CN212259462U - Flexible plate bending device of optical module - Google Patents
Flexible plate bending device of optical module Download PDFInfo
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- CN212259462U CN212259462U CN202021099807.2U CN202021099807U CN212259462U CN 212259462 U CN212259462 U CN 212259462U CN 202021099807 U CN202021099807 U CN 202021099807U CN 212259462 U CN212259462 U CN 212259462U
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Abstract
The utility model relates to an optical module field, concretely relates to flexible board bending device of optical module. The flexible plate bending device comprises a positioning mechanism and a bending mechanism, wherein the positioning mechanism is used for positioning a bonding pad; the bending mechanism is movably connected with the positioning mechanism; the positioning mechanism comprises a first positioning pressing block for positioning the bonding pad, the bending mechanism comprises a second positioning pressing block for positioning one end of the flexible board connected with the light emitting assembly and/or the light receiving assembly, the second positioning pressing block moves relative to the positioning mechanism and is close to the first positioning pressing block to form a gap with the same preset distance, and therefore the flexible board can be bent. The utility model discloses can be with the flexible board shaping of bending, the pad is difficult to be cracked because of the flexible board is bent, and the flexible board can not be inefficacy because of bending the rupture, improves assembly efficiency and product yields greatly.
Description
Technical Field
The utility model relates to an optical module field, concretely relates to flexible board bending device of optical module.
Background
Under the MSA standard protocol in the optical communication industry, due to the limitation of the protocol, the available space inside the optical module shell is very narrow, especially the SFP optical module. Under such narrow and small space, must lay optical transmission subassembly, light receiving component, PCB board and flexonics board, optical transmission subassembly and light receiving component wherein all are connected with the PCB board through the flexonics board, and the flexonics board passes through pad and PCB board welding. Therefore, an operator needs to bend the flexible board, so that the device can be assembled in a narrow optical module housing.
In a common low-rate SFP optical module, in the case that a BOX package is adopted for a light emitting module, electronic devices on a PCB are particularly compact, so that the design length of a flexible board is limited to only 11mm, which brings great difficulty to the bending operation of the flexible board. In addition, the flexible board needs to be bent after the PCB and the flexible board are welded, if the flexible board is bent first and then welded, the flexible board is uneven, the welding position cannot be accurately controlled, and the process stability cannot be guaranteed.
Therefore, in the above case, if no special device is provided, failure conditions such as breakage of the flexible board, tearing of the bonding pad, and the like easily occur after the flexible board is bent and molded.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model lies in, to the above-mentioned defect of prior art, provide a flexbile plate bending device of optical module, solve the problem that the flexible plate rupture appears easily in the flexible plate shaping of buckling among the current optical module, the pad tears the inefficacy circumstances such as.
The utility model provides a technical scheme that its technical problem adopted is: the utility model provides a 1, flexible board bending device of optical module, optical module include optical transmission subassembly, light receiving component, PCB board and flexible board, optical transmission subassembly and light receiving component are connected with the PCB board through a flexible board respectively, the pad is passed through to the one end of flexible board and the welding of PCB board, flexible board bending device includes:
the positioning mechanism is used for positioning the bonding pad;
the bending mechanism is movably connected with the positioning mechanism; wherein the content of the first and second substances,
the positioning mechanism comprises a first positioning pressing block for positioning the bonding pad, the bending mechanism comprises a second positioning pressing block for positioning one end of the flexible board connected with the light emitting assembly and/or the light receiving assembly, the second positioning pressing block moves relative to the positioning mechanism and is close to the first positioning pressing block to form a gap with the same preset distance, and therefore the flexible board is bent.
The utility model discloses a further preferred scheme is: the bending mechanism further comprises a moving block capable of moving relative to the positioning mechanism, and the second positioning pressing block is rotatably connected with the moving block so as to position one end, connected with the light emitting assembly and/or the light receiving assembly, of the flexible board onto the moving block.
The utility model discloses a further preferred scheme is: the flexible plate bending device further comprises a pin penetrating through the through hole of the moving block, and two ends of the pin are fixedly connected with the positioning mechanism respectively.
The utility model discloses a further preferred scheme is: the first positioning pressing block is provided with a first positioning part for positioning the bonding pad and a second positioning part for positioning the PCB.
The utility model discloses a further preferred scheme is: the first positioning pressing block is further provided with a groove, the upper end of the groove is arranged at the first positioning part, and the lower end of the groove is arranged at the second positioning part.
The utility model discloses a further preferred scheme is: the positioning mechanism further comprises a positioning base used for placing the PCB, and the first positioning pressing block is rotatably connected with the positioning base.
The utility model discloses a further preferred scheme is: and a first chamfer used for limiting the outer bending radius of the flexible plate is arranged on the outer contour of the first positioning pressing block close to the positioning base.
The utility model discloses a further preferred scheme is: and a second chamfer used for limiting the outer bending radius of the flexible plate is arranged on the outer contour of the second positioning pressing block close to the moving block.
The utility model discloses a further preferred scheme is: the positioning base is provided with a clamping groove, and the moving block is clamped in the clamping groove and moves relative to the positioning base.
The utility model discloses a further preferred scheme is: the flexible board bending apparatus further includes a bending auxiliary bar for limiting an inner bending radius of the flexible board.
The beneficial effects of the utility model reside in that, compared with the prior art, through setting up positioning mechanism and the mechanism of bending, positioning mechanism's first location briquetting is fixed a position flexbile plate and PCB board welded pad, the second location briquetting of the mechanism of bending is fixed a position the one end that flexbile plate and light emission component and/or light receiving component are connected, and second location briquetting relative positioning mechanism removes, be close to the clearance that forms the preset distance with first location briquetting, bend the shaping with the flexbile plate, the pad is difficult to be cracked because of the flexbile plate is bent, and the flexbile plate can not be inefficacy because of bending the rupture, assembly efficiency and product yields are greatly improved.
Drawings
The invention will be further explained with reference to the drawings and examples, wherein:
FIG. 1 is a schematic plan view of a flexible board before bending and forming;
FIG. 2 is a schematic view of a plane structure of a flexible board after bending and forming;
fig. 3 is an exploded schematic view of a flexible board bending device of the optical module according to the present invention;
fig. 4 is a schematic perspective view of a flexible board bending apparatus (a state where the first positioning pressing block is not pressed on the PCB and the bonding pad) of the optical module according to the present invention;
fig. 5 is a schematic perspective view of a flexible board bending apparatus (a state where a first positioning pressing block presses a PCB board and a bonding pad) of an optical module according to the present invention;
FIG. 6 is a schematic cross-sectional view taken along line A-A of FIG. 5;
fig. 7 is a partially enlarged schematic view of B in fig. 6.
Detailed Description
The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.
As shown in fig. 3 to 6, the present invention provides a preferred embodiment of a flexible board bending apparatus for an optical module.
The optical module comprises a light emitting assembly 100, a light receiving assembly 200, a PCB 300 and a flexible board 400, wherein the light emitting assembly 100 and the light receiving assembly 200 are respectively connected with the PCB 300 through the flexible board 400, and one end of the flexible board 400 is welded with the PCB 300 through a welding disc 500. The model of the optical module can be SFP, QSFP-DD and the like. The utility model discloses a flexplate bending device of optical module can bend the flexplate 400 of connecting light emission subassembly 100 and PCB board 300, perhaps bends the flexplate 400 of connecting light receiving assembly 200 and PCB board 300. Fig. 1 shows a schematic diagram of the flexible board 400 before bending, and fig. 2 shows a schematic diagram of the flexible board 400 after bending and molding by using the flexible board bending apparatus of the optical module.
Referring to fig. 3 to 5, the flexible board bending apparatus includes a positioning mechanism 10 and a bending mechanism 20, wherein the positioning mechanism 10 is used for positioning a bonding pad 500; the bending mechanism 20 is movably connected with the positioning mechanism 10; the positioning mechanism 10 comprises a first positioning pressing block 11 for positioning the bonding pad 500, the bending mechanism 20 comprises a second positioning pressing block 21 for positioning one end of the flexible board 400 connected with the light emitting assembly 100 and/or the light receiving assembly 200, and the second positioning pressing block 21 moves relative to the positioning mechanism 10 and is close to the first positioning pressing block 11 to form a gap consistent with a preset distance so as to bend the flexible board.
Through setting up positioning mechanism 10 and bending mechanism 20, positioning mechanism 10's first location briquetting 11 is fixed a position flexbile plate 400 and PCB board 300 welded pad 500, bending mechanism 20's second location briquetting 21 is fixed a position the one end that flexbile plate 400 and optical transmission subassembly 100 and/or light receiving assembly 200 are connected, and second location briquetting 21 removes relative positioning mechanism 10, be close to the clearance that forms the preset distance with first location briquetting 11, bend the shaping with flexbile plate 400, pad 500 is difficult to be because of flexbile plate 400 bends and breaks, and flexbile plate 400 can not be because of bending the fracture inefficacy, assembly efficiency and product yields are improved greatly.
The preset distance is set according to the radius of the shape formed by bending the flexible board 400, the second positioning pressing block 21 moves relative to the positioning mechanism 10, and when the distance between the second positioning pressing block 21 and the first positioning pressing block 11 reaches the preset distance, the flexible board 400 is bent into the required shape.
Referring to fig. 3 and 5, the bending mechanism 20 further includes a moving block 22 that is movable relative to the positioning mechanism 10, and the second positioning pressing block 21 is rotatably connected to the moving block 22. The second positioning pressing block 21 moves relative to the positioning mechanism 10 through the moving block 22, and forms a gap consistent with the preset distance with the first positioning pressing block 11. The second positioning pressing block 21 can be rotatably connected with the moving block 22 through the pin 30, the second positioning pressing block 21 is rotatably connected with the moving block 22, the light emitting assembly 100 and/or the light receiving assembly 200 are pressed and positioned on the moving block 22, one end, connected with the light emitting assembly 100 and/or the light receiving assembly 200, of the flexible board 400 is pressed and positioned on the moving block 22, the flexible board 400 is positioned on the moving block 22, and one end, connected with the light emitting assembly 100 and/or the light receiving assembly 200, of the flexible board 400 is positioned on the moving block 22. Specifically, referring to fig. 6 and 7, taking the case of pressing and positioning the light emitting module 100 on the moving block 22 as an example, the second positioning pressing block 21 is an L-shaped structure and is provided with a first pressing end surface 211 and a second pressing end surface 212, the first pressing end surface 211 and the second pressing end surface 212 are respectively abutted to two adjacent end surfaces of the light emitting module 100, and the light emitting module 100 is pressed and positioned on the moving block 22, so that one end of the flexible board 400 connected to the light emitting module 100 is pressed and positioned on the moving block 22, and in the moving process of the moving block 22 relative to the positioning mechanism 10, one end of the flexible board 400 connected to the light emitting module 100 is always kept pressed, the flexible board 400 is kept bent upward, and is finally bent and molded. The second positioning pressing block 21 is not in contact with the surface of the flexible board 400, so that the interference between the second positioning pressing block 21 and the glue layer on the flexible board 400 is avoided.
Further, referring to fig. 3, a through hole 221 is formed in the moving block 22, the flexible board bending device further includes a pin 30, and the pin 30 is disposed through the through hole 221 of the moving block 22, and two ends of the pin are respectively fixedly connected to the positioning mechanism 10. Under the guiding action of the pin 30, the moving block 22 moves relative to the positioning mechanism 10, moves relative to the first positioning pressing block 11 and is close to the first positioning pressing block 11, the structure is simple and convenient, and the assembly efficiency and the product yield are effectively improved.
Further, referring to fig. 3 and 4, the positioning mechanism 10 further includes a positioning base 12 for placing the PCB 300, and the first positioning pressing block 11 is rotatably connected with the positioning base 12, so that an operator can conveniently take and place the PCB 300. Specifically, the first positioning pressing block 11 is rotatably connected with a connecting block 40 through a pin 30, and the connecting block 40 is detachably connected with the positioning base. In addition, the positioning base 12 is provided with a clamping groove 121, and the moving block 22 is clamped in the clamping groove 121 and moves relative to the positioning base 12. The moving block 22 may be set to be an L-shaped structure and is clamped in the clamping groove 121. The pin 30 is arranged through the through hole 221 of the moving block 22, two ends of the pin are fixedly connected with two opposite wall surfaces of the clamping groove 121 in the positioning base 12 respectively, when the second positioning pressing block 21 is close to the first positioning pressing block 11, the moving block 22 is abutted against the positioning base 12, the distance between the second positioning pressing block 21 and the first positioning pressing block 11 is consistent with the preset distance, and the flexible plate 400 is bent and formed. The flexible board bending device is designed in a mode that the moving block 22 is clamped with the clamping groove 121, and the whole flexible board bending device is more compact. The positioning base 12 is further provided with a positioning groove 122 for placing the PCB 300, and the first positioning pressing block 11 rotates to press the PCB 300 and the bonding pad 500 into the positioning groove 122 to position the PCB 300 and the bonding pad 500.
Further, referring to fig. 6 and 7, the first positioning pressing block 11 is provided with a first chamfer 111 for limiting the outer bending radius of the flexible board 400 near the outer contour of the positioning base 12. The outer contour of the second positioning pressing block 21 close to the moving block 22 is provided with a second chamfer 213 for limiting the outer bending radius of the flexible plate 400. The first chamfer 111 and the second chamfer 213 ensure the minimum outer bending radius of the flexible board 400, further avoid the flexible board 400 from being broken, and improve the yield of products.
Referring to fig. 3 and 4, in this embodiment, in order to position the PCB 300 and the pad 500 of the flexible board 400 connected to the PCB 300, the first positioning pressing block 11 is provided with a first positioning portion 112 for positioning the pad 500 and a second positioning portion 113 for positioning the PCB 300. Specifically, the first positioning portion 112 presses and positions the bonding pad 500 in the positioning slot 122 of the positioning base 12, and the second positioning portion 113 presses and positions the PCB 300 in the positioning slot 122 of the positioning base 12.
Furthermore, the first positioning pressing block 11 is further provided with a slot 114, the first positioning portion 112 is disposed at the upper end of the slot 114, and the second positioning portion 113 is disposed at the lower end of the slot 114. Because the surface of the PCB 300 and the surface of the flexible board 400 have a height difference, the first positioning portion 112 and the second positioning portion 113 are separated by the groove 114, and the PCB 300 and the pad 500 are respectively pressed and positioned correspondingly, so that tolerance influence caused by the height difference is eliminated, and the positioning effect of the PCB 300 and the pad 500 is better.
Referring to fig. 5 to 7, in the present embodiment, the flexible board bending apparatus further includes a bending auxiliary bar 50 for limiting an inner bending radius of the flexible board 400. Specifically, the auxiliary bending rod 50 has a cylindrical structure, and the radius of the cylindrical structure is adapted to the inner bending radius of the flexible board 400, so as to ensure the minimum inner bending radius of the flexible board 400 after bending. In the process of moving the second positioning pressing block 21 to approach the first positioning pressing block 11, when the flexible board 400 is bent to a certain degree, the bending auxiliary rod 50 can be inserted, and the second positioning pressing block 21 is continuously moved to assist in bending and molding the flexible board 400.
Referring to fig. 3 and 4, in the present embodiment, the flexible board bending apparatus further includes a locking member 60 and a screw 70 installed on the positioning base 12, and the locking member 60 cooperates with the screw 70 to lock the first positioning pressing block 11 on the positioning base 12. The cooperation of retaining member 60 and screw 70 can guarantee that in the flexible board 400 bending process, first positioning briquetting 11 is for PCB board 300 and pad 500 pressure all the time, prevents that PCB board 300 from bouncing off location base 12, further prevents that flexible board 400 from breaking and pad 500 from tearing.
The following example of bending the flexible board 400 connected to the light emitting module 100 and the PCB 300 is used to illustrate the specific working principle of the flexible board bending device of the optical module of the present invention:
an operator places the PCB 300 in the positioning slot 122 of the positioning base 12, rotates the first positioning pressing block 11 of the positioning mechanism 10, presses and positions the bonding pad 500 in the positioning slot 122 by the first positioning portion 112 of the first positioning pressing block 11, and presses and positions the PCB 300 in the positioning slot 122 by the second positioning portion 113; operating the locking member 60 to match with the screw 70 to lock the first positioning pressing block 11 on the positioning base 12; then, the second positioning pressing block 21 of the bending mechanism 20 is rotated to press and position the light emitting assembly 100 on the moving block 22, and then the end of the flexible board 400 connected with the light emitting assembly 100 is pressed and positioned on the moving block 22; pressing second location briquetting 21 and operating and removing second location briquetting 21, making second location briquetting 21 be close to first location briquetting 11, after the certain degree of bending of flexile plate 400, will bend auxiliary rod 50 and insert the position of bending of flexile plate 400, continue to remove second location briquetting 21, support with location base 12 when movable block 22 and support and lean on, distance between first location briquetting 11 and the second location briquetting 21 is unanimous with the distance of predetermineeing, and the flexile plate 400 is bent the shaping.
It should be understood that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same, and those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some technical features; and all such modifications and alterations should fall within the scope of the appended claims.
Claims (10)
1. The utility model provides an optical module's flexonics board bending device, optical module include optical transmission subassembly, light receiving component, PCB board and flexonics board, optical transmission subassembly and light receiving component are connected with the PCB board through a flexonics board respectively, the pad is passed through to the one end of flexonics board and PCB board welding, its characterized in that, flexonics board bending device includes:
the positioning mechanism is used for positioning the bonding pad;
the bending mechanism is movably connected with the positioning mechanism; wherein the content of the first and second substances,
the positioning mechanism comprises a first positioning pressing block for positioning the bonding pad, the bending mechanism comprises a second positioning pressing block for positioning one end of the flexible board connected with the light emitting assembly and/or the light receiving assembly, the second positioning pressing block moves relative to the positioning mechanism and is close to the first positioning pressing block to form a gap with the same preset distance, and therefore the flexible board is bent.
2. The device according to claim 1, wherein the bending mechanism further comprises a moving block that is movable relative to the positioning mechanism, and the second positioning pressing block is rotatably connected to the moving block to position an end of the flexible board connected to the light emitting module and/or the light receiving module on the moving block.
3. The device according to claim 2, wherein the moving block is provided with a through hole, and the device further comprises a pin, the pin is disposed through the through hole of the moving block, and two ends of the pin are respectively fixedly connected with the positioning mechanism.
4. The flexible board bending device according to claim 1, wherein the first positioning pressing block is provided with a first positioning portion for positioning the bonding pad and a second positioning portion for positioning the PCB.
5. The device according to claim 4, wherein the first positioning pressing block further has a slot, the first positioning portion is disposed at an upper end of the slot, and the second positioning portion is disposed at a lower end of the slot.
6. The flexible board bending device according to claim 2, wherein the positioning mechanism further comprises a positioning base for placing the PCB, and the first positioning pressing block is rotatably connected with the positioning base.
7. The device according to claim 6, wherein the first positioning pressing block is provided with a first chamfer for limiting the outer bending radius of the flexible plate near the outer contour of the positioning base.
8. The device for bending a flexible plate according to claim 2, wherein the second positioning pressing block is provided with a second chamfer for limiting the outer bending radius of the flexible plate close to the outer contour of the moving block.
9. The device according to claim 6, wherein the positioning base is provided with a locking groove, and the moving block is locked in the locking groove and moves relative to the positioning base.
10. The flexible board bending apparatus according to any one of claims 1 to 9, further comprising a bending auxiliary bar for limiting an inner bending radius of the flexible board.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2020202676448 | 2020-03-06 | ||
| CN202020267644 | 2020-03-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212259462U true CN212259462U (en) | 2020-12-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021099807.2U Active CN212259462U (en) | 2020-03-06 | 2020-06-15 | Flexible plate bending device of optical module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212259462U (en) |
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2020
- 2020-06-15 CN CN202021099807.2U patent/CN212259462U/en active Active
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| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 518000 No. 35, Cuijing Road, Pingshan New District, Shenzhen, Guangdong Patentee after: Ona Technology (Shenzhen) Group Co.,Ltd. Address before: No.35 Cuijing Road, Pingshan District, Shenzhen City, Guangdong Province Patentee before: O-NET COMMUNICATIONS (SHENZHEN) Ltd. |
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| CP03 | Change of name, title or address |