JPH06252188A - Method and device for manufacturing resin-encapsulated semiconductor chip - Google Patents

Abstract

PURPOSE:To prevent axial lead type resin-encapsulating semiconductor chip defects due to lead bending process (peeling and gaps on the interface between the lead wires and the molding resin) and provide the rational manufacturing method and device which reduce the number of the processes on the production line. CONSTITUTION:A manufacturing device is formed by incorporating a punch 7 with a resin molding die 6 composed of a male mold 4 and a female mold 5 as a jig for bending a lead. The lead processing of the lead wires using the punch is performed simultaneously with the injection of casting resin into a cavity 6a under the condition that the combined assembly body composed of a semiconductor chip 1 and the lead wires 2 is set on the die, and in the same process, a resin package 3 is formed with the formation of a bending part 2a on the lead wires.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing an axial lead type resin-sealed semiconductor element for a diode or the like.

[0002]

2. Description of the Related Art First, a structure of an axial lead type resin-sealed semiconductor element, which is an object of the present invention, is shown in FIG.
4B and FIGS. 4A and 4B. In the figure, 1
Is a semiconductor chip, 2 is a lead wire that is joined to both ends of the semiconductor chip 1 and is drawn out in the axial direction, 3 is a resin package that seals the peripheral area of the semiconductor chip 1, 2a is a bent portion formed on the lead wire, and 2b is It is a standoff.

That is, in order to insert and mount the above-mentioned axial lead type semiconductor element into a printed wiring board by pins, normally, as shown in FIG. 3, a lead wire 2 is subjected to lead processing and an L-shaped bend is made in the middle thereof. The portion 2a is formed. Further, in order to regulate the insertion depth of the lead wire 2 at the time of pin insertion mounting, as shown in FIG. 4, a flat standoff 2b is previously formed on the tip side of the lead wire 2.

On the other hand, a semiconductor device having such a structure is manufactured by the following method. First, after the lead wire 2 is soldered to the semiconductor chip 1 in another step, a resin package 3 is formed on this assembly by a transfer molding method to seal the semiconductor chip 1 with resin. In the subsequent lead processing step, a linear lead wire 2 is bent using a lead processing jig to form a bent portion 2a as shown in FIG. Further, when forming the standoffs 2b, the lead processing is divided into two steps, the standoffs 2b are first pressed, and then the bent portions 2a are formed.

[0005]

By the way, when the lead 2 is bent after the resin package 3 is molded as described above, the stress caused by the bending causes the root portion of the lead wire 2 pulled out from the resin package 3. In addition, the interface between the lead wire 2 and the mold resin 3 may peel off due to this, and a gap may be formed in this portion. Moreover, if such a gap is created, moisture will intrude into the package from the outside, resulting in characteristic deterioration, which will seriously affect the reliability of the product.

The present invention has been made in view of the above points, and an object thereof is to solve the above problems and to prevent product defects (delamination of interface between lead wire and resin package, generation of gap) due to lead bending processing. An object of the present invention is to provide a method for manufacturing a resin-sealed semiconductor element and a manufacturing apparatus which are rational in terms of productivity and which can be avoided and also reduce the number of steps in the production line.

[0007]

In order to achieve the above object, according to the manufacturing method of the present invention, an assembly in which a lead wire is bonded to a semiconductor chip is set in a molding die, and is then cast into a cavity. The molding of the resin package in which the resin is injected and the lead processing for forming the lead wire are performed in parallel.

On the other hand, the manufacturing apparatus of the present invention used for carrying out the above method is constructed by incorporating a lead processing jig into a resin molding die. In addition, a lead wire bending jig or a lead wire standoff jig can be used alone or in combination with the manufacturing apparatus.

[0009]

As described above, by molding the resin package and forming the lead wire in parallel with the assembly of the semiconductor chip and the lead wire set in the resin molding die, the cavity is formed during the lead processing. The casting resin injected into is in an uncured state, and the resin is cured after the lead wire is formed into a predetermined shape. Therefore, it is possible to reliably avoid the possibility of peeling and gaps at the interface between the lead wire and the resin due to the mechanical stress caused by the lead bending process.

Further, since the molding of the resin package and the processing of the lead wire are performed at the same time, the number of steps on the production line can be reduced by that much, and the productivity can be rationalized.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. In each embodiment, the same members corresponding to those in FIGS. 3 and 4 are designated by the same reference numerals. Example 1 In FIGS. 1A to 1C, an upper die 4 is used with respect to a resin molding die 6 including a combination of an upper die 4 and a lower die 5.
Has a pair of punches 7 incorporated on both left and right sides as a jig for lead bending, and the lower die 5 is opposed to the punches 7.
The left and right ends of the are formed in a shape to form a die, and the resin molding die 6 and the punch 7 constitute a semiconductor device manufacturing apparatus according to the present invention. In addition, 6a in the figure
Is a cavity of the mold 6, and 6b is a gate for injecting a casting resin.

Next, a method of manufacturing a semiconductor element by the manufacturing apparatus having the above structure will be described. First, the joining assembly of the semiconductor chip 1 and the lead wire 2 assembled in another step is set at a predetermined position with respect to the lower die 5 as shown in FIG.
As shown in the figure, the mold 6 is closed and the mold is clamped. In this mold clamping state, the lead wire 2 is sandwiched by the mating surface of the upper die 4 and the lower die 5 (in the actual die, a groove into which the lead wire 2 is inserted is provided on the mating surface of the upper die and the lower die). To be done. Next, in the mold clamped state shown in (b), the cavity 6a is passed through the upper mold gate 6b.
At the same time as the injection of the casting resin is started, the punch 7 is operated by ejecting pressure to the punch 7 as shown in FIG. As a result, the lead wire 2 which was straight until now
Is bent into an L shape along the side surface of the lower die 5, and the bent portion 2a is formed in this portion. Then, when the resin injected into the cavity 6a is solidified, the mold is opened and the product is taken out, whereby the same lead-molded resin-sealed semiconductor element as shown in FIG. 3 is obtained.

Embodiment 2 FIG. 2 shows the standoff 2 shown in FIG. 4 on the lead wire 2 in parallel with the molding of the resin package 3.
1 shows a manufacturing apparatus configured to form b, and a pair of punches vertically opposed to each other as jigs for standoff processing are provided on both left and right sides of an upper die 4 and a lower die 5 of a resin molding die 6. 8 and 9 are incorporated.

With respect to such an apparatus, the bonding assembly of the semiconductor chip 1 and the lead wire 2 is set in the mold 6 and clamped in the same manner as described in the first embodiment, and then poured into the cavity 6a of the mold 6. Mold resin is injected to mold the resin package 3, and at the same time, the punches 8 and 9 are pressed upward and downward to project, and the flat standoff 2b is pressed at the tip of the lead wire 2. Is processed.

For the resin molding die 6, the lead bending punch 7 described in the first embodiment and the standoff punches 8 and 9 described in the second embodiment are used together (note that In this case, the punch 9 on the lower die side is retracted to a position where it does not interfere with the lead bending after standoff processing), and the standoff to the lead wire 2 is performed in parallel with the injection operation of the casting resin into the mold cavity. By performing lead processing in the order of 2b and the bent portion 2a, a semiconductor device in which FIG. 3 and FIG. 4 are combined can be manufactured in the same process.

[0016]

As described above, the manufacturing method of the present invention,
According to the manufacturing apparatus, the following effects can be obtained. (1) It is possible to avoid peeling and gaps at the interface between the resin package and the lead wire due to the stress caused by the lead wire forming, especially the lead bending process, and thus the reliability of the semiconductor element is significantly improved. To do.

(2) Since lead processing is simultaneously performed in the resin package molding step, the number of steps in the production line can be reduced and the productivity can be rationalized.

[Brief description of drawings]

FIG. 1 is a configuration of a manufacturing apparatus corresponding to a first embodiment of the present invention,
And (a) is a state diagram in which an element assembly is set in a mold, (b) is a state diagram during molding of a resin package, and (c) is a lead processing state diagram.

FIG. 2 is a configuration diagram of a manufacturing apparatus corresponding to a second embodiment of the present invention.

FIG. 3 is a structural diagram of an axial lead type resin-sealed semiconductor element in which a lead wire is bent.
(A) is a side sectional view, (b) is an end view of (a)

FIG. 4 is a structural diagram of an axial lead type resin-sealed semiconductor element in which a standoff is formed on a lead wire,
(A) is a side view, (b) is an end view of (a)

[Explanation of symbols]

 1 semiconductor chip 2 lead wire 2a bent portion 2b standoff 3 resin package 4 upper mold 5 lower mold 6 resin molding die 6a cavity 6b gate 7 punch (lead bending jig) 8, 9 punch (standoff jig) Ingredient

Claims (4)

[Claims] 1. An axial lead type resin-sealed semiconductor element comprising a semiconductor chip, a lead wire joined to both ends of the semiconductor chip and extended in an axial direction, and a resin package sealing the peripheral region of the semiconductor chip. In the manufacturing method of, a semiconductor package in which a lead wire is joined to a semiconductor chip is set in a molding die, and molding of a resin package in which a casting resin is injected into a cavity and lead processing for forming the lead wire are performed in parallel. And a method of manufacturing a resin-sealed semiconductor element. 2. A resin-encapsulated semiconductor device manufacturing apparatus used in the manufacturing method according to claim 1, wherein a jig for lead processing is incorporated in the resin molding die. 3. The manufacturing apparatus for a resin-sealed semiconductor device according to claim 2, wherein the jig is a jig for bending a lead wire. 4. The manufacturing apparatus for a resin-sealed semiconductor device according to claim 2, wherein the jig is a lead-off stand-off processing jig.