JPH0438858A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPH0438858A JPH0438858A JP14541390A JP14541390A JPH0438858A JP H0438858 A JPH0438858 A JP H0438858A JP 14541390 A JP14541390 A JP 14541390A JP 14541390 A JP14541390 A JP 14541390A JP H0438858 A JPH0438858 A JP H0438858A
- Authority
- JP
- Japan
- Prior art keywords
- water
- resin
- lead frame
- soluble
- soluble resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 13
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000011347 resin Substances 0.000 claims abstract description 59
- 229920005989 resin Polymers 0.000 claims abstract description 59
- 239000002195 soluble material Substances 0.000 claims abstract description 20
- 239000007788 liquid Substances 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 10
- 238000001035 drying Methods 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000003292 glue Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000002861 polymer material Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 229920002472 Starch Polymers 0.000 description 3
- 235000019698 starch Nutrition 0.000 description 3
- 239000008107 starch Substances 0.000 description 3
- 229920000084 Gum arabic Polymers 0.000 description 2
- 241000978776 Senegalia senegal Species 0.000 description 2
- 235000010489 acacia gum Nutrition 0.000 description 2
- 239000000205 acacia gum Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 229920005615 natural polymer Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920001059 synthetic polymer Polymers 0.000 description 1
- 229920003170 water-soluble synthetic polymer Polymers 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野］
本発明はリードフレームに封止用の樹脂が成形される半
導体装置の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a semiconductor device in which a resin for sealing is molded onto a lead frame.
（発明の概要〕
本発明は、リードフレームに封止用の樹脂が成形される
半導体装置の製造方法において、リードフレームのリー
ド間に液体可溶性材＃４部を形成し、樹脂成形後にその
液体可溶性材料部を所要の液体を用いて除去することに
より、モールド時の樹脂流出の抑えとされた部材を効率
良く除去するものである。(Summary of the Invention) The present invention provides a method for manufacturing a semiconductor device in which a resin for sealing is molded onto a lead frame, in which a liquid soluble material #4 is formed between the leads of the lead frame, and the liquid soluble material #4 is formed between the leads of the lead frame. By removing the material part using a required liquid, the member that is supposed to prevent resin from flowing out during molding can be efficiently removed.
通常、各種の半導体装置は、その千ノブがリードフレー
ムのグイパッド部にダイポンディングされ、そのグイパ
ッド部の周囲ムこ配されたリードにワイヤボンディング
される。そして、チップをリードフレームの一部を含め
て樹脂封止することで、その製品化がなされている。Generally, the knobs of various semiconductor devices are die-bonded to a lead pad portion of a lead frame, and wire-bonded to leads placed around the lead pad portion. The chip, including a part of the lead frame, is sealed with resin to be commercialized.
ところで、リードフレームのリードは、複数の細い導体
部からなり、そのリード間を結合する部分はタイバーと
呼ばれる。このタイバーは、樹脂成形時のパリ止め用に
も機能し、チップの樹脂封止後に取り除かれる。By the way, the leads of a lead frame are made up of a plurality of thin conductor parts, and the part that connects the leads is called a tie bar. This tie bar also functions as a stopper during resin molding, and is removed after the chip is sealed with resin.
〔発明が解決しようとする課′Ｉ５］
半導体装置の高性能化に従ってピンの数も増大しており
、その結果、リートの間の間隔も、例えばＱ Ｆ Ｐ
（ｑｕａｄ ｆｌａｔ ｐａｃｋａｇｅ ）で現在実用
化されている０、５■から今後０．３ ｍの間隔に切り
換えられて行くものと予想されている。[Problem to be solved by the invention 'I5] As the performance of semiconductor devices increases, the number of pins increases, and as a result, the spacing between REITs also increases, for example, Q F P
It is expected that the spacing of 0.3 m (quad flat package), which is currently in practical use, will be switched to a spacing of 0.3 m in the future.
しかしながら、０．３ ｍ程度の細い間隔の領域にタイ
バーを設けた場合では、そのタイバーの切断が困難とな
る。これに対して、タイバーを設けなければ、パリが発
生して封止用の樹脂が詰まることになり、その除去が難
しくなる。そして、この封止用の樹脂のパリを強引に取
り除く場合では、リード変形が発生する等の新たな問題
を抱えることになる。However, when tie bars are provided in areas with narrow intervals of about 0.3 m, it becomes difficult to cut the tie bars. On the other hand, if tie bars are not provided, pars will occur and the sealing resin will become clogged, making it difficult to remove them. If this sealing resin is forcibly removed, new problems such as lead deformation occur.
そこで、本発明は上述の技術的な課題に鑑み、成形時の
樹脂流出を防止する部材を効率良く除去するような半導
体装置の製造方法を提供することを目的とする。SUMMARY OF THE INVENTION In view of the above-mentioned technical problems, it is an object of the present invention to provide a method for manufacturing a semiconductor device that efficiently removes a member that prevents resin from flowing out during molding.
上述の目的を達成するため、本発明の半導体装置の製造
方法は、リードフレームのリード間に液体可溶性材料部
を形成し、上記リードフレームに樹脂成形した後、上記
液体可溶性材料部を所要の液体を用いて上記リードフレ
ームから除去することを特徴とする。In order to achieve the above object, the method for manufacturing a semiconductor device of the present invention includes forming a liquid soluble material portion between the leads of a lead frame, molding the lead frame with resin, and then injecting the liquid soluble material portion into a required liquid. It is characterized in that it is removed from the lead frame using.
ここで液体可溶性材料部の例としては、水溶性と耐熱性
を備えたデンプン、アラビアゴム、ニカワ等の天然高分
子材料或いは水溶性の合成高分子材料等が挙げられる。Here, examples of the liquid-soluble material include water-soluble and heat-resistant natural polymer materials such as starch, gum arabic, and glue, and water-soluble synthetic polymer materials.
また、この液体可溶性材料部は、水溶性のみに限定され
ず、アルコールや他の有機溶剤に可溶な材料であっても
良い。その液体可溶性材料部は、リード間に従来のタイ
バーの代わりに形成され、樹脂の外郭よりも外側のｋｌ
域の外部リードの間の部分に設けられる。この液体可溶
性材料部の形成方法は、スクリーン印刷工や刷毛塗り等
の各種手法を用いることができる。また、上記液体可溶
性材料部のリードフレームからの除去方法としては、所
要の水圧ハリ取り装置を用いることができる。Moreover, this liquid-soluble material portion is not limited to only water-soluble materials, but may also be materials that are soluble in alcohol or other organic solvents. The liquid-soluble material portion is formed between the leads in place of a conventional tie bar, and is located outside the resin shell.
Provided between the external leads of the area. The liquid-soluble material portion can be formed by various methods such as screen printing or brush coating. Further, as a method for removing the liquid-soluble material portion from the lead frame, a required hydraulic tension removing device can be used.
［作用］
液体可溶性材料部をリードフレームのリード間に形成す
ることにより、その液体可溶性材料部は従来のタイバー
の機能を果たし、樹脂成形時の樹脂流出を防止する。こ
のためパリの発生が抑えられる。この液体可溶性材料部
は樹脂成形後に所要の液体で処理することで、熔解し、
簡単に除去できる。従って、リード間の間隔が細くなっ
た場合でも、目詰まり等の問題は生しない。[Function] By forming the liquid soluble material portion between the leads of the lead frame, the liquid soluble material portion functions as a conventional tie bar and prevents resin from flowing out during resin molding. This suppresses the occurrence of paris. This liquid-soluble material part can be melted by treating it with the required liquid after resin molding.
Can be easily removed. Therefore, even if the distance between the leads becomes narrow, problems such as clogging do not occur.
〔実施例］ 本発明の好適な実施例を図面を参照しながら説明する。〔Example] Preferred embodiments of the present invention will be described with reference to the drawings.
本実施例は、デンプン等の水溶性レジンをタイバーの代
わりにリード間に塗布する半導体装置の製造方法である
。以下、本実施例をその製造工程に従って説明する。This embodiment is a method of manufacturing a semiconductor device in which a water-soluble resin such as starch is applied between the leads instead of the tie bars. This example will be described below according to its manufacturing process.
初めに、打抜きやエツチング等で所要のパターンに形成
されたリードフレームを用意する。このリードフレーム
は、パンケージの形状に合わせて種々のものが用いられ
る。First, a lead frame formed into a desired pattern by punching, etching, etc. is prepared. Various types of lead frames are used depending on the shape of the pan cage.
次に、このリードフレームは、第３１に示すように、ス
クリーン印￥１１機３１にセットされる。リードフレー
ム２は、その枠部の両側に設けられた孔からなるピン位
置部３にピン３２が挿通して位置決めされる。このよう
にピン３２によって位置決めされたリードフレーム２の
表面を、スクリーン３３が覆う、そして、そのスクリー
ン３３を介して水溶性レジンが塗布される。Next, this lead frame is set on a screen stamp 31 as shown in No. 31. The lead frame 2 is positioned by inserting pins 32 into pin position portions 3 which are holes provided on both sides of the frame portion. A screen 33 covers the surface of the lead frame 2 thus positioned by the pins 32, and a water-soluble resin is applied through the screen 33.
第１図は、その水溶性レジンの塗布パターンを示したも
のであり、図中数点で示す領域に水溶性レジンが塗布さ
れる。すなわち、先ず、第１圀に示すＱＦＰ型のリード
フレーム２は細い線条部材である複数のり一ド５が略方
形状のダイパッド部４の各辺に離間しながら対向し、そ
れらリーと５はダイパッド部４から略放射状に延在され
て図示しないリードフレーム２の枠部に連続するように
されている０図中、方形状の破線６は、樹脂成形される
領域の外郭を示しており、リードフレーム２中、ダイパ
ッド部４の全部とり一ド５のインチ−リード部が成形さ
れた樹脂内に含まれる。そして、その破１６の直ぐに外
側に、当該破線６を帯状に囲んで水溶性レジンの塗布パ
ターン７が存在する。この塗布パターン７は、上記スク
リーン３３でマスク材がない領域であり、リード５上に
もマスク材が存在するため、リード５の間の領域にのみ
水溶性レジンが塗布されることになる。第２図は、その
塗布される水溶性レジン１を示した図であり、リード５
の間に水溶性レジン１がタイバーの代わりに形成されて
いる様子を示す、水溶性レジン１は、例えばデンプン、
アラビアゴム、ニカワ等の天然高分子材料であるが、合
成高分子材料であっても良い、この水溶性レジン１に要
求される耐熱性としては、後の工程のボンディング時に
変形や劣化等が生じないものであれば十分である。FIG. 1 shows the application pattern of the water-soluble resin, and the water-soluble resin is applied to the areas indicated by several points in the figure. That is, first, in the QFP type lead frame 2 shown in the first section, a plurality of glues 5, which are thin linear members, face each side of a substantially rectangular die pad part 4 while being spaced apart from each other. A rectangular broken line 6 in FIG. 0, which extends substantially radially from the die pad portion 4 and continues to the frame portion of the lead frame 2 (not shown), indicates the outline of the area to be resin molded. In the lead frame 2, the entire die pad section 4 and the inch-lead section of the die 5 are contained in the molded resin. Immediately outside the broken line 6, there is a water-soluble resin coating pattern 7 surrounding the broken line 6 in a band shape. This coating pattern 7 is an area where there is no masking material on the screen 33, and since the masking material is also present on the leads 5, the water-soluble resin is applied only to the area between the leads 5. FIG. 2 is a diagram showing the water-soluble resin 1 to be applied, and the lead 5
The water-soluble resin 1 is formed between, for example, starch,
This water-soluble resin 1 is made of natural polymer materials such as gum arabic and glue, but may also be made of synthetic polymer materials.The heat resistance required for this water-soluble resin 1 is such that deformation and deterioration may occur during bonding in the subsequent process. It is enough if there is none.
このようにリードフレーム２に水溶性レジン１を塗布し
た後、その水溶性レジン１は乾燥処理により硬化する。After the water-soluble resin 1 is applied to the lead frame 2 in this manner, the water-soluble resin 1 is cured by a drying process.
そして、その硬化後、ダイボンディングとワイヤボンデ
ィングが行われる。この時、硬化した水溶性レジン１が
各リード５を固定するため、確実な各ボンディングが行
われることになる。After curing, die bonding and wire bonding are performed. At this time, since the hardened water-soluble resin 1 fixes each lead 5, each bonding is performed reliably.
ボンディングの後、樹脂成形が行われる。すなわち、水
溶性レジン１をリード５間に配したり一ドフレーム２を
所要の樹脂成形装置にセットし、その成形金型内に樹脂
を圧力して、第１回の破線６を外形とするモールディン
グが行われる。この時、前記水溶性レジン１がタイバー
として機能し、ダムバリの発生が防止される。After bonding, resin molding is performed. That is, the water-soluble resin 1 is placed between the leads 5, the frame 2 is set in a required resin molding device, and the resin is pressurized into the mold, so that the first broken line 6 is the outer shape. Molding is done. At this time, the water-soluble resin 1 functions as a tie bar to prevent the occurrence of dam burrs.
このような樹脂成形の後、所要の水圧ハリ取り装置を用
いてタイバーとして機能した水溶性レジンｌが除去され
る。第４図は、その水圧ハリ取り装置による水溶性レジ
ン１の除去を示しており、水圧パリ取り装置のノズル４
１から水４２が所要の圧力で噴出される。その水４２は
、リードフレーム２のリード５間で硬化していた水溶性
レジン１をその表面から溶解させ、該水溶性レジン１を
圧力によってリード５間から脱落させる。その結果、ジ
−１５０間隔が極めて細いものであっても、確実に水溶
性レジン１の除去が行われる。水４２は、通常の水温の
みならず多少加熱した温水等であっても良い、また、圧
力を付加しな（でも除去できる場合では、水溶性レジン
ｌが形成されたリードフレーム２を水中に置き、そのま
ま水中で揺動させて、水溶性レジンｌをリード５間から
脱落させても良い、また、水溶性レジン１が絶縁材料で
ある場合、完全に除去しなくとも、電気接続上の問題を
生しない範囲で残したままとすることも可能である。After such resin molding, the water-soluble resin l that functioned as a tie bar is removed using a required hydraulic tension removing device. FIG. 4 shows the removal of the water-soluble resin 1 by the hydraulic deburring device, and the nozzle 4 of the hydraulic deburring device
Water 42 is ejected from 1 at a required pressure. The water 42 dissolves the water-soluble resin 1 that has been hardened between the leads 5 of the lead frame 2 from its surface, and causes the water-soluble resin 1 to fall off from between the leads 5 due to pressure. As a result, the water-soluble resin 1 can be reliably removed even if the spacing between the grooves is extremely narrow. The water 42 may be not only normal water temperature but also slightly heated warm water, etc. Also, if the water 42 can be removed without applying pressure, the lead frame 2 on which the water-soluble resin 1 is formed is placed in water. , the water-soluble resin 1 may be shaken in water as it is to cause the water-soluble resin 1 to fall out from between the leads 5.Also, if the water-soluble resin 1 is an insulating material, problems with electrical connection may occur even if it is not completely removed. It is also possible to leave it as long as it does not occur.
このように本実施例の半導体装置の製造方法では、水溶
性レジン１をタイバーの代わりに用いることで、パリの
発生を防止すると共に、リード間の間隔が非常に微細な
ものとなっても、樹脂成形後にリードフレーム２から水
溶性レジンエが水圧によって確実に除去される。このた
め、多ピン構造のチップに適用して好適である。As described above, in the semiconductor device manufacturing method of this embodiment, by using the water-soluble resin 1 instead of the tie bar, it is possible to prevent the occurrence of paris, and even if the spacing between the leads is extremely small, After resin molding, the water-soluble resin is reliably removed from the lead frame 2 by water pressure. Therefore, it is suitable for application to a chip with a multi-pin structure.
〔発明の効果］
本発明の半導体装置の製造方法は、液体可溶性材料部が
リードフレームのり一ド間ζこ形成さね７、その液体可
溶性材料部によってハリの発生が防止される。この液体
可溶性材料部は、所要の液体によって容易に除去される
ため、リード間の間隔が極めて細くなった場合にも適用
でき、特に多ビン構造の半導体装置に適用して有益とさ
れる。[Effects of the Invention] In the semiconductor device manufacturing method of the present invention, the liquid soluble material portion forms the groove 7 between the lead frame glue and the lead frame, and the liquid soluble material portion prevents the occurrence of firmness. Since this liquid-soluble material portion is easily removed by the required liquid, it can be applied even when the distance between the leads is extremely narrow, and is particularly useful when applied to a semiconductor device with a multi-bin structure.
第１図は本発明の半導体装置の製造方法の一例における
水溶性レジンの塗布・ぐターンを示す平面図、第２図は
上記−例の水溶性レジンの形成された状態を示す斜視図
、第３［ｆｆｌ＋ま上記−例におけるスクリーン印刷の
様子を示す断面図、第４図は上記−例における水圧パリ
取りの様子を示す斜視図である。
ｌ・・・水溶性レジン
２・・・リードフレーム
４・・・グイバンド部
５・・・リード
７・・・塗布パターンFIG. 1 is a plan view showing the coating and patterning of water-soluble resin in an example of the method for manufacturing a semiconductor device of the present invention, FIG. FIG. 4 is a cross-sectional view showing the state of screen printing in the above-mentioned example, and FIG. 4 is a perspective view showing the state of hydraulic deburring in the above-mentioned example. l... Water-soluble resin 2... Lead frame 4... Gui band portion 5... Lead 7... Coating pattern
Claims (1)
し、上記リードフレームに樹脂成形した後、上記液体可
溶性材料部を所要の液体を用いて上記リードフレームか
ら除去することを特徴とする半導体装置の製造方法。Manufacturing a semiconductor device, characterized in that a liquid soluble material portion is formed between the leads of a lead frame, resin molded on the lead frame, and then the liquid soluble material portion is removed from the lead frame using a required liquid. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14541390A JPH0438858A (en) | 1990-06-05 | 1990-06-05 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14541390A JPH0438858A (en) | 1990-06-05 | 1990-06-05 | Manufacture of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0438858A true JPH0438858A (en) | 1992-02-10 |
Family
ID=15384685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14541390A Pending JPH0438858A (en) | 1990-06-05 | 1990-06-05 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0438858A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05291463A (en) * | 1992-04-07 | 1993-11-05 | Nec Kyushu Ltd | Lead frame for resin-sealed semiconductor device |
| JPH0846127A (en) * | 1994-07-29 | 1996-02-16 | Nec Corp | Production of semiconductor device |
| JP2009252778A (en) * | 2008-04-01 | 2009-10-29 | Sharp Corp | Manufacturing method of semiconductor package |
-
1990
- 1990-06-05 JP JP14541390A patent/JPH0438858A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05291463A (en) * | 1992-04-07 | 1993-11-05 | Nec Kyushu Ltd | Lead frame for resin-sealed semiconductor device |
| JPH0846127A (en) * | 1994-07-29 | 1996-02-16 | Nec Corp | Production of semiconductor device |
| JP2009252778A (en) * | 2008-04-01 | 2009-10-29 | Sharp Corp | Manufacturing method of semiconductor package |
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