JP2710515B2 - Lead frame for resin-sealed semiconductor device - Google Patents
Lead frame for resin-sealed semiconductor deviceInfo
- Publication number
- JP2710515B2 JP2710515B2 JP4084312A JP8431292A JP2710515B2 JP 2710515 B2 JP2710515 B2 JP 2710515B2 JP 4084312 A JP4084312 A JP 4084312A JP 8431292 A JP8431292 A JP 8431292A JP 2710515 B2 JP2710515 B2 JP 2710515B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead frame
- semiconductor device
- view
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Description
【０００１】[0001]
【産業上の利用分野】本発明は、樹脂封止型半導体装置
に用いられるリードフレームに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame used for a resin-sealed semiconductor device.
【０００２】[0002]
【従来の技術】従来の樹脂封止型半導体装置用リードフ
レームは、図３（ａ），（ｂ）に示す様に、樹脂封止部
１の外側にあるリード３のある部分に樹脂流出防止用の
タイバー６が付加されて構成されていた。2. Description of the Related Art As shown in FIGS. 3 (a) and 3 (b), a conventional lead frame for a resin-encapsulated semiconductor device prevents resin from leaking to a portion of a lead 3 outside a resin-encapsulated portion 1. FIG. Tie bar 6 is additionally provided.
【０００３】[0003]
【発明が解決しようとする課題】この従来のリードフレ
ームでは、樹脂封止をすると樹脂の一部がタイバーの位
置まで流出してしまい、後工程の外部リード成形で外部
リード変形を引き起こすという問題があった。In this conventional lead frame, when the resin is sealed, a part of the resin flows out to the position of the tie bar, and the external lead is deformed in the external lead molding in a later process. there were.
【０００４】また、タイバーを切断すると切り残し部が
発生する為外部リード成形において、リード平坦度がう
まくでないという問題点があった。[0004] In addition, when the tie bar is cut, an uncut portion is generated, so that there is a problem that the lead flatness is not good in external lead molding.
【０００５】[0005]
【課題を解決するための手段】本発明のリードフレーム
は、樹脂封止部の外側に容易に除去可能な低融点金属も
しくは水溶性樹脂のタイバーをもつ構造になっている。The lead frame of the present invention has a structure in which a tie bar of a low melting point metal or a water-soluble resin that can be easily removed is provided outside the resin sealing portion.
【０００６】[0006]
【実施例】次に本発明について図面を参照して説明す
る。図１（ａ），（ｂ）は、本発明の一実施例の樹脂封
止型半導体装置用リードフレームの平面図及び断面図で
ある。図２（ａ），（ｂ）は、本発明の実施例２の平面
図及び断面図である。第１の実施例は、リードフレーム
４の樹脂封止部１の外側リード３の間隙に半田５をリー
ドフレーム板厚分付加した構造を有する。実施例２は、
リードフレーム４の樹脂封止部１の外側リード３の間隙
に水溶性樹脂７をリードフレーム板厚分付加した構造に
なっている。なお水溶性樹脂は、オレフィン系水溶性樹
脂（住友ベークライト社製）等、市販のものが利用でき
るので樹脂の詳細については説明を省略する。この実施
例２の効果としては、実施例１では半田除去工程で完全
に除去できない場合リード間が電気的にショートするの
に対し、水溶性樹脂は、絶縁性である為完全に除去でき
なくても良いという効果がある。又、除去する場合酸・
アルカリの代りに水でできる為安全性・経済性が確保で
きる。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. 1A and 1B are a plan view and a sectional view of a lead frame for a resin-encapsulated semiconductor device according to one embodiment of the present invention. 2A and 2B are a plan view and a sectional view of a second embodiment of the present invention. The first embodiment has a structure in which solder 5 is added to the gap between the outer leads 3 of the resin sealing portion 1 of the lead frame 4 by the thickness of the lead frame. Example 2
The structure is such that a water-soluble resin 7 is added to the gap between the outer leads 3 of the resin sealing portion 1 of the lead frame 4 by the thickness of the lead frame. As the water-soluble resin, a commercially available water-soluble resin such as an olefin-based water-soluble resin (manufactured by Sumitomo Bakelite Co., Ltd.) can be used. The effect of the second embodiment is that in the first embodiment, when the solder cannot be completely removed in the solder removing step, the leads are electrically short-circuited, whereas the water-soluble resin is insulative and cannot be completely removed. Is also good. When removing acid or
Since water can be used instead of alkali, safety and economy can be secured.
【０００７】[0007]
【発明の効果】以上説明した様に本発明は、樹脂封止部
外側リード付根部に容易に除去可能な低融点もしくは水
溶性樹脂のタイバーを付加した為、樹脂封止での樹脂流
出が無くなり外部リード成形でリード変形を防止するこ
とができる。As described above, according to the present invention, a resin tie bar of a low melting point or a water-soluble resin which can be easily removed is added to the root portion of the outer lead of the resin sealing portion. External lead molding can prevent lead deformation.
【０００８】又、付加したタイバーを、メッキ工程で除
去すればタイバー切断工程を無くすことができる。If the added tie bar is removed in the plating step, the tie bar cutting step can be eliminated.
【図１】本発明の一実施例の平面図と断面図である。FIG. 1 is a plan view and a sectional view of an embodiment of the present invention.
【図２】本発明の実施例２の平面図と断面図である。FIG. 2 is a plan view and a cross-sectional view of a second embodiment of the present invention.
【図３】従来例の平面図と断面図である。FIG. 3 is a plan view and a cross-sectional view of a conventional example.
１ 樹脂封止部 ３ リード ４ リードフレーム ５ 半田 ６ タイバー ７ 水溶性樹脂 DESCRIPTION OF SYMBOLS 1 Resin sealing part 3 Lead 4 Lead frame 5 Solder 6 Tie bar 7 Water-soluble resin
Claims (2)
る樹脂封止部と、この周囲に設けた複数のリードとから
成る樹脂封止型半導体用リードフレームにおいて、前記
リード間を繋いだタイバーを低融点金属（合金も含む）
で構成したことを特徴とする樹脂封止型半導体用リード
フレーム。1. A resin-encapsulated semiconductor lead frame comprising a resin-sealed portion on which a semiconductor chip is mounted and sealed with a resin, and a plurality of leads provided around the resin-sealed portion. Low melting point metal (including alloy )
Encapsulated semiconductor lead frame, characterized by being configured in.
樹脂封止型半導体用リードフレーム。Resin-sealed lead frame for semiconductors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4084312A JP2710515B2 (en) | 1992-04-07 | 1992-04-07 | Lead frame for resin-sealed semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4084312A JP2710515B2 (en) | 1992-04-07 | 1992-04-07 | Lead frame for resin-sealed semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05291463A JPH05291463A (en) | 1993-11-05 |
| JP2710515B2 true JP2710515B2 (en) | 1998-02-10 |
Family
ID=13826990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4084312A Expired - Fee Related JP2710515B2 (en) | 1992-04-07 | 1992-04-07 | Lead frame for resin-sealed semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2710515B2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01191459A (en) * | 1988-01-27 | 1989-08-01 | Hitachi Ltd | Manufacture of semiconductor device |
| JPH0438858A (en) * | 1990-06-05 | 1992-02-10 | Sony Corp | Manufacture of semiconductor device |
-
1992
- 1992-04-07 JP JP4084312A patent/JP2710515B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05291463A (en) | 1993-11-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19970916 |
|
| LAPS | Cancellation because of no payment of annual fees |