JP2002329827A - Forming method for axial lead-type electronic component, metal mold for use therein, and axial lead-type electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent deformation in a right-angled shoulder portion previously formed by folding in a lead wire. SOLUTION: When a flat portion 15 for positioning is formed in lead wires 11a and 11b by press work, a movable positioning stopper portion 22 for absorbing elongation of the lead wires 11a and 11b which elongation develops on the resin body portion 21 side of the lead wires is formed as an outer wall of a housing 5, in which the resin body portion 12 of an axial lead-type electronic component 10 is to be placed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a forming method of an axial lead type electronic component which does not give a mechanical stress to a functional component such as a semiconductor chip in an electronic component, a forming die used in the method, and a forming method. The present invention relates to a formed axial lead type electronic component.

[0002]

2. Description of the Related Art An axial lead type electronic component, such as a semiconductor device, in which a pair of lead wires are led out from both ends of a resin main body portion, is mounted on a printed wiring board (PWB) or the like. Bent at a right angle to the axis of the part, formed into a flat U-shape, and
In some cases, a flattened portion for positioning is pressed at a substantially middle portion of the lead wire. Conventionally, the following forming dies have been used to press the flattened portions for positioning. That is, FIG. 4 is a plan view schematically showing a conventional forming die, and FIG. 5 is a cross-sectional view thereof. The schematic configuration will be described with reference to these drawings.

[0003] Reference numeral 1 denotes an entire forming die. The forming die 1 is formed by previously bending the lead wires 11a and 11b of the axial lead type electronic component 10 at a substantially right angle with respect to the axis L of the resin main body 12 and forming the same into a planar shape and a substantially U-shape. On the other hand, it is used when a flattened portion for positioning is pressed into a substantially intermediate portion of the lead wires 11a and 11b. Therefore, the fixed-side pressing member 2 that supports the lead wires 11a and 11b, the movable-side pressing member 3 that is provided facing the fixed-side pressing member 2 and that can be moved up and down, and the resin body 12 are positioned. And a storage part 5 formed near the end of the lower mold 5 to be supported.

The fixed-side pressing member 2 is fixed to a lower pedestal 6 and penetrates a lower mold 4 supported by a spring 7. The movable-side pressing member 3 is fixed to the upper pedestal 8, penetrates the upper mold 9, and is provided at a position facing the fixed-side pressing member 2. The upper mold 9 is connected to the upper pedestal 8 by a spring 7 and has a structure that can be moved up and down with respect to the lower mold 4 by an elevating mechanism (not shown).

Long grooves 13a and 13b are formed in the axial direction of the electronic component 10 for accommodating the lead wires 11a and 11b. As shown in the sectional view of FIG. 5, the upper mold 9 is opposed to the long grooves 13a and 13b.
b is formed. The function of the storage section 5 of the resin main body 12 is to make the dimension up to the positioning flat section formed substantially in the middle of the lead wires 11a and 11b a predetermined dimension.

Next, a procedure for forming flattened portions for positioning on the lead wires 11a and 11b using the forming die 1 having the above-described structure will be described. First, the lead wire 11 of the axial lead type electronic component 10
Although the resin body 12a is formed in advance into a substantially U-shape in a plan view, the resin body 12 is inserted into the housing 10 of the lower mold 4.
And the lead wire 11 bent into a substantially U-shape
a, 11b into the long grooves 13a, 13b,
The position of the electronic component 10 is positioned at a predetermined position.

Next, an elevator (not shown) is driven to lower the upper mold 9. As a result, the upper mold 9 and the lower mold 4 are fitted together, and the lead wires 11a and 11b are pressed by the spring action of the spring 7. Next, when the upper mold 9 is further lowered, the fixed-side pressing member 2 and the movable-side fixed member 3 abut on each other with the lead wires 11a and 11b interposed therebetween.
1b is partially crushed, and the positioning flat portion 1 used for positioning when inserted into a PWB or the like as shown in FIG.
5 are formed. After the positioning flat portion 15 is formed, the upper die 9 is raised, and the axial lead type electronic component 10 in the lower die 4 is removed.

[0008]

When a forming die having the above structure is used, there are the following problems to be solved. That is, the fixed-side pressing member 2 and the movable-side pressing member 3 in the forming mold 1 shown in FIGS.
When the lead wires 11a and 11b are pressed with
As shown in FIG. 6, 1a and 11b extend in the left and right arrow directions about the positioning flat portion 15. In the above case, there is no particular problem with the extension of the lead wires 11a and 11b in the direction of the distal end portion, because the long grooves 13a and 13b are provided with clearances for which the extension is predicted in advance.

However, a problem arises with respect to the extension of the lead wires 11a and 11b toward the resin body 12. That is, the lead wires 11a, 11a
When b is extended, the resin main body 12 is stored in the storage section 5 which also serves as positioning, and cannot move to the left in the drawing. For this reason, the shoulder 16 bent at a right angle to the lead wires 11a and 11b is deformed. Especially the lead wire 11
When the wire diameters of a and 11b are large, for example, 1 mmφ or more, a bending moment is applied to the lead-out portion from the resin main body portion 12, and this force is applied to the resin main body 12 by resin sealing, for example, a semiconductor chip. There is a problem that a mechanical stress is applied to adversely affect the electrical characteristics, and in extreme cases, the semiconductor chip may be broken.

[0010]

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-described problems. In forming a positioning flat portion on a lead wire of an axial lead type electronic component by pressing, the electrical characteristics of the electronic component are reduced. It is an object of the present invention to provide a forming method that does not adversely affect, a mold used for the forming method, and an axial lead type electronic component formed by the forming method.

[0011]

According to a first aspect of the present invention, there is provided a method for forming an axial lead type electronic component, wherein a pair of lead wires are led out from both ends of a resin main body portion. The axial lead type electronic component forming method of bending at right angles to the axis of the main body, forming into a substantially U-shaped planar shape, and pressing a positioning flat portion at a substantially middle portion of the lead wire. When the positioning flat portion is pressed, there is provided means for moving a supporting position of the resin main body along with the extension of the lead wire in the direction of the resin main body.

In a forming mold according to a second aspect of the present invention, the lead wire of an axial lead type electronic component having a pair of lead wires led out from both ends of a resin body is bent at right angles to an axis of the resin body. A fixed-side pressing member for supporting the lead wire of the axial lead-type electronic component formed in a substantially U-shape in a planar shape, a movable-side pressing member provided to be movable up and down in opposition to the fixed-side pressing member, and the resin A storage portion for positioning and supporting the main body portion, and a movable positioning stopper portion for making a supporting position of the resin main body portion positioned and supported by the storage portion movable. .

An axial lead type electronic component according to a third aspect of the present invention is the axial lead type electronic component having a pair of lead wires led out from both ends of a resin main body, the lead being perpendicular to the axis of the resin main body. A fixed-side pressing member that supports the lead wire of the axial-lead type electronic component that is formed in a bent, planar shape substantially U-shape, and a movable-side pressing member that is provided to be able to move up and down in opposition to the fixed-side pressing member, Using a forming die having a storage portion for positioning and supporting the resin main body portion, and a movable positioning stopper portion for making a supporting position of the resin main body portion positioned and supported by the storage portion movable, After positioning and storing the resin main body in the storage section, the movable side pressing member is lowered to press a flattened portion for positioning at a substantially middle portion of the lead wire, and the positioning flat portion is formed. At the time of pressing the flat portion, the supporting position of the resin main body portion is changed by the movement of the movable positioning stopper portion accompanying the elongation of the lead wire, and the right shoulder portion of the lead wire is not deformed, and Is formed while maintaining the shape described above.

[0014]

In the forming method of the first invention, when the positioning flat portion is pressed, the supporting position of the resin main body moves along with the extension of the lead wire toward the resin main body. Therefore, the right shoulder of the lead wire is not deformed, and
Since no extra force is applied to the lead wire lead-out portion from the resin main body portion, functional components such as internal semiconductor chips are not adversely affected, and electrical characteristics are not impaired.

In the forming die for an axial lead type electronic component according to the second invention, since a portion serving as an outer wall of a storage portion for positioning and fixing the resin main body of the axial lead type electronic component is a movable positioning stopper portion, The stopper moves rearward so as to absorb the elongation of the lead wire when forming the positioning flat portion on the lead wire by the cooperative action of the fixed-side pressing member and the movable-side pressing member. Because of this, the right-angled shoulder of the lead wire retains its initial shape without being deformed, and does not apply extra force to the lead wire lead-out portion from the resin body, so that it does not adversely affect the internal functional components, There is no loss of electrical characteristics.

In the axial lead type electronic component according to the third aspect of the present invention, since the right-angled shoulder of the lead wire is not deformed, no mechanical stress is applied to the resin-sealed semiconductor chip in the resin main body, and the electrical lead is reduced. Excellent mechanical properties. Also,
Since the size of both ends of the lead wire does not change, it can be smoothly inserted into a through-hole or the like formed in a predetermined size in advance.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view schematically showing a forming die for carrying out the forming method of the present invention.
Is a plan view thereof. In these figures, the same parts as those of the conventional forming mold are denoted by the same reference numerals. A feature of the forming mold 21 used in the present invention is that an outer wall surface of a storage section for storing the resin body 12 is movable in order to position the axial lead type electronic component 10 at a predetermined position.

That is, a movable positioning stopper 22 is provided outside the housing 5. The stopper 22 has its lower end fixed to the side of the lower mold 4 by a screw 23 via a spring 7. The fixed portion depends on the size of the stopper portion 22, but may be approximately one or two. The stroke of the spring 7 is several mm.
I just need. Further, the strength of the spring 7 should be relatively weak enough to position the resin body 12 of the electronic component 10. Other structures are the same as those of the conventional forming 1, and the description thereof is omitted.

Next, the operation of the forming mold 21 having the above configuration will be described. First, the axial lead type electronic component 10 in which the lead wires 11 a and 11 b are formed in a U-shape in a plane is set in the lower mold 4 so that the resin main body portion 12 is accommodated in the storage portion 5. Next, the upper mold 9 is lowered, and the lead wire 11 is moved.
After lightly pressing a and 11b, the upper mold 9 is further lowered to a predetermined position. Accordingly, the lead wire 11 sandwiched between the opposed fixed-side pressing member 2 and the movable-side pressing member 3
The positioning flat part 15 (FIG. 6)
) Is formed.

When the positioning flat portion 15 is formed,
The lead wires 11a and 11b extend in opposite directions about the flat portion 15 as shown in FIG. In the figure, lead wires 11a, 11a
When b extends, a force is applied to push the resin body 12 outward. At this time, the positioning stopper 22 is moved outward against the spring force of the spring 7.

That is, the positioning stopper 2 described above
2 moves the lead wire 11 toward the resin body 12.
a, 11b will be absorbed, and the lead wire 1
The right shoulder 16 (see FIG. 6) of 1a, 11b receives little mechanical stress. For this reason, the right-angled shoulder 16
Does not deform, retains its initial shape, and does not apply mechanical stress to the lead wire lead-out portion from the resin main body portion 12 and does not adversely affect internal functional components such as semiconductor chips.
The electrical characteristics are not impaired.

Next, FIG. 7 shows an axial lead type electronic component obtained by performing the forming method using the mold of the present invention and a conventional metal mold by performing the forming method. This is shown in comparison with an axial lead type electronic component. In the figure, (a) is a product of the present invention, and (b) is a conventional product. In the drawings, the dimensions of each part are as follows. N
= 10 mm, M = 15 mm, R = 2.5 mm, D = 1.
4mmφ, Q = 0.1-0.4mm, θ = 2-9 °

As is apparent from the above-described drawings, when the axial lead type electronic component 10 is formed by a conventional forming die, the right-angled shoulder 16 is deformed, and a sharp bend is generated. The degree of this acute angle varies depending on the wire diameter D, the shoulder dimension R, the variation in the pressing force by the press machine, etc., but the dimension Q has an error of 0.1 to 0.4 mm, and the inclination θ at this time is , About 2 to 9 °. Those deformed as described above are removed due to poor appearance, but conventionally, the occurrence rate is of the order of tens of PPM, and it is difficult to easily adapt to a market where a failure rate of 1 PPM or less is required. there were. However, according to the present invention, since the right-angled shoulder portion is not deformed and keeps its shape, the above-mentioned failure rate can be easily reduced to 1 PPM or less.

[0024]

As described above, the present invention relates to a movable positioning device which moves along with the escape of a resin main body when pressing a flattened portion for positioning in the middle of a lead wire of an axial lead type electronic component. Since the stopper portion is provided in the housing portion of the resin main body, the extension of the lead wire on the resin main body side can be absorbed. For this reason, the shape of the right-angled shoulder portion of the lead wire is not deformed, mechanical stress is not applied to the lead wire lead-out portion from the resin body portion, and stress applied to components inside the resin body may be transmitted. Since it does not, the electric characteristics are not impaired. As described above, there is an excellent effect that the defective rate is reduced and the manufacturing cost of this kind of product can be reduced.

[Brief description of the drawings]

FIG. 1 is a sectional view schematically showing a forming mold used in the present invention.

FIG. 2 is a plan view of the forming mold.

FIG. 3 is an enlarged view for explaining an operation when forming a positioning flat portion on a lead wire using the mold.

FIG. 4 is a plan view schematically showing a conventional forming mold.

FIG. 5 is a sectional view of a conventional forming mold.

FIG. 6 is a plan view of an axial lead electronic component showing a deformed shoulder.

FIGS. 7A and 7B are plan views comparing the shapes of the product of the present invention and the conventional product, wherein FIG. 7A shows the product of the present invention, and FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Forming die 2 Fixed side pressing member 3 Moving side pressing member 4 Lower die 5 Housing part 6 Lower pedestal 7 Spring 8 Upper pedestal 9 Upper die 10 Axial lead type electronic components 11a, 11b Lead wire 12 Resin main body 13a, 13b Long groove 14a, 14b Long groove 15 Positioning flat part 21 Forming die 22 Movable positioning stopper part 23 Screw

Claims (3)

[Claims] An axial lead type electronic component in which a pair of lead wires are led out from both ends of a resin main body is bent at a right angle to an axis of the resin main body, and formed into a substantially U-shaped planar shape. And, in a forming method of an axial lead type electronic component for pressing a positioning flat portion at a substantially middle portion of the lead wire, when pressing the positioning flat portion, the pressing in the direction of the resin body portion. A method for forming an axial lead type electronic component, comprising: means for moving a supporting position of the resin main body part along with the extension of a lead wire. 2. An axial lead type electronic component in which a pair of lead wires are led out from both ends of a resin main body is bent at right angles to an axis of the resin main body, and formed into a substantially U-shaped planar shape. A fixed-side pressing member that supports the lead wire of the axial lead-type electronic component, a movable-side pressing member that is provided to be movable up and down in opposition to the fixed-side pressing member, and positions and supports the resin main body. 2. The axial lead type electronic component according to claim 1, further comprising: a housing portion; and a movable positioning stopper portion for making a supporting position of the resin body portion positioned and supported by the housing portion movable. Forming mold used for the forming method. 3. An axial lead type electronic component in which a pair of lead wires are led out from both ends of a resin main body is bent at right angles to an axis of the resin main body, and formed into a substantially U-shaped planar shape. A fixed-side pressing member that supports the lead wire of the axial lead-type electronic component, a movable-side pressing member that is provided to be movable up and down in opposition to the fixed-side pressing member, and positions and supports the resin main body. Positioning the resin main body part in the storage part by using a forming mold having a storage part and a movable positioning stopper part for making a supporting position of the resin main body part positioned and supported by the storage part movable. After being housed, the movable side pressing member is lowered to press the flattening portion for positioning substantially in the middle of the lead wire, and the pressing process of the flattening portion accompanies the elongation of the lead wire. The supporting position of the resin body part Te,
An axial lead type electronic component characterized in that it is formed while maintaining its shape without changing the right-angle shoulder of the lead wire by changing the movable positioning stopper by moving it.