JPH03209860A - Lead frame for resin sealed type semiconductor device - Google Patents
Lead frame for resin sealed type semiconductor deviceInfo
- Publication number
- JPH03209860A JPH03209860A JP510490A JP510490A JPH03209860A JP H03209860 A JPH03209860 A JP H03209860A JP 510490 A JP510490 A JP 510490A JP 510490 A JP510490 A JP 510490A JP H03209860 A JPH03209860 A JP H03209860A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead frame
- outer frame
- gate
- gate section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 11
- 239000011347 resin Substances 0.000 title abstract description 45
- 229920005989 resin Polymers 0.000 title abstract description 45
- 238000007789 sealing Methods 0.000 abstract description 17
- 238000000034 method Methods 0.000 abstract description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は樹脂封止型半導体装置用リードフレームに関す
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a lead frame for a resin-sealed semiconductor device.
第５図は従来の樹脂封止型半導体装置用リードフレーム
の平面図、第６図は第５図のリードフレームを用いて樹
脂封止する方法を説明する断面図である。FIG. 5 is a plan view of a conventional resin-sealed lead frame for a semiconductor device, and FIG. 6 is a cross-sectional view illustrating a resin-sealing method using the lead frame of FIG. 5.
従来、樹脂封止型半導体装置は、第５図及び第６図に示
すように、半導体素子１を樹脂封止型半導体装置用リー
ドフレーム（以下リードフレームと記す）６の素子搭載
部２に搭載し、半導体素子１と内部リード３とを金属細
線にて接続し、封止樹脂４にて封止し、封止樹脂４が硬
化した後に樹脂封止金型からリードフレーム６を取り出
し、ゲート部樹脂７を除去した後、外部リード１０を成
形して完成するものである。Conventionally, a resin-sealed semiconductor device has a semiconductor element 1 mounted on an element mounting portion 2 of a lead frame (hereinafter referred to as lead frame) 6 for a resin-sealed semiconductor device, as shown in FIGS. 5 and 6. Then, the semiconductor element 1 and the internal leads 3 are connected with thin metal wires and sealed with a sealing resin 4. After the sealing resin 4 has hardened, the lead frame 6 is taken out from the resin sealing mold and the gate portion is sealed. After removing the resin 7, the external leads 10 are molded to complete the process.
上述したように、従来の半導体装置は、耐湿性が要求さ
れるなめ、封止樹脂とリードとのすきまからの水分の侵
入を避ける必要があり、封止樹脂はリードフレームと密
着性の高いものを使用している。・そのため、第５図及
び第６図に示すゲート部樹脂７を除去する際、リードフ
レーム外枠８がゲート部樹脂７から容易に分離せず、第
７図に示すようにリードフレーム外枠８に樹脂が残った
り、第８図に示すようにリードフレーム外枠８がゲート
部樹脂７から分離するときの力で変形するという問題が
起きている。As mentioned above, conventional semiconductor devices require moisture resistance, so it is necessary to prevent moisture from entering through the gaps between the encapsulating resin and the leads. are using. - Therefore, when removing the gate resin 7 shown in FIGS. 5 and 6, the lead frame outer frame 8 is not easily separated from the gate resin 7, and the lead frame outer frame 8 is removed as shown in FIG. Problems have arisen in that resin remains on the lead frame, and as shown in FIG. 8, the lead frame outer frame 8 is deformed by the force when it is separated from the gate resin 7.
本発明の目的は、上記の欠点を除去し樹脂封止後にゲー
ト部樹脂が容易に除去できるリードフレームを提供する
ことにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a lead frame that eliminates the above-mentioned drawbacks and allows easy removal of the gate resin after resin sealing.
本発明は、樹脂封止型半導体装置用リードフレームにお
いて、リードフレーム外枠の樹脂封止時にゲート部と接
する部分が切除されている。The present invention provides a resin-sealed lead frame for a semiconductor device, in which a portion of the lead frame outer frame that contacts a gate portion when resin-sealed is cut away.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の第１の実施例の平面図、第２図は第１
図のリードフレームを樹脂封止したときの平面図、第３
図は第２図のＡ−Ａ’線断面図である。FIG. 1 is a plan view of the first embodiment of the present invention, and FIG. 2 is a plan view of the first embodiment of the present invention.
Top view when the lead frame shown in the figure is sealed with resin, 3rd
The figure is a sectional view taken along the line AA' in FIG. 2.
第１の実施例は、第１図〜第３図に示すように、リード
フレーム外枠８のうち樹脂封止時にゲート部と接する部
分９が切除されている。このようにすると、樹脂封止後
にゲート部樹脂７がリードフレーム外枠８と密着するこ
とはないので、リードフレーム６とゲート部樹脂７の分
離を容易に行うことができる。In the first embodiment, as shown in FIGS. 1 to 3, a portion 9 of the lead frame outer frame 8 that contacts the gate portion during resin sealing is cut away. In this way, the gate portion resin 7 does not come into close contact with the lead frame outer frame 8 after resin sealing, so that the lead frame 6 and the gate portion resin 7 can be easily separated.
また、自動装置によりゲート部樹脂７の除去を自動的に
行う場合には、従来のリードフレームとは異なり、ゲー
ト部樹脂７の根元の部分をはさむことができるので、ゲ
ート部樹脂７の除去はより確実になされる。Furthermore, when the gate resin 7 is automatically removed using an automatic device, unlike conventional lead frames, the base portion of the gate resin 7 can be pinched; done more reliably.
第４図は本発明の第２の実施例のリードフレームを樹脂
封止したときの断面図である。FIG. 4 is a sectional view of a lead frame according to a second embodiment of the present invention sealed with resin.
第２の実施例は、第４図に示すように、第１の実施例と
同様にリードフレーム外枠８のうち樹脂封止時にゲート
部と接する部分が切除されているが、その断面は、第１
の実施例とは異なりななめになっている。In the second embodiment, as shown in FIG. 4, the portion of the lead frame outer frame 8 that comes into contact with the gate portion during resin sealing is cut out, as in the first embodiment, but its cross section is as follows. 1st
Unlike the example shown in FIG.
このようにすることにより、第１の実施例よりもさらに
ゲート部樹脂７の除去が容易になるという利点がある。By doing so, there is an advantage that the gate portion resin 7 can be removed more easily than in the first embodiment.
以上説明したように本発明によれば、リードフレーム外
枠部分のうち樹脂封止時にゲート部と接する部分を切除
することにより、樹脂封止後のゲート部樹脂の除去作業
において、リードフレームとゲート部樹脂との分離が容
易になり、作業性が向上するとともに、リードフレーム
外枠にゲート部樹脂の一部が残ることを防止し、リード
フレーム外枠の変形を防ぐ効果がある。As explained above, according to the present invention, by cutting out the portion of the outer frame portion of the lead frame that comes into contact with the gate portion during resin sealing, the lead frame and the gate can be removed in the work of removing the gate portion resin after resin sealing. The gate resin can be easily separated from the gate resin, improving workability, and also prevents a portion of the gate resin from remaining on the outer frame of the lead frame, thereby preventing deformation of the outer frame of the lead frame.
第１図は本発明の第１の実施例の平面図、第２図は第１
図のリードフレームを樹脂封止したときの平面図、第３
図は第２図のＡ−Ａ’線断面図、第４図は本発明の第２
の実施例のリードフレームを樹脂封止したときの断面図
、第５図は従来のリードフレームの平面図、第６図は第
５図のリードフレームを用いて樹脂封止する方法を説明
する断面図、第７図及び第８図は従来技術における問題
点を説明する要部断面図である。
１・・・半導体素子、２・・・素子搭載部、３・・・内
部リード、４・・・封止樹脂、５・・・樹脂封止金型、
６・・・リードフレーム、７・・・ゲート部樹脂、８・
・・リードフ−５＝
レーム外枠、
・・樹脂封止時にゲート部と接する
部分、
０・・・外枠リード。FIG. 1 is a plan view of the first embodiment of the present invention, and FIG. 2 is a plan view of the first embodiment of the present invention.
Top view when the lead frame shown in the figure is sealed with resin, 3rd
The figure is a sectional view taken along the line A-A' in Fig. 2, and Fig. 4 is a cross-sectional view taken along line A-A' of Fig.
5 is a plan view of a conventional lead frame, and FIG. 6 is a cross-sectional view illustrating a method of resin sealing using the lead frame of FIG. 5. 7 and 8 are sectional views of main parts for explaining problems in the prior art. DESCRIPTION OF SYMBOLS 1... Semiconductor element, 2... Element mounting part, 3... Internal lead, 4... Sealing resin, 5... Resin sealing mold,
6...Lead frame, 7...Gate portion resin, 8.
...Lead f-5 = frame outer frame, ...portion that comes into contact with the gate part during resin sealing, 0...outer frame lead.
Claims (1)
ドフレーム外枠の樹脂封止時にゲート部と接する部分が
切除されていることを特徴とする樹脂封止型半導体装置
用リードフレーム。A resin-sealed lead frame for a semiconductor device, characterized in that a portion of the lead frame outer frame that contacts a gate portion when resin-sealed is cut away.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP510490A JPH03209860A (en) | 1990-01-12 | 1990-01-12 | Lead frame for resin sealed type semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP510490A JPH03209860A (en) | 1990-01-12 | 1990-01-12 | Lead frame for resin sealed type semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03209860A true JPH03209860A (en) | 1991-09-12 |
Family
ID=11602059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP510490A Pending JPH03209860A (en) | 1990-01-12 | 1990-01-12 | Lead frame for resin sealed type semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03209860A (en) |
-
1990
- 1990-01-12 JP JP510490A patent/JPH03209860A/en active Pending
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