JPS5954953U

JPS5954953U - lead frame

Info

Publication number: JPS5954953U
Application number: JP14941982U
Authority: JP
Inventors: 寛山田
Original assignee: 日本電気ホームエレクトロニクス株式会社
Priority date: 1982-09-30
Filing date: 1982-09-30
Publication date: 1984-04-10

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図及び第２図は樹脂封止型半導体装置の一例を示す
正面図及び側面図、第３図は従来のリードフレームの部
分平面図、第４図は第３図のり−ドフレームを使った樹
脂モールド成形用金型の断面図、第５図は樹脂モールド
成形後のリードフレームの部分拡大平面図、第６図は本
考案の一実施例を示す部分平面図、第７図及び第８図は
第６図のリードフレームの樹脂モールド成形後及びタイ
バー切断後の部分拡大平面図、第９図及び第１０図は本
考案の他の各実施例を説明するためのリードフレームの
部分平面図である。１・・・外装樹脂材、２・・・リード、５・・・ストッ
パ一部、７．７ｅ、？ｆ、７ｇ・−・タイバー、１２−
・・リードフレーム。1 and 2 are a front view and a side view showing an example of a resin-sealed semiconductor device, FIG. 3 is a partial plan view of a conventional lead frame, and FIG. 4 is a partial plan view of a conventional lead frame. FIG. 5 is a partially enlarged plan view of the lead frame after resin molding; FIG. 6 is a partial plan view showing an embodiment of the present invention; FIGS. The figure is a partially enlarged plan view of the lead frame shown in FIG. 6 after resin molding and after cutting the tie bars, and FIGS. 9 and 10 are partial plan views of the lead frame for explaining other embodiments of the present invention. It is. 1...Exterior resin material, 2...Lead, 5...Part of stopper, 7.7e,? f, 7g --- tie bar, 12-
··Lead frame.

Claims

[Scope of utility model registration request]

In a lead frame of a resin-sealed semiconductor device in which a plurality of leads each having a wide stopper portion formed in an intermediate portion thereof are connected by a tie bar, the tie bar includes at least a portion of each lead where the stopper portion is to be formed. A lead frame characterized by being provided at a certain part.