JP2016165732A - Lead molding equipment and lead molding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide lead molding equipment which can easily bend leads in two directions in a simple structure without using a complex configuration such as a slide mechanism.SOLUTION: Lead molding equipment 10 comprises bending dies 13a, 13b that receives leads 53, 54 of an electronic component 50, bending punches 20a, 20b that have flexibility and bend the leads 53, 54 by pressing while moving in a first direction (+Z axis direction) toward the bending dies 13a, 13b, and guides 14a, 14b that have inclined planes 24a, 24b inclined so that the depth side in the first direction may come closer to a virtual perpendicular line passing through the center of the electronic component 50 in a plan view than to the near side in the first direction to make the bending punches 20a, 20b moved in the first direction come in contact.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a lead molding apparatus and a lead molding method for molding a lead such as an electronic component.

  In recent years, portable electronic devices have become widespread, and accordingly, demands for reducing the size and weight of electronic devices have increased. Along with this, there is an increasing demand for miniaturization of electronic components such as semiconductor components and vibrators used in electronic devices. For example, bending of external leads protruding in a planar direction from a package (base) is viewed from the vertical direction. It is now performed at the position that overlaps the package (base). As a lead molding apparatus that molds (bends) external leads into such a shape, for example, there is a lead molding die as described in Patent Document 1.

  A lead molding die disclosed in Patent Document 1 includes a punch having a forming portion, an adjustment pin that is provided on the punch and that can slide in a direction that intersects the direction of movement of the punch, and slides the adjustment pin. A taper cam surface. The adjustment pin is provided with a fulcrum pin that is inserted into a long hole (guide hole) provided in the punch. As the punch moves, one end of the adjustment pin is pushed by the taper cam surface and is provided in the punch. The adjustment pin can be slid by sliding the support pin using the elongated hole as a guide. In the lead molding die disclosed in Patent Document 1, the external lead is preliminarily bent by the movement of the punch, and then one end of the adjustment pin is pushed by the tapered cam surface along with the movement of the punch. Is slid and the other end of the adjustment pin further pushes and bends the external lead, thereby forming the external lead into a predetermined shape.

JP 2003-78095 A

  However, in the lead molding die as described in Patent Document 1, it is necessary to use a complicated structure for sliding the adjustment pin in the direction intersecting the movement direction of the punch. Specifically, a space for accommodating the adjustment pin is provided in the punch, and a long hole (guide hole) is provided in the punch. And the support pin provided in the adjustment pin is inserted in this long hole, and the adjustment pin is slid by the slide movement of the support pin along the long hole of the punch. In order to realize such a complicated slide mechanism and operation (slide movement) in a limited space, it is necessary to have high processing accuracy and assembly accuracy of each part, resulting in an expensive lead mold. Had the problem of increasing the price of electronic components.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A lead molding apparatus according to this application example is a lead molding apparatus that bends a lead protruding from a base, has a bending die that receives at least a part of the lead, and has flexibility. A bending punch that pushes and bends the lead while moving in a first direction toward the bending die, and the first direction side is closer to a virtual perpendicular passing through the center in a plan view of the base than the side opposite to the first direction. And a guide part having an inclined surface with which the bending punch moved in the first direction comes into contact.

  According to this application example, by moving the bending punch in the first direction, pre-bending is performed to push and bend the lead in the first direction, and then the bending punch that contacts the inclined surface of the guide portion follows the inclined surface. Thus, it is possible to perform so-called secondary bending, in which the pre-bent lead is pushed and bent in the second direction while sliding in the second direction that intersects the first direction. As described above, the bending in the first direction is performed by the bending punch, and the bending of the bending punch is facilitated by the bending of the bending punch, and the bending punch can be restored after the lead is bent. Easy to do with the configuration. Therefore, a very high processing accuracy and assembly accuracy are not required, and the cost of the apparatus can be kept low. As a result, the price of the electronic component can be kept low.

  Application Example 2 In the lead forming apparatus according to the application example described above, the bending punch is configured by a plate member, and the front and back surfaces of the plate member are inclined so as to move away from the virtual perpendicular line as they move away from the lead. Are preferably arranged.

  According to this application example, the bending punch can be easily deformed in the front and back direction of the plate member. Further, as the distance from the lead increases, the front and back surfaces of the plate member are inclined so as to be away from the virtual perpendicular passing through the center of the plan view of the base, that is, the front and back surfaces are inclined relative to the virtual perpendicular. Therefore, the plate member can be further easily deformed in the front and back direction.

  Application Example 3 In the lead forming apparatus according to the application example described above, it is preferable that an inclination angle of the bending punch with respect to the first direction is smaller than an inclination angle of the inclined surface with respect to the first direction.

  According to this application example, it is possible to perform the pre-bending in which the lead is pushed and bent in the first direction, and it is easy to perform the secondary bending in which the lead is pushed and bent in the second direction because the bending punch easily slides on the inclined surface. Can be done.

  Application Example 4 In the lead molding apparatus according to the application example described above, it is preferable that the bending punch has an abutting portion having an arc shape that abuts the lead.

  According to this application example, since the contact portion of the bending punch with the lead has an arc shape, the inclined surface can be easily slipped and the contact resistance with the lead can be reduced. Damage to the leads such as scratches and cracks can be reduced.

  Application Example 5 In the lead molding apparatus according to the application example described above, it is preferable that the guide portion includes a groove portion through which the lead deforms and passes, at a position facing the lead.

  According to this application example, since the width direction of the lead can be guided by both side surfaces of the groove portion, it is possible to reduce variation in bending accuracy in the width direction of the lead.

  Application Example 6 In the lead forming apparatus according to the application example described above, the lead bending position is preferably provided at a position overlapping the base in plan view.

  According to this application example, bending of the external lead protruding in the planar direction from the base is performed at a position overlapping the base when viewed from the vertical direction, that is, the lead is disposed at a position overlapping the base when viewed from the vertical direction. In addition, the shape of the lead can be made more compact.

Application Example 7 A lead molding method according to this application example includes a bending die that receives a lead protruding from a base, and a flexible die that pushes the lead while moving in a first direction toward the bending die. A bending punch that bends, and a guide that has an inclined surface on which the back side in the first direction is inclined so as to approach a virtual perpendicular passing through the center of the base in plan view, and the bending punch that has moved in the first direction is in contact with the bending punch A lead molding method using a lead molding device comprising:
Placing the lead on the bending die; pushing the lead in the first direction as the bending punch moves in the first direction; and bending the punch on the inclined surface. After the contact, the step of moving the lead in the second direction intersecting the first direction along the inclined surface to push and bend the lead in the second direction; and the bending punch in a direction opposite to the first direction And a step of restoring the original shape by the flexibility of the bending punch.

  According to this application example, by moving the bending punch in the first direction, pre-bending is performed to push and bend the lead in the first direction, and then the bending punch that contacts the inclined surface of the guide portion follows the inclined surface. Thus, it is possible to perform so-called secondary bending, in which the pre-bent lead is pushed and bent in the second direction while sliding in the second direction that intersects the first direction. Therefore, the bending punch can perform lead bending in two directions of the first direction and the second direction by moving in one direction, that is, moving in the first direction. In addition, due to the flexibility of the bending punch, the slide (deformation) for bending the lead in the second direction and the return to the original shape of the bending punch after bending the lead can be easily performed with a simple configuration. Can do. By such a simple method, preliminary bending in the first direction by the bending punch, secondary bending by sliding in the second direction, and restoration by the flexibility of the bending punch after bending the lead are performed. Can do.

An example of the electronic component provided with the lead is shown, (A) is a plan view showing the lead before bending, (B) is a front view showing before the lead bending, and (C) is a front view showing after the lead bending. BRIEF DESCRIPTION OF THE DRAWINGS The outline of the lead shaping | molding apparatus which concerns on embodiment of this invention is shown, (A) is a front sectional view in BB of (B), (B) is a top view in AA view of (A). The side view in the C view of Drawing 2 (A) showing the outline of the lead molding device concerning the embodiment of the present invention. The perspective view which expanded the location including the inclined surface and recessed part of a guide part partially. The perspective view which expanded a part of bending punch. (A)-(D) is a process flow figure showing a lead molding method using a lead molding device concerning an embodiment. (E)-(H) are process flow diagrams showing the lead forming method following FIG.

<Embodiment>
(Constitution)
A lead forming apparatus according to an embodiment of the present invention will be described below with reference to FIGS. 1 shows an example of an electronic component having a lead that is bent by a lead molding apparatus, FIG. 1A is a plan view showing the lead before bending, FIG. 1B is a front view showing the lead before bending, FIG. (C) is a front view showing after lead bending. 2 shows an outline of the lead forming apparatus according to the embodiment of the present invention, FIG. 2A is a front sectional view taken along line BB of FIG. 2B, and FIG. 2B is FIG. 2A. It is a top view in AA view. FIG. 3 is a side view showing the outline of the lead forming apparatus according to the embodiment of the present invention, as seen from the C view in FIG. FIG. 4 is a partially enlarged perspective view of a portion including the inclined surface and the concave portion of the guide portion constituting the lead forming apparatus. FIG. 5 is a partially enlarged view of a bending punch, FIG. 5 (A) is a perspective view showing the bending punch according to the embodiment, and FIG. 5 (B) is a bending according to a modification. It is a perspective view which shows a punch. 2 to 5, for convenience of explanation, the X axis, the Y axis, and the Z axis are illustrated as three axes orthogonal to each other. In addition, the direction toward the + Z axis direction is referred to as a first direction, and the direction toward the ± X axis direction is referred to as a second direction. For convenience of explanation, in the Z-axis direction, the + Z-axis direction may be described as the back side of the first direction, and the -Z-axis direction may be described as the near side of the first direction. Furthermore, for convenience of explanation, in the plan view when viewed from the Z-axis direction, the surface in the + Z-axis direction will be described as the lower surface, and the surface in the −Z-axis direction will be described as the upper surface.

(Electronic parts)
Before describing the lead molding apparatus 10 according to the embodiment of the present invention, an electronic component for molding a lead using the lead molding apparatus according to the present embodiment will be briefly described with reference to FIG. In the electronic component 50 shown in FIG. 1A and FIG. 1B, a circuit element 52 such as an integrated circuit or a capacitor is mounted on an upper surface 51a of a substrate 51 as a base, and leads (lead terminals) 53 and 54 are mounted on the lower surface 51b. Is connected. On the upper surface 51 a of the substrate 51, circuit wiring (not shown) is configured and electrically connected to the circuit element 52.

  The substrate 51 as a base is made of a material such as an insulating glass epoxy resin or ceramics. Further, circuit wiring (not shown) provided on the substrate 51 is formed by a method of etching from a substrate having a copper foil applied to the entire surface, or a metal wiring material such as tungsten (W) or molybdenum (Mo) is screened on the substrate. It is formed by printing and baking, followed by plating with nickel (Ni), gold (Au) or the like. The lower surface 51b of the substrate 51 is provided with a pad electrode (not shown) electrically connected to the circuit wiring (not shown) on the upper surface 51a by a through electrode (not shown). Leads (lead terminals) 53 and 54 are connected to the pad electrode by, for example, a soldering method. Note that the pad electrode does not necessarily have to be electrically connected to the circuit wiring.

  The leads (lead terminals) 53 and 54 in the electronic component 50 of the present embodiment are provided so as to protrude on both sides in the X-axis direction of the substrate 51 along the second direction (X-axis direction). In addition, although the lead in this form has shown the example arrange | positioned 6 each on both sides of the board | substrate 51, the number of leads is not restricted to this, Any number may be sufficient. As the constituent material of the leads 53 and 54, it is preferable to use a material with good formability such as a plate material of 42 alloy (iron nickel alloy) or copper (Cu).

  The leads (lead terminals) 53 and 54 in the electronic component 50 described above are first positioned at a position overlapping the substrate 51 in plan view as shown in FIG. It is bent in the direction (+ Z axis direction). As a result, the electronic component 50a having the leads 53a and 54a formed so that the ends of the leads 53 and 54 face the + Z-axis direction is obtained.

  In the electronic component 50 described above, the example in which the substrate 51 is used as the base from which the leads 53 and 54 protrude is described. However, the base is a package formed of ceramic or the like, and the circuit element 52 or the like is accommodated therein. It may be the configuration. In this case, the lead is bonded to the outer surface such as the lower surface of the package.

(Lead forming equipment)
Details of the lead forming apparatus according to the embodiment of the present invention will be described with reference to FIG. As shown in FIGS. 2A and 2B, the lead forming apparatus 10 according to the embodiment of the present invention includes a base base 11 and four guides fixed to four corners of the base base 11. The shaft 22 and the moving unit 15 that moves along the Z-axis direction using the guide shaft 22 as a guide are provided. The moving part 15 is provided with a punch fixing part 16, and is provided with bending punches 20 a and 20 b fixed to the punch fixing part 16 with fixing bolts 21. The base base 11 is provided with bending dies 13a and 13b for receiving the leads 53 and 54 of the electronic component 50, respectively.

  The bending dies 13a and 13b arranged at the center of the base base 11 in the XY plane are arranged at positions for receiving at least a part of the leads 53 and 54 of the electronic component 50, respectively. The outer edges of the bending dies 13a and 13b (the edge in the + X-axis direction for the bending die 13a and the edge in the -X-axis direction for the bending die 13b) cover at least a part of the leads 53 and 54 and the base of the electronic component 50 Is provided at a position overlapping the substrate 51 in plan view. In this way, by arranging the outer edges of the bending dies 13a and 13b at positions overlapping the substrate 51 in plan view, the bending positions of the leads 53 and 54 protruding in the planar direction (X-axis direction) from the substrate 51 are The substrate 51 can be positioned so as to overlap the substrate 51 in a plan view when the substrate 51 is viewed from the vertical direction, in other words, when viewed from the front side in the first direction. In other words, the leads 53 and 54 can be bent inside the outer periphery of the substrate 51 in the same plan view as described above. Therefore, the leads 53 and 54 can be bent more compactly, which contributes to downsizing of the electronic component 50.

  Further, in the region sandwiched between the bending dies 13a and 13b on both sides, a recess 12 is provided as a relief portion. The bending dies 13a and 13b provided with the recess 12 interposed therebetween are provided so as to protrude from the upper surface 11a of the base base 11 to the -Z axis side (moving part 15 side). Further, the base base on the outside of the bending dies 13a and 13b on both sides (the + X axis side opposite to the concave portion 12 with respect to the bending die 13a and the −X axis side opposite to the concave portion 12 with respect to the bending die 13b). Guide portions 14 a and 14 b are fixed to the upper surface 11 a of the motor 11 by fixing bolts 26. The guide portions 14a and 14b are provided with groove portions 25a and 25b and inclined surfaces 24a and 24b arranged in contact with the bending dies 13a and 13b.

  The groove portion 25a of the guide portion 14a is mounted on the bending dies 13a and 13b in a plan view when the guide portion 14a is viewed from the front side (first direction side) in the first direction to the back side (opposite direction side in the first direction). It arrange | positions facing the placed lead | read | reed 53, and has penetrated from the upper surface to the lower surface. 3 and 4, the groove 25a is provided with a width w2 slightly wider than the width w1 of the lead 53 so that the lead 53 bent in the first direction can pass therethrough. Both side surfaces 25c and a back wall surface 25d provided behind the tip of the lead 53, and the bending die 13a side is open.

  Returning to FIG. 2, the inclined surface 24 a of the guide portion 14 a has a first direction opposite to the first direction (the lower side in the figure, which is the back side in the first direction, hereinafter referred to as “the back side in the first direction”). It is inclined so as to be closer to the bending die 13a side than the direction side (the upper side in the figure which is the front side in the first direction, hereinafter referred to as “the front side in the first direction”). The inclined surface 24a of this embodiment is inclined toward the bending die 13a side from substantially the same position as the inner wall surface 25d of the groove 25a described above. The inclined surface 24a preferably has an angle b with respect to the Z axis of about 35 degrees (35 ± 5 degrees).

  And the guide part 14a is being fixed to the upper surface 11a of the base base 11 with the fixing volt | bolt 26 so that the inclined surface 24a may face the bending die 13a. The inclined surface 24a is brought into contact with the bending punch 20a by bending the bending punch 20a, which has moved in the first direction (+ Z-axis direction), while sliding on the inclined surface 24a after being in contact with the inclined surface 24a. The portion 28a (see FIG. 5A) can be moved in the second direction (−X axis direction). As described above, by setting the angle b of the inclined surface 24a to about 35 degrees (35 ± 5 degrees), the bending punch 20a is more easily deformed in the second direction (−X axis direction). Can do. In addition, the inclined surface 24a is preferably provided with, for example, a mirror finish or a low resistance sliding layer in order to reduce the resistance to sliding of the bending punch 20a and make the sliding smooth.

  In the form shown in FIG. 4, the configuration in which the step 27 is provided at the tip portions of the inclined surfaces 24 a and 24 b (the open side of the grooves 25 a and 25 b) is illustrated, but the configuration in which the step 27 is not provided. It may be.

  The groove portion 25b of the guide portion 14b is disposed so as to face the leads 54 placed on the bending dies 13a and 13b in a plan view of the guide portion 14b as viewed from the front side in the first direction, and from the upper surface to the lower surface. It penetrates to. As shown in FIGS. 3 and 4, the groove 25b is provided on both side surfaces having a width w2 slightly wider than the width w1 of the lead 54 so that the lead 54 bent in the first direction can pass therethrough. 25c and a back wall surface 25d provided in the back from the tip of the lead 54, and the bending die 13b side is open.

  Returning to FIG. 2, the inclined surface 24 b of the guide portion 14 b is inclined so that the back side in the first direction (lower side in the figure) is closer to the bending die 13 b side than the front side in the first direction (upper side in the figure). doing. The inclined surface 24b of this embodiment is inclined toward the bending die 13b side from substantially the same position as the inner wall surface 25d of the groove 25b described above. The inclined surface 24b preferably has an angle b with respect to the Z axis of about 35 degrees (35 ± 5 degrees), similar to the inclined surface 24a described above.

  And the guide part 14b is being fixed to the upper surface 11a of the base base 11 with the fixing volt | bolt 26 so that the inclined surface 24b may face the bending die 13b. The inclined surface 24b is brought into contact with the bending punch 20b by bending the bending punch 20b that has moved in the first direction (+ Z-axis direction) while sliding on the inclined surface 24b after contacting the inclined surface 24a. The portion 28a (see FIG. 5A) can be moved in the second direction (+ X-axis direction). As described above, by setting the angle b of the inclined surface 24b to about 35 degrees (35 ± 5 degrees), the bending punch 20b can be more easily deformed in the second direction (+ X axis direction). it can. In addition, the inclined surface 24b is preferably provided with a mirror finish or a low-resistance sliding layer, for example, in order to reduce sliding resistance of the bending punch 20b and make the sliding smooth.

  By providing the groove portions 25a and 25b as described above in the guide portions 14a and 14b, the leads 53 and 54 can be positioned in the width direction on both side surfaces 25c of the groove portions 25a and 25b. Variation in bending accuracy can be reduced.

  In addition to the above-described punch fixing portion 16 and bending punches 20a and 20b, the moving portion 15 is provided with a guide hole (not shown) that slides with the guide shaft 22 and a central portion of the moving portion 15 on the XY plane. And a pressing portion 23 that applies pressure to the pressing portion 17. The presser portion 17 is movable along the Z-axis direction (the first direction and the direction opposite to the first direction), and is connected to the movable portion 15 so as to be movable with respect to the punch fixing portion 16 with the pressing portion 23 interposed therebetween. Has been. The pressing portion 17 is provided with a concave portion 18 on the side facing the electronic component 50, and provided with convex portions 19 extending in the Y-axis direction on both sides of the concave portion 18 in the X-axis direction. When the pressing portion 17 moves in the first direction (+ Z-axis direction), the substrate 51 of the electronic component 50 with which the convex portion 19 abuts can be suppressed by the pressure of the pressing portion 23. Further, the concave portion 18 can be used as a relief portion of the circuit element 52 mounted on the substrate 51 of the electronic component 50. Moreover, the punch fixing | fixed part 16 is each provided in the both sides which pinched the press part 17 in the X-axis direction.

  The bending punches 20a and 20b fixed to the punch fixing portion 16 of the moving portion 15 movable in the Z-axis direction with the guide shaft 22 as a guide are arranged in the direction in which the leads 53 and 54 are arranged (see FIG. 5A). It is composed of a flexible plate member having a thickness t provided with a contact portion 28a extending in the (Y-axis direction). Returning to FIG. 2, as the bending punches 20a and 20b move away from the leads 53 and 54 in the -Z-axis direction, the front and back surfaces of the plate member are moved away from the virtual perpendicular passing through the center of the electronic component 50 in plan view. Inclined and fixed to the punch fixing portion 16. The inclination angle a of the bending punches 20a and 20b is preferably about 15 degrees (15 ± 5 degrees), and by setting such an angle, the second direction of the bending punches 20a and 20b (± It is possible to easily cause deformation in the direction of the X axis.

  A plate material having flexibility (spring property) can be used for the bending punches 20a and 20b. Examples of the material of the plate material constituting the bending punches 20a and 20b include spring stainless steel using SUS-304CSP as an example, cold rolled steel for spring using SK85-CSP (SK-5-CSP) as an example, In addition, a copper alloy for springs using beryllium copper as an example can be used.

  The angle a of the bending punches 20a and 20b that is inclined with respect to the Z-axis direction (first direction) is in the Z-axis direction (first direction) of the inclined surfaces 24a and 24b of the guide portions 14a and 14b. It is preferable that the angle b is smaller than the angle b. By arranging in this way, it is possible to reliably perform the preliminary bending for pushing and bending the leads 53 and 54 in the first direction (+ Z-axis direction), and the bending punches 20a and 20b slide on the inclined surfaces 24a and 24b. Therefore, the secondary bending for pushing and bending the leads 53 and 54 in the second direction can be easily performed.

  The contact portions 28a of the bending punches 20a and 20b (see FIG. 5A) overlap with the leads 53 and 54 when viewed from the front side in the first direction, that is, the bending punches 20a and 20b. Is moved in the first direction (+ Z-axis direction) when it is in contact with the leads 53 and 54. The abutting portions 28a (see FIG. 5A) of the bending punches 20a and 20b are preferably arcuate outer surface shapes, so-called rounded shapes. It is possible to slide with the surfaces 24a and 24b. Further, the bending punches 20a and 20b are positioned at the position of the contact portion 28a (see FIG. 5A) in the −Z-axis direction from the surface (lower surface) where the convex portion 19 of the pressing portion 17 contacts the substrate 51. Place it slightly shifted. Thereby, when the moving part 15 moves in the first direction (+ Z-axis direction), the bending punches 20a and 20b can be brought into contact with the leads 53 and 54 after the pressing part 17 holds the substrate 51, and the leads The bending of 53 and 54 can be started more reliably.

  Although the driving source of the moving unit 15 is not shown, it is not particularly limited as long as it can move in the first direction while applying a predetermined pressure that can bend the leads 53 and 54. As such a drive source, for example, a configuration in which the moving unit 15 is moved using a separate press device such as a hydraulic press, an air press, a hand press, or the like, for example, an air press mechanism, Alternatively, a configuration incorporating a hand press mechanism can be applied.

  According to the lead forming apparatus 10 according to the above-described embodiment of the present invention, the leads 53 and 54 are moved in the first direction (+ Z-axis direction) by moving the bending punches 20a and 20b in the first direction (+ Z-axis direction). Pre-bending can be performed by pushing and bending. Thereafter, a second direction (X-axis) is a direction in which the bending punches 20a and 20b contacting the inclined surfaces 24a and 24b of the guide portions 14a and 14b intersect the first direction while sliding along the inclined surfaces 24a and 24b. ), The so-called secondary bending, in which the pre-bent leads 53 and 54 are pushed and bent in the second direction, can be performed. In this manner, the bending punches 20a and 20b fixed to the moving portion 15 (punch fixing portion 16) moving in one direction (the first direction in this embodiment), the preliminary bending in the first direction, and the inclined surface 24a, The secondary bending in the second direction performed by sliding on 24b can be performed in both directions.

  Further, the bending punches 20a and 20b after the secondary bending of the leads 53 and 54 are completed, the moving portion 15 (punch fixing portion 16) returns to the −Z direction, and the inclined surface 24a due to the flexibility possessed. , 24b are slid in the opposite direction to return to the original shape. Thus, the return of the bending punches 20a and 20b can be easily performed with a simple configuration. Therefore, a very high processing accuracy and assembly accuracy are not required, and the lead forming apparatus 10 can be made with a low cost. And by using this lead shaping | molding apparatus 10, it becomes possible to hold down the price of the electronic component 50 low as a result.

  In the above-described embodiment, the moving unit 15 moves in the Z-axis direction (the first direction and the direction opposite to the first direction) using the four guide shafts 22 fixed to the four corners of the base base 11 as guides. However, the present invention is not limited to this. As another configuration example, two guide shafts are provided at a position sandwiching the central portion of the XY plane of the base base 11 between them, and a guide hole corresponding to the guide shaft is provided in the moving unit 15, or the moving unit 15 The structure which provides a guide shaft in two places of the position which pinches | interposes the four corners of this, or the center part of XY plane of the moving part 15, and provides a guide hole in the base base 11 side etc. is also applicable.

(Modification of bending punch)
With reference to FIG. 5 (B), the modification of bending punch 20a, 20b is demonstrated. The bending punches 20a and 20b shown in FIG. 5B are formed by bending the abutting portions 28b into an arc shape. As described above, by making the outer surface of the contact portion 28b into an arc shape, that is, a so-called round shape, it becomes possible to slide the inclined surfaces 24a, 24b more smoothly. Further, since the contact portions 28b of the bending punches 20a and 20b with the leads 53 and 54 have an arc shape, the contact resistance with the leads 53 and 54 can be reduced. Damage to the leads 53 and 54, such as scratches and cracks, can be reduced.

(Lead molding method)
The lead molding method according to the present invention will be described with reference to FIGS. 6A to 6D are process flow diagrams showing a lead forming method using the lead forming apparatus 10 according to the embodiment. FIG. 7E to FIG. 7H are process flow diagrams showing the lead forming method following FIG.

  In this lead molding method, the step of placing the leads 53 and 54 of the electronic component 50 on the bending dies 13a and 13b, as shown in FIG. 6B, and the bending punches 20a and 20b as shown in FIG. As the lead moves in the first direction (+ Z-axis direction), the step of pushing and bending the leads 53, 54 in the first direction (+ Z-axis direction) and the bending punches 20a, 20b shown in FIG. After contacting the surfaces 24a and 24b, the leads 53 and 54 are moved in the second direction (± X-axis direction) intersecting the first direction along the inclined surfaces 24a and 24b to move the leads 53 and 54 in the second direction (± X-axis direction). ) And the bending punches 20a and 20b shown in FIG. 7H move in the direction opposite to the first direction (the −Z-axis direction) while the bending punches 20a and 20b are flexible. Restoring to the shape of .

  First, as shown in FIG. 6A, the lead forming apparatus 10 described above is prepared. In addition, since the lead shaping | molding apparatus 10 is the same as that of embodiment mentioned above, the same code | symbol is attached | subjected and description here is abbreviate | omitted. The lead forming apparatus 10 has a space between the bending dies 13a and 13b and the pressing portion 17 (convex portion 19), and the moving portion 15 is held.

  Next, as illustrated in FIG. 6B, the electronic component 50 is placed on the bending dies 13 a and 13 b of the lead molding apparatus 10 so that at least a part of the leads 53 and 54 is applied. Specifically, the substrate 51 is disposed in the center, the lead 53 is placed on the bending die 13a, and the lead 54 is placed on the bending die 13b. At this time, the leads 53 and 54 are arranged at positions overlapping the groove portions 25a and 25b of the opposing guide portions 14a and 14b in plan view.

  Next, as shown in FIG. 6C, the moving unit 15 moves in the first direction (+ Z-axis direction). At this time, the bending punches 20a and 20b and the presser part 17 connected to the moving part 15 (punch fixing part 16) similarly move in the first direction (+ Z-axis direction). And the convex part 19 of the front-end | tip part of the moved pressing part 17 contact | abuts to the board | substrate 51 (not shown in the figure) of the electronic component 50. FIG. The circuit element 52 (not shown in the figure) on the substrate 51 is not pressed by being housed in the concave portion 18 provided in the pressing portion 17. Further, the moving unit 15 continues to move, but the position of the pressing unit 17 does not change, and moves in the opposite direction relative to the moving unit 15 while bending the pressing unit 23.

  Further, when the moving portion 15 moves in the first direction (+ Z-axis direction), the bending punches 20a and 20b come into contact with the leads 53 and 54 as shown in FIG. Then, as shown in FIG. 7E, the leads 53 and 54 sandwiched between the holding portion 17 and the bending dies 13a and 13b via the substrate 51 are directed in the first direction (+ Z-axis direction). Pre-bending to push and deform begins. At this time, the leads 53 and 54 start to be deformed with the outer edge of the bending dies 13a and 13b (the edge in the + X-axis direction for the bending die 13a and the edge in the -X-axis direction for the bending die 13b) as the deformation location. The grooves 25a and 25b move in the bending direction.

  Further, when the moving part 15 moves in the first direction (+ Z-axis direction), the bending punches 20a and 20b continue to move, and as shown in FIG. It contacts the inclined surfaces 24a and 24b of the portions 14a and 14b.

  Further, when the moving unit 15 moves in the first direction (+ Z-axis direction), as shown in FIG. 7G, the bending punches 20a and 20b in contact with the inclined surfaces 24a and 24b While sliding 24b, the tip end portion (contact portion 28a) also moves in the second direction (± X axis direction). At this time, the pre-bent leads 53 and 54 are further bent in the second direction (± X-axis direction), and the outer edges of the bending dies 13a and 13b (the + X-axis edge in the bending die 13a, the bending die) In 13b, the secondary bending that is pushed and bent to the side surface extending from the edge in the −X-axis direction is finished, and the movement of the moving unit 15 in the first direction (+ Z-axis direction) stops. As a result, the leads 53 and 54 are bent at a predetermined bending angle.

Thereafter, the moving unit 15 moves in the direction opposite to the first direction (the −Z-axis direction) and returns to the initial position as shown in FIG. At this time, the bending punches 20a and 20b that have been bent along the inclined surfaces 24a and 24b are inclined in a direction opposite to the direction in which the bending punches 20a and 20b are bent while sliding on the inclined surfaces 24a and 24b. It moves while sliding on the surfaces 24a, 24b, and returns (restores) to its original shape at a position away from the inclined surfaces 24a, 24b.
Through the series of steps as described above, the bending of the leads 53 and 54 of the electronic component 50 can be performed.

  According to such a lead forming method, the pre-bending for bending the leads 53 and 54 in the first direction (+ Z axis direction) by moving the bending punches 20a and 20b in the first direction (+ Z axis direction) is performed. After that, the second direction (± X-axis direction) in which the bending punches 20a and 20b contacting the inclined surfaces 24a and 24b of the guide portions 14a and 14b intersect the first direction along the inclined surfaces 24a and 24b. ), The so-called secondary bending, in which the pre-bent leads 53 and 54 are pushed and bent in the second direction (± X-axis direction), can be performed. Therefore, the bending punches 20a and 20b move in one direction, that is, move in the first direction (+ Z-axis direction), so that the first direction (+ Z-axis direction) and the second direction (± X-axis direction). ) Lead bending in two directions. Further, due to the flexibility of the bending punches 20a and 20b, the slide for bending in the second direction (± X-axis direction) and the restoration of the bending punches 20a and 20b to the original shape after bending the lead are performed. It can be easily performed with a simple configuration. After such a simple method, the bending in the first direction (+ Z-axis direction) by the bending punches 20a and 20b, the secondary bending by sliding in the second direction (± X-axis direction), and the lead is bent. The bending punches 20a and 20b can be restored to their original shapes by flexibility.

  DESCRIPTION OF SYMBOLS 10 ... Lead shaping | molding apparatus, 11 ... Base base, 11a ... Upper surface of a base base, 12 ... Recessed part, 13a, 13b ... Bending die, 14a, 14b ... Guide part, 15 ... Moving part, 16 ... Punch fixing part, 17 ... presser part, 18 ... concave part, 19 ... convex part, 20a, 20b ... bending punch, 21 ... fixing bolt, 22 ... guide shaft, 23 ... pressing part, 24a, 24b ... inclined surface, 25a, 25b ... groove part, 25c ... Side surface, 25d ... back wall surface, 26 ... fixing bolt, 27 ... step, 28a, 28b ... contact part, 50 ... electronic component, 51 ... substrate as base, 51a ... upper surface of substrate, 51b ... lower surface of substrate, 52 ... Circuit elements 53, 54 ... leads, a ... angle of bending punch, b ... angle of inclined surface.

Claims (7)

A lead forming device for bending a lead protruding from a base,
A bending die that receives at least a portion of the lead;
A bending punch that has flexibility and pushes and bends the lead while moving in a first direction toward the bending die;
The inclined surface on which the bending punch moved in the first direction abuts on the first direction side so as to approach a virtual perpendicular passing through the center in a plan view of the base, as compared with the opposite direction side of the first direction. A lead forming apparatus comprising: a guide portion including: The bending punch is composed of a plate member,
2. The lead forming apparatus according to claim 1, wherein the front and back surfaces of the plate member are inclined so as to move away from the virtual perpendicular line as the distance from the lead is increased.   The lead forming apparatus according to claim 2, wherein an inclination angle of the bending punch with respect to the first direction is smaller than an inclination angle of the inclined surface with respect to the first direction.   4. The lead forming apparatus according to claim 1, wherein the bending punch has an abutting portion having an arc shape that abuts on the lead. 5.   5. The lead forming apparatus according to claim 1, wherein the guide portion includes a groove portion through which the lead is deformed and passes at a position facing the lead. 6.   The lead forming apparatus according to any one of claims 1 to 5, wherein a bending position of the lead is provided at a position overlapping the base in a plan view. A bending die for receiving the lead protruding from the base;
A bending punch that has flexibility and pushes and bends the lead while moving in a first direction toward the bending die;
A guide portion having an inclined surface on which the back side in the first direction approaches an imaginary perpendicular passing through the center of the base in plan view, and has an inclined surface with which the bending punch moved in the first direction abuts. A lead forming method using a lead forming apparatus,
Placing the lead on the bending die;
As the bending punch moves in the first direction, bending the lead in the first direction;
After the bending punch abuts on the inclined surface, moving in a second direction intersecting the first direction along the inclined surface to push and bend the lead in the second direction;
And a step of restoring the original shape by the flexibility of the bending punch while the bending punch moves in a direction opposite to the first direction.

Images