JPS6337212U - - Google Patents
Info
- Publication number
- JPS6337212U JPS6337212U JP12976786U JP12976786U JPS6337212U JP S6337212 U JPS6337212 U JP S6337212U JP 12976786 U JP12976786 U JP 12976786U JP 12976786 U JP12976786 U JP 12976786U JP S6337212 U JPS6337212 U JP S6337212U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- encapsulation
- resin
- resin leakage
- tie bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005538 encapsulation Methods 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 230000002265 prevention Effects 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
第１図は、本考案の一実施例の平面図、第２図
は第１図のＡ矢視側面図、第３図は、本考案の他
の実施例の平面図、第４図は第３図のＢ矢視側面
図、第５図は、従来の封入金型の平面図、第６図
は、第５図のＣ矢視側面図である。
１……リードフレーム、２……封入樹脂、３…
…つぶしブロツク（３ａ…上型；３ｂ…下型）、
４……タイバーエンド部（４ａ…つぶし前；４ｂ
…つぶし後）、５……樹脂溜め溝、６……金型（
６ａ…上金型；６ｂ…下金型）、７……リード部
。
FIG. 1 is a plan view of one embodiment of the present invention, FIG. 2 is a side view taken in the direction of arrow A in FIG. 1, FIG. 3 is a plan view of another embodiment of the present invention, and FIG. 3 is a side view taken from arrow B in FIG. 3, FIG. 5 is a plan view of a conventional encapsulation mold, and FIG. 6 is a side view taken from arrow C shown in FIG. 1...Lead frame, 2...Encapsulation resin, 3...
...Crushing block (3a...upper mold; 3b...lower mold),
4...Tie bar end part (4a...before crushing; 4b
...after crushing), 5...resin reservoir groove, 6...mold (
6a...upper mold; 6b...lower mold), 7...lead part.
Claims (1)
る封入金型において、タイバー部分つぶしブロツ
クを、上型，下型に有することを特徴とする樹脂
漏れ防止機構付封入金型。 (2) 前記タイバー部分つぶしブロツクに、樹脂
漏れ溜め溝を有することを特徴とする実用新案登
録請求第(1)項記載の樹脂漏れ防止機構付封入金
型。[Scope of Claim for Utility Model Registration] (1) An encapsulation with a resin leakage prevention mechanism characterized in that an encapsulation mold used in an encapsulation process for resin-sealing a semiconductor element has tie bar crushing blocks on the upper and lower dies. Mold. (2) The encapsulating mold with a resin leakage prevention mechanism according to claim 1, wherein the tie bar crushing block has a resin leakage groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12976786U JPH0446899Y2 (en) | 1986-08-25 | 1986-08-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12976786U JPH0446899Y2 (en) | 1986-08-25 | 1986-08-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6337212U true JPS6337212U (en) | 1988-03-10 |
| JPH0446899Y2 JPH0446899Y2 (en) | 1992-11-05 |
Family
ID=31026637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12976786U Expired JPH0446899Y2 (en) | 1986-08-25 | 1986-08-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0446899Y2 (en) |
-
1986
- 1986-08-25 JP JP12976786U patent/JPH0446899Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0446899Y2 (en) | 1992-11-05 |