JPH10178137A - Manufacture of resin molded semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate affects due to resin burr for improved quality and productivity. SOLUTION: On the outside edge of a lead frame 4, a place corresponding to a runner part 16 of metal mold 2 is cut off with a width wider than the runner part 16 to form a recessed part 6. At the metal mold 2, a protruded part 20 in a shape fitting in the recessed part 6 is formed. The protruded part 20 is fitted into the recessed part 6 of the lead frame 4, and a molten resin is injected into the metal mold 2 for forming a package 1001, then a cull part resin 2601 is cutoff, so that a resin burr 28 is housed inside the recessed part 6.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a resin-molded semiconductor device in which a package is resin-molded on a lead frame, and more particularly, to a novel method for coping with a resin burr remaining on an end face of a lead frame. It is.

[0002]

2. Description of the Related Art In a conventional resin-molded semiconductor device, a lead frame is clamped by upper and lower dies, molten resin is injected into the dies, and a semiconductor element portion is resin-molded.
A package 1001 is formed on a lead frame 4 as shown in FIG. At this time, as shown in FIGS. 8 and 9, a cull resin 26 serving as a resin injection port is formed on one end surface of the lead frame 4. The resin-molded lead frame 4 as shown is obtained. However, when the molten resin passes through the runner section 16, the resin leaks from the runner section 16 of the mold and adheres to the outer edge of the lead frame 4, which solidifies and remains as a resin burr 28 after separating the cull resin 26. (See FIG. 11).

[0003]

As described above, in the conventional method of manufacturing a resin-molded semiconductor device, the resin burr 2
Since the resin 8 remains on the outer edge of the lead frame 4, the resin burrs 28 are caught on equipment rails and the like in a later process, which causes a reduction in productivity and a deterioration in quality of the semiconductor device. For this reason, in some resin-molded semiconductor devices, a method of manually removing the resin burr 28 is also employed, but this method requires a large number of steps, and inevitably increases the cost.

However, it is difficult to completely prevent the resin burr 28 with the current semiconductor molding equipment and manufacturing method, and a solution has been desired. SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and has as its object to provide a method of manufacturing a resin-molded semiconductor device which eliminates adverse effects of resin burrs and improves quality and productivity.

[0005]

According to the present invention, a lead frame on which a semiconductor element is mounted is clamped by a mold, and a molten resin is injected from a runner portion of the mold to the lead frame side. A method of manufacturing a resin-molded semiconductor device in which a package is formed by resin-molding the semiconductor element, wherein a portion of the outer edge of the lead frame facing the runner portion has a larger width than the runner portion. A concave portion is formed inside the lead frame, a molten resin is injected into the mold, and the semiconductor element is molded with a resin. Then, the resin cured by the runner portion is cut off.

In the present invention, when the molten resin is injected into the mold, a package is formed through the runner portion, and in the process, a small amount of resin leaks from the runner portion and adheres to the concave portion. After the resin is cured, when the resin formed at the runner portion is cut off, resin burrs are generated.
Since it does not protrude from the end face of the lead frame, it does not get caught on a rail or the like when it is transferred to a subsequent process, so that productivity and quality are not adversely affected without removing resin burrs.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on an embodiment shown in the drawings. 8 to 11 are denoted by the same reference numerals.
1 and 2 show a state in which a lead frame used in the method of the present invention is set in a mold and resin-molded. A recess 6 is formed in the outer edge of the lead frame 4 by cutting out a portion corresponding to a runner portion described later.

The mold 2 comprises an upper mold 2A and a lower mold 2B, and the upper mold 2A moves up and down with respect to the lower mold 2B. As shown in FIG. 2, the lower mold 2 </ b> B has, as shown in FIG. 2, housing portions 8 for housing the lead frames 4 formed on the left and right of the partition portion 12, and recesses 10 for forming the package 1001 formed above and below the housing portions 8. ing. A cull portion 26 serving as a resin pool is formed in the central partition portion 12.
Runner portions 16 extend from the left and right of the lower mold 2B via the gate portion 18.
Has been linked with.

As shown in FIG. 1, the recess 6 is formed at the outer edge of the lead frame 4 where the runner 16 faces, and has a width larger than that of the runner 16.
Are formed on the lower surface of the lead frame 4. On the left and right sides of the partition portion 12 corresponding to the runner portion 16, the convex portion 2 having a shape to fit into the concave portion 6 of the lead frame 4.
0 is formed. As shown in FIG. 2, the lead frame 4 is accommodated in the accommodating portion 8 of the lower die 2B and clamped between the upper die 2A. At this time, the concave portion 6 of the lead frame 4 is fitted in the convex portion 20 of the lower mold 2B in a close state (see FIGS. 3 and 4).

In this state, when the molten resin is injected from the injection port 22 of the lower mold 2B, the molten resin flows from the cull portion 26 to the runner portion 16 and further from the runner portion 16 to the gate portion 18 to the recess 10 of the lower mold 2B. It is injected and supplied from the depression 10 of the lower die 2B to the depression 10 of the upper die 2A through a gap between a plurality of leads formed on the lead frame 4, and the semiconductor is formed in the depression 10 of the upper die 2A and the lower die 2B. The element is molded, and a package 1001 is formed. When the resin cures after a predetermined time, the cull resin 2601 formed by the cull portion 26 is connected to the lead frame 4 and the lead frame 4 is removed from the mold 2 (see FIG. 5).

Next, when the cull resin 2601 is automatically separated from the gate resin 1801 by a molding facility, a lead frame 4 having a package 1001 is formed as shown in FIG. Cal part resin 260
When 1 is cut off, the resin cured by the runner section 16 is also cut off, but the resin burr 28 remains in the recess 6 later (see FIG. 7). However, in the present embodiment, the resin burr 28 fits in the recess 6 and the lead frame 4
Does not protrude from the outer edge 401 of the resin burr, so that it does not get caught on a rail or the like when transferred to a subsequent process.
Even if 8 is not removed, productivity and quality will not be adversely affected.

In addition, since the convex portion 20 that fits into the concave portion 6 is also formed on the mold 2, the resin leaking from the gate portion 18 is also blocked by the convex portion 20 and becomes very small.
8 itself becomes minute. Therefore, according to the method of manufacturing a resin-molded semiconductor device of the present embodiment, the concave portion 6 is formed in the lead frame 4 without removing the resin burr 28 which is a factor of lowering productivity and deteriorating quality. The harmful effect of the resin burr 28 can be dealt with by a simple means.

Further, the additional work of removing the resin burr 28 can be eliminated, and the cost can be reduced by reducing the number of steps. In addition, the concave portion 6 is formed such that the resin burr 28 is
Since it is formed for the purpose of not protruding from 01, it is preferable to form as small a depth as possible if the purpose can be achieved. In addition, the configuration of the mold 2 is not limited to the above-described embodiment. For example, only one lead frame 4 may be resin-molded, or a type in which the lead frame 4 is housed in the upper mold 2A. The present invention may be applied to any type of mold in which a resin is injected from a gate portion to perform resin molding.

[0014]

As described above in detail, according to the present invention, the outer edge of the lead frame facing the runner portion is
After forming a concave portion having a width larger than that of the runner portion and depressed inside the lead frame, injecting a molten resin into a mold and resin-molding the semiconductor element, the resin cured in the runner portion is cut off. did. Therefore, when the cull resin is cut off, resin burrs are formed on the lead frame, but the resin burrs are contained in the concave portions and do not protrude from the outer edge of the lead frame, so that when transferred to a subsequent process, they are not caught on a rail or the like, Even if the resin burrs are not removed, the productivity and quality of the resin mold type semiconductor device will not be adversely affected. In addition, the additional work of removing resin burrs can be eliminated, and cost can be reduced by reducing man-hours.

[Brief description of the drawings]

FIG. 1 is a plan sectional view showing a state in which a lead frame used in a method of manufacturing a resin-molded semiconductor device of the present invention is set in a mold, and is a sectional view taken along line AA of FIG.

FIG. 2 is a sectional view taken along line BB of FIG.

FIG. 3 is an enlarged sectional view of a main part of FIG.

FIG. 4 is a sectional view taken along line CC of FIG. 3;

FIG. 5 is a plan view showing a state in which a resin-molded lead frame is removed from a mold.

FIG. 6 is a plan view showing a state where a cull resin is cut off.

FIG. 7 is a plan view of a main part of FIG. 6;

FIG. 8 is a plan view showing a state in which a lead frame molded by resin according to a conventional manufacturing method is taken out of a mold.

FIG. 9 is a side view of FIG.

FIG. 10 is a plan view of a conventional lead frame in a state where a cull resin is cut off.

FIG. 11 is a plan view of a main part of FIG. 10;

[Description of Signs] 2 ... Mold, 2A ... Upper mold, 2B ... Lower mold, 4 ... Lead frame, 401 ... Outer edge, 6 ... Concave section, 8 ... Accommodating section, 10 ... Recess, 1001 ... Package, 12 ... Partition section , 16 ... runner part, 18 ... gate part, 1801 ... gate part resin, 2
0: convex, 26: cull, 2601: cull resin, 28
... resin burrs.

Claims (6)

[Claims] 1. A resin mold for clamping a lead frame on which a semiconductor element is mounted with a mold, injecting a molten resin from a runner portion of the mold to the lead frame side, and resin-molding the semiconductor element to form a package. A method of manufacturing a semiconductor device, comprising: forming a concave portion having a larger width than the runner portion and being depressed inside the lead frame at an outer edge of the lead frame and facing the runner portion; A method for manufacturing a resin-molded semiconductor device, comprising: after injecting a molten resin into the mold to resin-mold a semiconductor element, separating the resin cured at the runner portion. 2. The method of manufacturing a resin-molded semiconductor device according to claim 1, wherein a convex portion that fits into a concave portion of the lead frame is formed on the mold. 3. Injection of the molten resin from the runner portion to the lead frame side is performed via a gate portion in contact with the runner portion on one surface side of the lead frame, and separation of the resin cured by the runner portion is performed. 2. The method for manufacturing a resin-molded semiconductor device according to claim 1, wherein the method is performed in a gate portion. 4. The resin mold of the semiconductor element made of the molten resin is supplied from the gate portion to the lower surface of the lead frame, and passes from the lower surface through a gap between a plurality of leads formed on the lead frame. 4. The method of manufacturing a resin-molded semiconductor device according to claim 3, wherein the method is performed by supplying a molten resin to an upper surface of the semiconductor device. 5. The mold comprises an upper mold and a lower mold, wherein a partition is formed in the center of the lower mold, and accommodating sections for accommodating the lead frame are formed on left and right of the partition. 2. The resin mold according to claim 1, wherein a cull portion to which the molten resin is supplied is formed at the center of the partition portion, and the runner portions are formed on the left and right sides of the cull portion in the partition portion. Of manufacturing a semiconductor device. 6. The method of manufacturing a resin-molded semiconductor device according to claim 5, wherein convex portions which fit into concave portions of said lead frame are formed on left and right sides of said partition portion, respectively.