JPH03248451A - Lead frame for semiconductor device - Google Patents
Lead frame for semiconductor deviceInfo
- Publication number
- JPH03248451A JPH03248451A JP4619290A JP4619290A JPH03248451A JP H03248451 A JPH03248451 A JP H03248451A JP 4619290 A JP4619290 A JP 4619290A JP 4619290 A JP4619290 A JP 4619290A JP H03248451 A JPH03248451 A JP H03248451A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead
- tie bar
- leads
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 34
- 229920005989 resin Polymers 0.000 claims abstract description 34
- 238000007789 sealing Methods 0.000 abstract description 8
- 238000005520 cutting process Methods 0.000 abstract description 7
- 238000005452 bending Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 2
- 238000000465 moulding Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置のリード付は組立に用いられるリー
ドフレーム、特に品質及び作業性の向上を図ったリード
フレームに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a lead frame used for assembling a semiconductor device with leads, and particularly to a lead frame with improved quality and workability.
第4図は従来のリードフレームを用いて組立てた樹脂封
止半導体装置の要部平面図である。第4図において、金
属薄板のエツチングまたはプレスで作られたリードフレ
ームにおける多数の外部リード1は、ダイバー4により
互いに連結されてリードフレーム形状を保持しており、
かつ、ダイバー4は、樹脂封止する際に、パッケージ樹
脂5が上下金型のすき間からダム樹脂6となって外部リ
ード1の外端の方にさらに流出するのを堰止める堰堤の
役目も果している。FIG. 4 is a plan view of essential parts of a resin-sealed semiconductor device assembled using a conventional lead frame. In FIG. 4, a large number of external leads 1 in a lead frame made by etching or pressing thin metal sheets are connected to each other by divers 4 to maintain the shape of the lead frame.
In addition, the diver 4 also serves as a dam to prevent the package resin 5 from flowing out further toward the outer end of the external lead 1 as a dam resin 6 through the gap between the upper and lower molds during resin sealing. There is.
上述した従来のリードフレームは、ダイバーはリードフ
レームの外部リードと同じ材質で形成されている。よっ
て、ダイバーは切断しなげればならず、ダイバー切断工
程が必要となる。また、樹脂封止において、樹脂封止金
型のゲートをリード上に持ってきた際に、リード側面に
樹脂パリが残り、半田付性を悪化させる。また、ダイバ
ー切断後にダム樹脂の残りが生じやすく、リード成形後
にリード曲りの原因となったり、またそのダム樹脂の残
りがリードに圧着されて半田付性を悪化させるという欠
点がある。In the conventional lead frame described above, the diver is made of the same material as the outer lead of the lead frame. Therefore, the diver must be cut, and a diver cutting process is required. Furthermore, in resin sealing, when the gate of the resin sealing mold is brought over the leads, resin particles remain on the side surfaces of the leads, which deteriorates solderability. Further, there is a disadvantage that residual dam resin tends to remain after diver cutting, causing lead bending after lead molding, and that residual dam resin is crimped onto the lead, impairing solderability.
上記課題に対し本発明のリードフレームは、複数本の外
部リードを互いに連結するダイバーを、前記外部リード
と別材質の溶解性又は弾力性のある樹脂で形成している
。In order to solve the above problem, in the lead frame of the present invention, a diver that connects a plurality of external leads to each other is made of a soluble or elastic resin different from the external leads.
〔実施例) 次に本発明について図面を参照して説明する。〔Example) Next, the present invention will be explained with reference to the drawings.
第1図は本発明の一実施例のリードフレームを用いて樹
脂封止を行なった状態における半導体装置の一部を示す
部分平面図である。第1図において、多数の外部リード
1はダイバー2で互いに連結されている。ダイバー2は
溶解性の絶縁性の樹脂で、リードの厚さと同じ厚さで、
パッケージ樹脂5とわずかのすき間をあけて、リード間
を連結している。このようなリードフレームでは樹脂封
止後にダイバー2を溶解処理することにより、ダイバー
が容易に除去でき、このため、金型の封入ゲートをリー
ド上に持ってくることによる樹脂パリの発生はなく、ダ
イバー切断が不要になるため、ダム樹脂の切断残りが防
止でき、半導体装置の品質を向上できる。FIG. 1 is a partial plan view showing a part of a semiconductor device in a resin-sealed state using a lead frame according to an embodiment of the present invention. In FIG. 1, a number of external leads 1 are connected to each other by divers 2. As shown in FIG. Diver 2 is a soluble insulating resin with the same thickness as the lead.
The leads are connected with a slight gap from the package resin 5. In such a lead frame, the diver 2 can be easily removed by melting the diver 2 after resin sealing, and therefore there is no occurrence of resin flakes caused by bringing the mold's encapsulation gate onto the lead. Since diver cutting is no longer necessary, it is possible to prevent dam resin from remaining uncut and improve the quality of semiconductor devices.
第2図は本発明の他の実施例のリードフレームを用いた
樹脂封止半導体装置の部分平面図である。第2図におい
ては、外部リード1を連結するダイバー3は、金属の外
部リード1とは別材質の弾力性がありかつ絶縁性の樹脂
で形成されている。そして、このようなリードフレーム
を用いてリード付は後樹脂封止をする際は、樹脂パッケ
ージ5の内部に、ダイバー3の一部が入り込むようにし
て樹脂封止できる。よって、第3図の部分斜視図に示す
ように、ダイバー3を切断せずにそのまま残してリード
1の折曲げ成形ができるため、ダム樹脂切断残りの問題
がひとりでに解消できるのに加えて、リード曲りの防止
もできる。FIG. 2 is a partial plan view of a resin-sealed semiconductor device using a lead frame according to another embodiment of the present invention. In FIG. 2, the diver 3 that connects the external lead 1 is made of a resilient and insulating resin that is different from the metal external lead 1. When such a lead frame is used to attach the leads and then perform resin sealing, resin sealing can be performed such that a part of the diver 3 enters inside the resin package 5. Therefore, as shown in the partial perspective view of Fig. 3, it is possible to bend and form the lead 1 while leaving the diver 3 intact without cutting it. It can also prevent bending.
以上説明したように本発明は、ダイバーを溶解性又は弾
力性があり、かつ絶縁性の樹脂で構成しているので、金
型の封入ゲートをリード上にもってきてもリード側面に
樹脂パリが発生することはなく、又、ダム樹脂除去及び
ダイバー切断が不要となるため、ダム樹脂の残りがなく
なり、樹脂屑のリードへの付着による半田付性の低下を
防止できる。又、ダム樹脂がなくなることにより、リー
ド曲りの発生も防止できる。特に弾力性の樹脂を使用し
た場合、ダイバーがリードを保持したまま成形されるた
め、リード曲りの発生が防止でき半田屑によるリード間
の短絡が低減できる効果がある。As explained above, in the present invention, the diver is made of a soluble or elastic resin and is insulating, so even if the mold's encapsulation gate is placed on the lead, resin particles will not appear on the side of the lead. This does not occur, and since dam resin removal and diver cutting are not necessary, there is no remaining dam resin, and it is possible to prevent deterioration of solderability due to resin debris adhering to the leads. Also, by eliminating the dam resin, lead bending can be prevented. Particularly when elastic resin is used, the diver is molded while holding the leads, which has the effect of preventing bending of the leads and reducing short circuits between the leads due to solder waste.
第1図は本発明の第1の実施例によるリードフレームを
用いた樹脂封止半導体装置のリード成形前の部分平面図
、第2図は本発明の第2の実施例を用いた半導体装置の
リード成形前の部分平面図、第3図は第2図の半導体装
置のリード成形後の部分斜視図、第4図は従来のリード
フレームによる樹脂封止半導体装置のリード成形前の部
分平面図である。
1・・・・・・外部リード、2,3.4・・・・・・ダ
イバー5・・・・・・パッケージ樹脂、6・・・・・・
ダム樹脂。FIG. 1 is a partial plan view of a resin-sealed semiconductor device using a lead frame according to a first embodiment of the present invention before lead molding, and FIG. 2 is a partial plan view of a semiconductor device using a second embodiment of the present invention. 3 is a partial perspective view of the semiconductor device shown in FIG. 2 after lead molding; FIG. 4 is a partial plan view of the resin-sealed semiconductor device using a conventional lead frame before lead molding; FIG. be. 1... External lead, 2, 3.4... Diver 5... Package resin, 6...
Dumb resin.
Claims (1)
するダイバーとを含む、樹脂封止半導体装置用のリード
フレームにおいて、前記ダイバーが樹脂により形成され
ていることを特徴とする半導体装置用リードフレーム。A lead frame for a resin-sealed semiconductor device that includes a plurality of external leads and a diver that connects the external leads to each other, wherein the diver is made of resin. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4619290A JPH03248451A (en) | 1990-02-26 | 1990-02-26 | Lead frame for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4619290A JPH03248451A (en) | 1990-02-26 | 1990-02-26 | Lead frame for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03248451A true JPH03248451A (en) | 1991-11-06 |
Family
ID=12740194
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4619290A Pending JPH03248451A (en) | 1990-02-26 | 1990-02-26 | Lead frame for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03248451A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05326819A (en) * | 1992-05-15 | 1993-12-10 | Nec Kyushu Ltd | Lead frame for semiconductor device |
US5989474A (en) * | 1994-07-29 | 1999-11-23 | Nec Corporation | Method for fabricating resin-sealed semiconductor device using leadframe provided with resin dam bar |
-
1990
- 1990-02-26 JP JP4619290A patent/JPH03248451A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05326819A (en) * | 1992-05-15 | 1993-12-10 | Nec Kyushu Ltd | Lead frame for semiconductor device |
US5989474A (en) * | 1994-07-29 | 1999-11-23 | Nec Corporation | Method for fabricating resin-sealed semiconductor device using leadframe provided with resin dam bar |
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