JP2603814B2 - Semiconductor device and manufacturing method thereof - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a semiconductor device and a method for manufacturing the same.

[0002]

2. Description of the Related Art FIGS. 6 to 12 show a conventional apparatus of this kind and a method of manufacturing the same. In the drawing, 1 is a lead frame, 2 and 3 are a pair of lead frames constituting the frame, 4 is a tie bar connecting the pair of lead frames 2 and 3, and 5 is a plurality of external ties connected to the tie bar 4. Lead 6 is the external lead 5
The base lead 7 connected to the semiconductor chip via a tie bar 4 is a package for sealing the semiconductor chip with a resin.

[0003] Reference numeral 8 denotes a flash between leads formed in the space between the tie bar 4, the root lead 6, and the package 7, and 9 denotes a deburring punch for removing the flash 8 between the leads. A clearance C is provided between the tie bar 4 and the package 7 and the base lead 6 with a clearance C provided between the tie bar 4 and the base lead 6. Numeral 10 is a flash residue on the package 7 side remaining after the deburring punch 9 is removed, and 11 is a flash residue on the root lead 6 side.

[0004] In the above configuration,
Processing is performed in the order of a molding (resin sealing) process → lead deburring process → surface deburring process → lead processing (tie bar cutting) process. During this step, after the resin sealing step, a lead gap 8 always occurs between the tie bar 4, the root lead 6, and the package 7. Therefore, the burrs 8 are removed by the burring punch 9 as shown in FIG.

The deburring punch 9 is shown in FIGS.
The clearance B is provided between the tie bar 4, the clearance C between the package 7 and the clearance D between the base lead 6, and the manufacturing tolerance of the lead frame 1 and the package at the time of resin sealing are provided. 7 compensates for the variation in the molding tolerances. Therefore, the deburring punch 9
When the inter-lead burrs 8 are removed, the remaining burrs 10 and 11 between the package 7 and the root lead 6 are removed.
Will occur.

[0006]

Since the conventional semiconductor device and the method for manufacturing the same have been described above, if a burr is formed between the tie bar, the root lead and the package, the burrs are removed in the deburring step. However, since the package is made of resin, it is possible to reduce the clearance between the package and the deburring punch. It is relatively easy to reduce the flash on the side of the package, but the base lead is made of metal. It is difficult to reduce the clearance between the picking punch and the root lead, and burrs are generated especially on the side of the root lead, and these burrs must be removed manually, increasing the number of work processes. However, there is a problem that productivity is significantly reduced.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and has as its object to provide a semiconductor device and a method of manufacturing the same, which can eliminate the step of removing burrs.

[0008]

According to a first aspect of the present invention, there is provided a semiconductor device having a tie bar which is cut after a semiconductor chip is sealed with a resin in a lead frame, wherein the lead frame is attached to the resin package outside the resin package. The tie bar is formed such that the distance between the outside of the resin package and the tie bar is 0.3 mm or less .

According to a second aspect of the present invention, when the resin is sealed,
The distance between the outside of the package and the tie bar is 0.3mm or less
To the lead frame on which the tie bar is formed.
Placing the conductive chip and sealing with resin;
A burr between the outside of the cage and the tie bar;
And the process of simultaneously removing with a tie bar cut punch
It becomes.

[0010]

[0011]

[0012]

In the semiconductor device constructed as in the first aspect , since the tie bar is close to the package at 0.3 mm or less , a conventional process for removing the lead is not required.
Ku, to reduce the rest of the lead between the beams after the tie bar Katsuhito
Can be

According to a second aspect of the present invention, there is provided a semiconductor device comprising:
The manufacturing method is just to cut the tie bar and the lead gap
Can be removed as little as possible.

[0014]

[0015]

[0016]

1 to 3 show an embodiment of the present invention.
Will be described. In the figure, reference numeral 20 denotes a large portion having an opening width F wider than the tie bar cut width E, formed only in a portion outside the package 7 and close to the package 7 and having a thickness G toward the tie bar 4 side. Is formed.

Reference numeral 21 denotes a small width portion formed to the position of the tie bar 4 following the large portion 20 and has an opening width H smaller than the cut width E of the tie bar 4. Please note that
An opening 22 is constituted by 20 and the narrow width portion 21. 23 is a step formed on the root lead 6 with a large portion 20 and a small width portion 21;
Is a protruding dimension J formed in the opening 22 and corresponding to the step 23.
This is the lead gap that produces the collar 25.

In the above configuration,
The lead spacing 24 is a tie bar 4 on the package 7 side.
Is larger than the cut width E of the tie bar 4 and smaller than the cut width E of the tie bar 4 on the tie bar 4 side. When the tie bar 4 is cut, the tie bar punch (not shown) is moved to the position of the large portion 20. Up to 20
And the tie bar 4 in the narrow width portion 21 and the tie bar 4 are punched at the same time, and the
24 is also reliably removed.

Also, by setting the clearance between the tie bar punch and the package 7 appropriately, the lead burrs 24 generated on the side surfaces of the package 7 can be reduced, and the lead burrs 24 can be removed at the same time in the tie bar cutting step. In particular, the thickness G of the large portion 20 is 0.3 mm, and the step portion 23
Good results could be obtained with a protrusion dimension J of 0.5 mm.

4 and 5 show another embodiment of the present invention. Reference numeral 30 denotes a tie bar provided close to the package 7, and 31 denotes a tie bar cut width E of the package 7.
An opening 32 having an opening width F wider than the opening width 32 is a lead gap formed in the opening 31.

In this configuration, as shown in FIG. 5, by punching out to the position of the opening 31 with a tie bar punch (not shown), the burrs 32 are removed at the same time as the tie bar cutting, and the same effect is obtained. become.

[0022]

As described above, according to the first aspect of the present invention, the lead
Cut after resin sealing semiconductor chip to frame
In the semiconductor device having the tie bars, the Ridofure
Arm is located on the outside of the resin package.
The tie bar to the outside of the resin package and the tie bar
With a distance of 0.3 mm or less.
Tie bars without the need for a deburring process
It is possible to reduce the remainder of the lead gap after cutting.
Resulting in excellent productivity, low cost, and excellent appearance
This has the effect of providing a semiconductor device.

Further, the inventions of claim 2, since the tie bar is close below 0.3mm in the package can be removed between the leads burr at only by tie bars Katsuhito, tie
Cutting and deburring can be performed simultaneously in one process,
Not only are manufacturing processes reduced and productivity increased,
It is possible to manufacture semiconductor devices with little residual and good appearance.
There is an excellent effect that can be done.

[0024]

[0025]

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of the present invention.

FIG. 2 is an enlarged plan view of a main part of the embodiment of FIG.

FIG. 3 is an enlarged plan view of a main part after a tie bar is cut in the embodiment of FIG. 1;

FIG. 4 is a plan view showing another embodiment of the present invention.

FIG. 5 is an enlarged plan view of a main part of the embodiment of FIG. 4;

FIG. 6 is a plan view showing a conventional lead frame.

FIG. 7 is a plan view of a conventional lead frame after molding.

FIG. 8 is an enlarged plan view of a main part of a conventional lead frame.

FIG. 9 is a sectional view of a main part of a conventional lead frame.

FIG. 10 is a fragmentary sectional view showing a conventional lead frame deburring step.

11 is a sectional view taken along line XI-XI in FIG.

FIG. 12 is an enlarged plan view of a main part after deburring a conventional lead frame.

[Explanation of symbols]

1 Lead frame, 4 Tie bar, 5 External lead, 6 Root lead, 7 Package,
22 openings, 24 lead spacing, 30 tie bars.

Claims (2)

(57) [Claims] 1. A semiconductor device having a tie bar which is cut after a semiconductor chip is sealed with a resin on a lead frame, wherein the lead frame has the tie bar attached to the resin package outside the resin package and the tie bar connected to the outside of the resin package. A semiconductor device formed to have a distance of 0.3 mm or less. 2. A step of mounting a semiconductor chip on a lead frame on which a tie bar is formed so that the distance between the outside of the resin package and the tie bar is 0.3 mm or less when the resin is sealed, and sealing with a resin. A method of manufacturing a semiconductor device, comprising: a step of simultaneously removing burrs between the outside of a resin package and a tie bar and the tie bar with a tie bar cut punch.