JPS6181154U - - Google Patents
Info
- Publication number
- JPS6181154U JPS6181154U JP16526384U JP16526384U JPS6181154U JP S6181154 U JPS6181154 U JP S6181154U JP 16526384 U JP16526384 U JP 16526384U JP 16526384 U JP16526384 U JP 16526384U JP S6181154 U JPS6181154 U JP S6181154U
- Authority
- JP
- Japan
- Prior art keywords
- connecting part
- lead
- lead frame
- protruding
- protruding reinforcing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 claims 3
- 238000005553 drilling Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は、本考案の第１実施例の要部を示す部
分拡大平面図である。第２図は、従来の半導体リ
ードフレームのほぼ１セクシヨンを示す平面図で
ある。第３図は、第２図の部分拡大図である。第
４図は、本考案の第２実施例の要部を示す部分拡
大平面図である。第５図は、本考案の第３実施例
の要部を示す部分拡大平面図である。第６図は、
本考案の第４実施例の要部を示す部分拡大平面図
である。
３４，６２……周辺リード、３６……その一端
部、３８ｂ，６５ｂ……セクシヨンバー、４０ｂ
，６４ｂ……タイバー、４２，６６……内部リー
ド、４４，６８……外部リード、４６ｂ，７０ｂ
……つなぎ部、４８ｂ，７２ｂ……突出補強部、
５０ｂ……つなぎ、５２ｂ……スリツト加工、５
４ｂ……つなぎ部側面、５６，７５……パツケー
ジ本体側壁面、７４ｂ……穴開け加工、７６ｂ…
…連結体、８０……突出樹脂板。
FIG. 1 is a partially enlarged plan view showing the main parts of a first embodiment of the present invention. FIG. 2 is a plan view showing approximately one section of a conventional semiconductor lead frame. FIG. 3 is a partially enlarged view of FIG. 2. FIG. 4 is a partially enlarged plan view showing the main parts of the second embodiment of the present invention. FIG. 5 is a partially enlarged plan view showing the main parts of the third embodiment of the present invention. Figure 6 shows
FIG. 6 is a partially enlarged plan view showing main parts of a fourth embodiment of the present invention. 34, 62... Peripheral lead, 36... One end thereof, 38b, 65b... Section bar, 40b
, 64b... Tie bar, 42, 66... Internal lead, 44, 68... External lead, 46b, 70b
... Connecting part, 48b, 72b ... Protruding reinforcement part,
50b...Connection, 52b...Slit processing, 5
4b...Side surface of joint part, 56, 75...Side wall surface of package body, 74b...Drilling process, 76b...
...Connection body, 80...Protruding resin plate.
Claims (1)
と、そのつなぎ部から突設し、つなぎ部を補強す
る突出補強部とからなるタイバーを備え、上記つ
なぎ部で樹脂の流出を阻止し、パツケージ本体側
壁面を形成することを特徴とする半導体リードフ
レーム。 (2) 前記突出補強部とリードとの間にスリツト
加工が存在することを特徴とする実用新案登録請
求の範囲第１項記載の半導体リードフレーム。 (3) 前記突出補強部とリードとの間に穴開け加
工が存在することを特徴とする実用新案登録請求
の範囲第１項記載の半導体リードフレーム。[Scope of Claim for Utility Model Registration] (1) A tie bar consisting of a connecting part connected to the lead with a small amount of connecting part, and a protruding reinforcing part protruding from the connecting part to reinforce the connecting part, A semiconductor lead frame characterized by preventing resin from flowing out and forming a side wall surface of a package body. (2) The semiconductor lead frame according to claim 1, wherein a slit is formed between the protruding reinforcing portion and the lead. (3) The semiconductor lead frame according to claim 1, wherein a hole is formed between the protruding reinforcing portion and the lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16526384U JPS6181154U (en) | 1984-10-31 | 1984-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16526384U JPS6181154U (en) | 1984-10-31 | 1984-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6181154U true JPS6181154U (en) | 1986-05-29 |
Family
ID=30723118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16526384U Pending JPS6181154U (en) | 1984-10-31 | 1984-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6181154U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0567005U (en) * | 1992-02-15 | 1993-09-03 | 日本電気株式会社 | Lead frame for semiconductor device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5354473A (en) * | 1976-10-27 | 1978-05-17 | Nec Corp | Lead frame for semiconductor |
| JPS5524451A (en) * | 1978-08-08 | 1980-02-21 | Nec Kyushu Ltd | Lead frame for semiconductor |
| JPS58219756A (en) * | 1982-06-15 | 1983-12-21 | Toshiba Corp | Lead frame for semiconductor device |
| JPS5936955A (en) * | 1982-08-25 | 1984-02-29 | Shinko Electric Ind Co Ltd | Lead frame |
-
1984
- 1984-10-31 JP JP16526384U patent/JPS6181154U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5354473A (en) * | 1976-10-27 | 1978-05-17 | Nec Corp | Lead frame for semiconductor |
| JPS5524451A (en) * | 1978-08-08 | 1980-02-21 | Nec Kyushu Ltd | Lead frame for semiconductor |
| JPS58219756A (en) * | 1982-06-15 | 1983-12-21 | Toshiba Corp | Lead frame for semiconductor device |
| JPS5936955A (en) * | 1982-08-25 | 1984-02-29 | Shinko Electric Ind Co Ltd | Lead frame |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0567005U (en) * | 1992-02-15 | 1993-09-03 | 日本電気株式会社 | Lead frame for semiconductor device |
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