JPH0252448U - - Google Patents
Info
- Publication number
- JPH0252448U JPH0252448U JP13290388U JP13290388U JPH0252448U JP H0252448 U JPH0252448 U JP H0252448U JP 13290388 U JP13290388 U JP 13290388U JP 13290388 U JP13290388 U JP 13290388U JP H0252448 U JPH0252448 U JP H0252448U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- sealed
- lead frame
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 239000013013 elastic material Substances 0.000 claims 1
- 239000008188 pellet Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の第１の実施例の半導体装置の
断面図、第２図は本考案の第２の実施例の半導体
装置の断面図、第３図は従来の半導体装置の断面
図である。
１……耐熱性ゴム、２……封止樹脂、３……リ
ードフレーム、４……ペレツト、５……ボンデイ
ングワイヤ、６……アイランド。
FIG. 1 is a cross-sectional view of a semiconductor device according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view of a semiconductor device according to a second embodiment of the present invention, and FIG. 3 is a cross-sectional view of a conventional semiconductor device. be. DESCRIPTION OF SYMBOLS 1... Heat resistant rubber, 2... Sealing resin, 3... Lead frame, 4... Pellet, 5... Bonding wire, 6... Island.
Claims (1)
少なくとも該封止樹脂からリードフレームが伸延
されている部分周辺が高弾性材料で形成されてい
ることを特徴とする半導体装置。 1. A resin-sealed semiconductor device, wherein at least a portion of the resin-sealed portion around which a lead frame extends from the sealing resin is formed of a highly elastic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13290388U JPH0252448U (en) | 1988-10-11 | 1988-10-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13290388U JPH0252448U (en) | 1988-10-11 | 1988-10-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0252448U true JPH0252448U (en) | 1990-04-16 |
Family
ID=31390292
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13290388U Pending JPH0252448U (en) | 1988-10-11 | 1988-10-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0252448U (en) |
-
1988
- 1988-10-11 JP JP13290388U patent/JPH0252448U/ja active Pending