JPH0256457U - - Google Patents
Info
- Publication number
- JPH0256457U JPH0256457U JP13462788U JP13462788U JPH0256457U JP H0256457 U JPH0256457 U JP H0256457U JP 13462788 U JP13462788 U JP 13462788U JP 13462788 U JP13462788 U JP 13462788U JP H0256457 U JPH0256457 U JP H0256457U
- Authority
- JP
- Japan
- Prior art keywords
- mounting surface
- resin
- semiconductor chip
- leads
- press
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Description
第１図は本考案の一実施例の部分的な拡大斜視
図、第２図及び第３図は本考案を適用し得る半導
体装置の夫々平面図及び側断面図、第４図は本考
案の一従来例の部分的な拡大斜視図であつて第１
図に対応する図面である。
なお図面に用いた符号において、１１……リー
ドフレーム、１２……半導体チツプ、１３……樹
脂、１４……搭載部、１４ａ……搭載面、１５…
…リード、１５ａ……端部、１６……タイバー、
２３……バリ、である。
FIG. 1 is a partially enlarged perspective view of an embodiment of the present invention, FIGS. 2 and 3 are a plan view and a side sectional view, respectively, of a semiconductor device to which the present invention can be applied, and FIG. 4 is a partially enlarged perspective view of an embodiment of the present invention. 1 is a partially enlarged perspective view of a conventional example;
FIG. In addition, in the symbols used in the drawings, 11...lead frame, 12...semiconductor chip, 13...resin, 14...mounting part, 14a...mounting surface, 15...
...Lead, 15a... End, 16... Tie bar,
23...Bali.
Claims (1)
半導体チツプと電気的に接続されるべき端部を有
するリードと、このリード同士を接続するタイバ
ーとを有する様にプレス加工によつて形成されて
おり、樹脂封止が行われるリードフレームにおい
て、 少なくとも前記端部は前記搭載面側にバリが出
る様にプレス加工され、 少なくとも前記樹脂封止が行われる部分とその
外側との境界から前記タイバーまでの部分は前記
搭載面とは反対側にバリが出る様にプレス加工さ
れたリードフレーム。[Claims for Utility Model Registration] A press having a mounting part having a mounting surface for a semiconductor chip, leads having ends to be electrically connected to the semiconductor chip, and tie bars connecting the leads to each other. In a lead frame formed by processing and resin-sealed, at least the end portion is press-processed so that a burr appears on the mounting surface side, and at least the resin-sealed portion and the outside thereof are The part from the boundary to the tie bar is pressed so that a burr appears on the side opposite to the mounting surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13462788U JPH0256457U (en) | 1988-10-15 | 1988-10-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13462788U JPH0256457U (en) | 1988-10-15 | 1988-10-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0256457U true JPH0256457U (en) | 1990-04-24 |
Family
ID=31393558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13462788U Pending JPH0256457U (en) | 1988-10-15 | 1988-10-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0256457U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63308358A (en) * | 1987-06-10 | 1988-12-15 | Mitsui Haitetsuku:Kk | Lead frame |
-
1988
- 1988-10-15 JP JP13462788U patent/JPH0256457U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63308358A (en) * | 1987-06-10 | 1988-12-15 | Mitsui Haitetsuku:Kk | Lead frame |
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