JPH03157943A - Manufacture of resin-sealed semiconductor integrated circuit - Google Patents

Abstract

PURPOSE:To decrease the close contact parts of a lead frame and gate parts to a resin and to prevent the generation of a resin residue on the gate parts by a method wherein a plate is superposed on parts, at which the lead frame and the gate parts come into contact with the resin, and a resin-sealing is performed. CONSTITUTION:A resin 3 is thrown in a pot part 7 in a bottom force 1, a plate 6 is put on the force 1 and a lead frame 6 with semiconductor elements 4 fixed thereon is put on the plate 6. The plate is a stainless steel plate or the like. Resin 3 is filled in cavities 9 and a resin-sealing is completed. After the sealing, the close contact parts of the frame 5 and gate parts 8 to the resin 3 are decreased by the plate 6, a separation of the frame 5 and the gate parts from the resin is facilitated and a resin residue to be generated on the frame 5 is extremely decreased.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method for manufacturing a resin-encapsulated semiconductor integrated circuit,
In particular, it relates to a resin sealing method.

[Conventional technology]

A conventional resin-sealing method in the manufacturing process of a resin-sealed semiconductor integrated circuit will be described with reference to FIG.

FIG. 3(a) is a sectional view showing the state of the mold before clamping.

The resin 3 is put into the pot part 7 of the lower mold 1, and then the lead frame 5 to which the semiconductor element 4 is fixed is placed on the lower mold 1.

Next, as shown in FIG. 3(b), the lead frame 5 is sandwiched between the upper mold 2, the mold is clamped, and the plunger]0 is pressurized to fill the cavity 9 with the resin 3 and seal the resin. complete the stop. When the resin sealing is completed, the lead frame 5 and the resin 3 in the gate portion 8 of the mold are in close contact with each other.

[Problem to be solved by the invention]

However, the above-described conventional method for manufacturing a resin-sealed semiconductor integrated circuit has the following drawbacks.

In recent years, with the diversification of mounting methods for a wide variety of packages and the increasing integration and size of semiconductor devices, we have been forced to take measures such as reducing stress on the resin side to relieve stress and improving moisture resistance with adhesion property -F. ing. However, due to such handling of the resin side, the conventional method of removing resin from the gate portion has the drawback that it is difficult to separate the resin from the lead frame and the gate portion, and resin remains at the gate portion.

[Means to solve the problem]

The method for manufacturing a resin-sealed semiconductor integrated circuit of the present invention comprises sandwiching a lead frame with a semiconductor element fixed between a lower mold and an upper mold and sealing the resin-sealed semiconductor integrated circuit with a resin by a transfer molding method. In the manufacturing method, a plate is placed on the gate portion of the lower mold, and a lead frame is placed on this plate.

〔Example〕

Next, the present invention will be explained using the drawings.

FIGS. 1(a) and 1(b) are sectional views for explaining a first embodiment of the present invention.

First, as shown in FIG. 1(a), the pot part 7 of the lower mold 1
Then, the plate 6 is placed on the lower mold 1, and finally the lead frame 5 to which the semiconductor element 4 is fixed is placed on the plate 6 in contact with the resin 3. The plate 6 may be any material as long as it is easily separated from the resin 3, and a stainless steel plate, a nickel alloy plate, or the like can be used.

Next, as shown in FIG. 1(b), the cavity 9 is filled with resin 3 to complete resin sealing.

As described above, according to the first embodiment, after the resin sealing is completed, the portion of the lead frame 5 and the resin 3 of the gate portion 8 that are in close contact with each other is reduced by the plate 6 that is in contact with the lead frame 5. Therefore, the resin of the lead frame 5 and the gate portion can be easily separated, and the amount of resin remaining on the lead frame 5 is extremely small.

FIG. 2 is a sectional view for explaining the second embodiment of the present invention, showing the state of the mold before clamping.

This second embodiment differs from the first embodiment in that a hole is provided in the portion of the plate 6A corresponding to the resin injection portion. Therefore plate 6
After placing A and the lead frame 5 on the lower mold 1, the resin 3
This has the advantage that the curing of the resin can be delayed and the resin 3 can be introduced into the cavity 9 more smoothly.

〔Effect of the invention〕

As explained above, the present invention reduces the contact area between the lead frame and the resin of the gate part by overlapping the plate and sealing with resin the part where the lead frame and the resin of the gate part contact. This has the effect of preventing resin from remaining when removing the gate resin.

[Brief explanation of the drawing]

1 and 2 are sectional views of a mold for explaining the first and second embodiments of the present invention, and FIG. 3 is a sectional view of a mold for explaining the prior art. 1...Lower mold, 2...Upper mold, 3...Resin, 4...
... Semiconductor element, 5... Lead frame, 6... Board, 7... Pot part, 8... Gate part, 9... Cavity, 10... Plunger.

Claims (1)

[Claims] In a method for manufacturing a resin-sealed semiconductor integrated circuit in which a lead frame with a semiconductor element fixed thereto is sandwiched between a lower mold and an upper mold and resin-sealed by a transfer molding method, a plate is attached to the gate portion of the lower mold. A method for manufacturing a resin-sealed semiconductor integrated circuit, comprising placing a lead frame on the mounting plate.