reference numerals and will be described below. In the embodiment of the above, a cutout portion directed to the inside of the lead frame is formed on the outer end of the outer frame of the lead frame, facing the resin injection path of the upper molding die, from the runner portion of the molding die. Is also configured to be widely formed.

That is, the outer frame 5 of the lead frame 3
As shown in FIG. 9, a notch 40 is provided at the outer end 5 ′ of the upper mold die 11 facing the runner portion 13, and the notch 40 has a width b. It is formed wider than the width a of the runner portion 13 of the molding die 11. The cutout portion 40 is formed so as to be orthogonal to the resin injection direction of the runner portion 13 of the upper molding die. Further, the cutout portion 40, the outer frame 5 of the lead frame 3, and the corner portion 40a prevent the cutout portion 40 from being caught by the guide rail 30 or the like, so that the cutout portion 40 is removed from the outer frame 5 of the lead frame 3. It is further cut away toward the side. The notch 40 is formed by etching, pressing, or the like when manufacturing the lead frame 3.

When a semiconductor device is manufactured using the lead frame 3 having the above-described structure, resin burrs generated in a portion corresponding to the runner portion 13 of the upper mold die will be described below. Trouble is prevented from occurring in the process.

That is, when the resin 15b cured in the runner portion 13 of the upper molding die 11 is mechanically removed from the surface of the lead frame 3, the outer end 5'of the outer frame 5 of the lead frame 3 has As shown in FIG. 9, a cutout portion 40 is provided in a portion of the upper molding die 11 facing the runner portion 13. Therefore, the cured resin 15b remaining in the portion of the molding die 11 corresponding to the runner portion 13 and the like,
When mechanically removing 15c, the resin 15b cured at the outer edge 5'of the outer frame 5 of the lead frame 3 is caught by the outer edge 40 'of the notch 40, and the cured resin 15b remains as burrs. .

By the way, as shown in FIG. 7, the lead frame 3 after the resin sealing is held by the guide rails 30 and 31, and is subjected to the next lead trimming and forming steps. Outer frame 5
The outer edge 5 ′ of the above contacts the guide rail 30 when the lead frame 3 is conveyed, but the notch 40 to which the resin burr 15 b is attached is recessed from the outer edge 5 ′ of the outer frame 5 of the lead frame 3. Therefore, the resin burr 15b attached to the notch 40 is not likely to come into contact with the guide rail 30 or the like when the lead frame 3 is conveyed in the next step, and the resin burr 15b does not drop into the manufacturing apparatus. Absent. Therefore, the resin burr 1 is formed in the cutout portion 40 of the lead frame 3.
Even if 5b adheres, the resin burr 15b does not fall off and adhere to, for example, the parting surface of the upper and lower trimming and forming dies. It is possible to prevent damage and adhesion of the lead frame 3 to other parts, which may result in defective conveyance of the lead frame 3.

The other structure and operation are the same as those of the above-mentioned embodiment, and the description thereof will be omitted.

[0038]

The present invention has the above-described structure and operation, and prevents resin burrs from being generated in the outer edge portion of the outer frame of the lead frame which is in contact with the resin injection path of the molding die in the resin sealing step. Can be prevented or even if resin burr occurs on the outer frame of the lead frame,
It is possible to provide a lead frame for a semiconductor device capable of preventing the occurrence of inconvenience due to a resin burr attached to the outer frame of the lead frame, and a method for manufacturing a semiconductor device using the same.

[Brief description of drawings]

FIG. 1 is a plan configuration diagram showing an embodiment of a lead frame for a semiconductor device according to the present invention.

FIG. 2 is a cross-sectional configuration diagram showing a semiconductor device.

FIG. 3 is a cross-sectional configuration diagram showing a molding die for manufacturing a semiconductor device.

FIG. 4 is a sectional view showing a main part of a lead frame according to this embodiment.

FIG. 5 is a cross-sectional view showing a lead frame after resin sealing.

FIG. 6 is an explanatory diagram showing a state in which a resin burr is removed from the lead frame after resin sealing.

FIG. 7 is a configuration diagram showing a conveyance state of a resin-sealed lead frame.

FIG. 8 is a plan view showing another embodiment of the lead frame for a semiconductor device according to the present invention.

FIG. 9 is a plan configuration diagram showing still another embodiment of a lead frame for a semiconductor device according to the present invention.

FIG. 10 is a plan configuration diagram showing a conventional lead frame for a semiconductor device.

FIG. 11 is a cross-sectional configuration diagram showing a molding die for manufacturing a semiconductor device.

FIG. 12 is a cross-sectional configuration diagram showing a state in which a resin burr is removed from the lead frame after resin sealing.

FIG. 13 is an explanatory diagram showing a state in which resin burrs are removed from the lead frame after resin sealing as well.

FIG. 14 is a configuration diagram showing a conveyance state of a resin-sealed lead frame.

[Explanation of symbols]

1 semiconductor device, 3 lead frame, 5 outer frame, 1
0, 11 upper and lower molds, 12 cavities, 1
3 runner part, 14 gate part, 15 resin, 20 chamfered part.

Claims (4)

[Claims] 1. A lead frame for a semiconductor device, which is sandwiched between a pair of molding dies and resin-sealed, of an outer frame of the lead frame, the outer frame being in contact with a resin injection path of the molding die. A semiconductor characterized in that an outer edge on the upstream side in the resin injection direction is formed with a chamfer having a cross-sectional shape formed so as to become thinner toward the upstream side in the resin injection direction, wider than the width of the resin injection path. Lead frame for equipment. 2. A resin injection path, a cavity corresponding to a resin sealing portion of a semiconductor device, and a recess for arranging the lead frame in a fitted state, which is shallower than the thickness of the lead frame. A pair of molding dies, the lead frame is sandwiched between the pair of molding dies in a state of being fitted in the recess, and is inserted from the resin injection path into a cavity corresponding to the resin sealing portion of the semiconductor device. In the method of manufacturing a semiconductor device by injecting and curing a resin, in the outer frame of the lead frame, the outer frame in contact with the resin injection path of the molding die has an upstream edge in the resin injection direction, the upstream side in the resin injection direction. Using a lead frame with a chamfer whose cross-sectional shape is formed so as to become thinner toward the side, wider than the width of the resin injection path. After performing resin sealing with the resin sandwiched between the molding dies, remove the resin-sealed lead frame from the pair of molding dies, and set the cured resin in the resin injection path of the molding dies. A method for manufacturing a semiconductor device, characterized in that it can be integrally removed without being left on the outer edge of the outer frame of the lead frame by chamfering formed on the outer edge of the outer frame of the lead frame. 3. A lead frame for a semiconductor device, which is sandwiched between a pair of mold dies and sealed with a resin, wherein an outer frame of the lead frame, which is in contact with a resin injection path of the mold dies. A lead frame for a semiconductor device, characterized in that a notch toward the downstream side in the resin injection direction is formed at the outer edge on the upstream side in the resin injection direction so as to be wider than the width of the resin injection path. 4. A resin injection path, a cavity corresponding to a resin sealing portion of a semiconductor device, and a recess shallower than the thickness of the lead frame for arranging the lead frame in a fitted state, on one of the parting surfaces thereof. A pair of molding dies, the lead frame is sandwiched between the pair of molding dies in a state of being fitted in the recess, and is inserted from the resin injection path into a cavity corresponding to the resin sealing portion of the semiconductor device. In the method of manufacturing a semiconductor device by injecting and curing a resin, in the outer frame of the lead frame, the outer frame in contact with the resin injection path of the molding die has an outer edge on the upstream side in the resin injection direction of the resin injection direction. Use a lead frame with a notch facing the downstream side wider than the width of the resin injection path, and seal the resin with this lead frame sandwiched between a pair of molding dies. After removing the resin-sealed lead frame from the pair of molds, the outer edge of the outer frame of the lead frame is removed when the cured resin is removed in the resin injection path of the mold. A method for manufacturing a semiconductor device, characterized in that the cured resin is left in the cutout formed in the above.