JPS5885357U - Lead frame for semiconductor devices - Google Patents

Lead frame for semiconductor devices

Info

Publication number
JPS5885357U
JPS5885357U JP18074781U JP18074781U JPS5885357U JP S5885357 U JPS5885357 U JP S5885357U JP 18074781 U JP18074781 U JP 18074781U JP 18074781 U JP18074781 U JP 18074781U JP S5885357 U JPS5885357 U JP S5885357U
Authority
JP
Japan
Prior art keywords
lead frame
semiconductor devices
piece
substrate
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18074781U
Other languages
Japanese (ja)
Inventor
田代　嘉宣
箕輪　文雄
Original Assignee
日本インタ−ナシヨナル整流器株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本インタ−ナシヨナル整流器株式会社 filed Critical 日本インタ−ナシヨナル整流器株式会社
Priority to JP18074781U priority Critical patent/JPS5885357U/en
Publication of JPS5885357U publication Critical patent/JPS5885357U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、従来の半導体装置用リードフレーム　−及び
樹脂成形用型を示す部分断面図、第２図は、本考案に係
る半導体装置用リードフレーム及び樹脂成形用型を示す
部分断面図である。 １１・・・・・・リードフレーム、１２・・・・・・長
尺片、１３・・・・・・短尺片、１４・・・・・・基板
、１５・・・・・・小タイバ、１６・・・・・・発光ペ
レット、１７・・・・・・金属細線、１８・・・・・・
凹部、１９・・・・・・樹脂成形用型。FIG. 1 is a partial sectional view showing a conventional lead frame for a semiconductor device and a mold for resin molding, and FIG. 2 is a partial sectional view showing a lead frame for a semiconductor device and a mold for resin molding according to the present invention. . 11...Lead frame, 12...Long piece, 13...Short piece, 14...Substrate, 15...Small tie bar, 16... Luminescent pellet, 17... Thin metal wire, 18...
Recessed portion, 19...Mold for resin molding.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板１４から直角方向に突出させた長尺片１２及び短尺
片１３とを有し、これら長尺片１２及び短尺片１３とを
１組として前記基板１４の長手方向に多数組形成するも
のにおいて、それら隣接する線間をタイバによって連結
しないことを特徴とする半導体素子用リードフレーム。A long piece 12 and a short piece 13 protruding from the substrate 14 in a right angle direction, and a large number of sets of the long piece 12 and the short piece 13 are formed in the longitudinal direction of the substrate 14, A lead frame for a semiconductor device characterized in that adjacent lines are not connected by tie bars.
JP18074781U 1981-12-04 1981-12-04 Lead frame for semiconductor devices Pending JPS5885357U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18074781U JPS5885357U (en) 1981-12-04 1981-12-04 Lead frame for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18074781U JPS5885357U (en) 1981-12-04 1981-12-04 Lead frame for semiconductor devices

Publications (1)

Publication Number Publication Date
JPS5885357U true JPS5885357U (en) 1983-06-09

Family

ID=29977611

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18074781U Pending JPS5885357U (en) 1981-12-04 1981-12-04 Lead frame for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5885357U (en)

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