JPH0215738U - - Google Patents
Info
- Publication number
- JPH0215738U JPH0215738U JP9448588U JP9448588U JPH0215738U JP H0215738 U JPH0215738 U JP H0215738U JP 9448588 U JP9448588 U JP 9448588U JP 9448588 U JP9448588 U JP 9448588U JP H0215738 U JPH0215738 U JP H0215738U
- Authority
- JP
- Japan
- Prior art keywords
- header
- lead
- resin
- semiconductor pellet
- periphery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000008188 pellet Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案に依る樹脂モールド型半導体装
置を説明する断面図、第２図は第１図の要部拡大
断面図、第３図は従来の樹脂モールド型半導体装
置を説明する断面図である。
１はヘツダー、２はリード、３は半導体ペレツ
ト、４はボンデイングワイヤー、５はモールド樹
脂層である。
FIG. 1 is a sectional view illustrating a resin molded semiconductor device according to the present invention, FIG. 2 is an enlarged sectional view of the main part of FIG. 1, and FIG. 3 is a sectional view illustrating a conventional resin molded semiconductor device. be. 1 is a header, 2 is a lead, 3 is a semiconductor pellet, 4 is a bonding wire, and 5 is a molding resin layer.
Claims (1)
ムの前記ヘツダーに半導体ペレツトを固着し前記
半導体ペレツトの電極と前記リードとをボンデイ
ングワイヤーで接続し前記ヘツダーおよびリード
の一端をモールド樹脂で被覆する樹脂モールド型
半導体装置において、前記ヘツダーの前記半導体
ペレツトを固着した反対主面の周辺を肉厚とし中
央を肉薄に形成することを特徴とする樹脂モール
ド型半導体装置。 (2) 前記ヘツダーの中央の厚さを周辺の厚さよ
り１／２〜１／３に形成することを特徴とする請
求項１記載の樹脂モールド型半導体装置。[Claims for Utility Model Registration] (1) A semiconductor pellet is fixed to the header of a lead frame having a header and a lead, and an electrode of the semiconductor pellet and the lead are connected with a bonding wire, and one end of the header and the lead is connected. 1. A resin-molded semiconductor device covered with a molding resin, wherein the main surface of the header opposite to which the semiconductor pellet is fixed has a thick wall around the periphery and a thin wall at the center. (2) The resin molded semiconductor device according to claim 1, wherein the thickness of the center of the header is 1/2 to 1/3 of the thickness of the periphery.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9448588U JPH0215738U (en) | 1988-07-15 | 1988-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9448588U JPH0215738U (en) | 1988-07-15 | 1988-07-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0215738U true JPH0215738U (en) | 1990-01-31 |
Family
ID=31319015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9448588U Pending JPH0215738U (en) | 1988-07-15 | 1988-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0215738U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017154072A1 (en) * | 2016-03-07 | 2017-09-14 | 三菱電機株式会社 | Semiconductor device and method for manufacturing semiconductor device |
-
1988
- 1988-07-15 JP JP9448588U patent/JPH0215738U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017154072A1 (en) * | 2016-03-07 | 2017-09-14 | 三菱電機株式会社 | Semiconductor device and method for manufacturing semiconductor device |
| JPWO2017154072A1 (en) * | 2016-03-07 | 2018-05-10 | 三菱電機株式会社 | Semiconductor device and manufacturing method of semiconductor device |
| US11152275B2 (en) | 2016-03-07 | 2021-10-19 | Mitsubishi Electric Corporation | Semiconductor device and method for manufacturing semiconductor device |