JPH0233451U - - Google Patents
Info
- Publication number
- JPH0233451U JPH0233451U JP11135388U JP11135388U JPH0233451U JP H0233451 U JPH0233451 U JP H0233451U JP 11135388 U JP11135388 U JP 11135388U JP 11135388 U JP11135388 U JP 11135388U JP H0233451 U JPH0233451 U JP H0233451U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- resin
- tie bar
- sealed
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａは本考案のリードフレームの平面図、
ｂはコイニング部のリード断面図、ｃはタイバー
より外側の外部リードの断面図、第２図ａ，ｂは
本考案に係る別の実施例を示すリードフレームの
平面図と側面図、第３図は本考案に係るリードフ
レームを封入金型に載置した部分断面図、第４図
は従来のリードフレームの欠点を説明するための
リード断面図である。
１……リード、２……タイバー、３……コイニ
ング部、４……外枠、５……樹脂封止領域、６…
封入金型、７…樹脂薄バリ、８……アイランド。
Figure 1a is a plan view of the lead frame of the present invention;
b is a sectional view of the lead at the coining part, c is a sectional view of the external lead outside the tie bar, FIGS. 2a and b are a plan view and a side view of a lead frame showing another embodiment of the present invention, and FIG. 3 4 is a partial cross-sectional view of the lead frame according to the present invention placed in an encapsulation mold, and FIG. 4 is a lead cross-sectional view for explaining the drawbacks of the conventional lead frame. DESCRIPTION OF SYMBOLS 1...Lead, 2...Tie bar, 3...Coining part, 4...Outer frame, 5...Resin sealing area, 6...
Encapsulating mold, 7...Resin thin burr, 8...Island.
Claims (1)
側に位置するタイバー部の一部または全部を含む
リード部分までが少なくともタイバー部より外側
のリード部の板厚より薄く且つ平坦に形成されて
いることを特徴とする樹脂封止型半導体装置用リ
ードフレーム。 The portion from the internal lead to be resin-sealed to the lead portion including part or all of the tie bar portion located outside the resin sealing portion is formed to be at least thinner and flat than the plate thickness of the lead portion outside the tie bar portion. A lead frame for resin-sealed semiconductor devices characterized by the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11135388U JPH0233451U (en) | 1988-08-24 | 1988-08-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11135388U JPH0233451U (en) | 1988-08-24 | 1988-08-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0233451U true JPH0233451U (en) | 1990-03-02 |
Family
ID=31349321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11135388U Pending JPH0233451U (en) | 1988-08-24 | 1988-08-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0233451U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0547975A (en) * | 1990-09-25 | 1993-02-26 | Sanyo Electric Co Ltd | Lead frame and surface package-type semiconductor device |
| JP2010056372A (en) * | 2008-08-29 | 2010-03-11 | Sanyo Electric Co Ltd | Resin sealed semiconductor device, and method of manufacturing the same |
-
1988
- 1988-08-24 JP JP11135388U patent/JPH0233451U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0547975A (en) * | 1990-09-25 | 1993-02-26 | Sanyo Electric Co Ltd | Lead frame and surface package-type semiconductor device |
| JP2010056372A (en) * | 2008-08-29 | 2010-03-11 | Sanyo Electric Co Ltd | Resin sealed semiconductor device, and method of manufacturing the same |